Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Micron Technology Inc. |
IC FLASH NOR 16MX4 VFQFPN
|
pacchetto: - |
Azione5.232 |
|
FLASH | FLASH - NOR | 32Mb (8M x 4) | SPI | 108MHz | 8ms, 5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | - | - | - |
||
AKM Semiconductor Inc. |
IC EEPROM 2KBIT 8TSSOP
|
pacchetto: - |
Azione6.896 |
|
EEPROM | EEPROM | 2Kb (128 x 16) | SPI | - | - | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | - | 8-TSSOP |
||
Adesto Technologies |
IC FLASH 4MBIT 70MHZ 8UDFN
|
pacchetto: 8-UDFN Exposed Pad |
Azione5.856 |
|
FLASH | FLASH | 4Mb (512K x 8) | SPI | 70MHz | 7µs, 5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-UDFN Exposed Pad | 8-UDFN (5x6) |
||
Micron Technology Inc. |
IC RLDRAM 576MBIT 400MHZ 144UBGA
|
pacchetto: 144-TFBGA |
Azione14.832 |
|
DRAM | DRAM | 576Mb (16M x 36) | Parallel | 400MHz | - | 20ns | 1.7 V ~ 1.9 V | 0°C ~ 95°C (TC) | Surface Mount | 144-TFBGA | 144-µBGA (18.5x11) |
||
STMicroelectronics |
IC FLASH 2MBIT 90NS 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione26.292 |
|
FLASH | FLASH - NOR | 2Mb (256K x 8, 128K x 16) | Parallel | - | 90ns | 90ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Micron Technology Inc. |
IC FLASH 8MBIT 90NS 44SOP
|
pacchetto: 44-SOIC (0.496", 12.60mm Width) |
Azione6.192 |
|
FLASH | FLASH - NOR | 8Mb (1M x 8, 512K x 16) | Parallel | - | 90ns | 90ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 44-SOIC (0.496", 12.60mm Width) | 44-SOP |
||
Maxim Integrated |
IC EEPROM 256BIT 1WIRE 4FCBGA
|
pacchetto: 4-UFBGA, FCBGA |
Azione3.648 |
|
EEPROM | EEPROM | 256b (32 x 8) | 1-Wire? | - | - | 15µs | - | -40°C ~ 85°C (TA) | Surface Mount | 4-UFBGA, FCBGA | 4-FlipChip (2.39x1.73) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 256KBIT 12NS 100TQFP
|
pacchetto: 100-LQFP |
Azione6.240 |
|
SRAM | SRAM - Dual Port, Synchronous | 256Kb (32K x 8) | Parallel | - | - | 12ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
SII Semiconductor Corporation |
IC EEPROM 128KBIT 5MHZ 8SOP
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.776 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 5MHz | 5ms | - | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Microchip Technology |
IC EEPROM 8KBIT 3MHZ 8TDFN
|
pacchetto: 8-WFDFN Exposed Pad |
Azione5.600 |
|
EEPROM | EEPROM | 8Kb (1K x 8, 512 x 16) | SPI | 3MHz | 2ms | - | 4.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
IC EEPROM 1KBIT 400KHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione51.396 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I2C | 400kHz | 10ms | 900ns | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Toshiba Semiconductor and Storage |
IC EEPROM 4GBIT 25NS 63FBGA
|
pacchetto: 63-VFBGA |
Azione4.480 |
|
EEPROM | EEPROM - NAND | 4Gb (512M x 8) | Parallel | - | 25ns | 25ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 63-VFBGA | 63-TFBGA (9x11) |
||
Micron Technology Inc. |
IC FLASH 1G SPI 166MHZ TBGA
|
pacchetto: 24-LBGA |
Azione6.736 |
|
FLASH | FLASH - NOR | 1Gb (128M x 8) | SPI | 166MHz | 8ms, 2.8ms | - | 1.7 V ~ 2 V | -40°C ~ 85°C (TA) | Surface Mount | 24-LBGA | 24-T-PBGA (6x8) |
||
Renesas Electronics America |
IC SRAM IBIS ASYNC
|
pacchetto: 44-TSOP (0.400", 10.16mm Width) |
Azione6.752 |
|
SRAM | SRAM | 4Mb (256K x 16) | Parallel | - | 12ns | 12ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
ISSI, Integrated Silicon Solution Inc |
IC SRAM 18M PARALLEL 165TFBGA
|
pacchetto: 165-TBGA |
Azione5.296 |
|
SRAM | SRAM - Synchronous | 18Mb (512K x 36) | Parallel | 117MHz | - | 7.5ns | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 165-TBGA | 165-TFBGA (13x15) |
||
ISSI, Integrated Silicon Solution Inc |
IC SRAM 18M PARALLEL 165PBGA
|
pacchetto: 165-TBGA |
Azione5.792 |
|
SRAM | SRAM - Quad Port, Synchronous | 18Mb (1M x 18) | Parallel | 200MHz | - | 3.1ns | 2.375 V ~ 2.625 V | 0°C ~ 70°C (TA) | Surface Mount | 165-TBGA | 165-PBGA (13x15) |
||
Micron Technology Inc. |
MASSFLASH/CONTROLLER 1T
|
pacchetto: - |
Azione2.096 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC FLASH SLC 1GBIT 1GX1
|
pacchetto: - |
Azione2.480 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC SDRAM DDR2 512M 84FBGA
|
pacchetto: 84-TFBGA |
Azione5.328 |
|
DRAM | SDRAM - DDR2 | 512M (32M x 16) | Parallel | 400MHz | 15ns | 400ps | 1.7V ~ 1.9V | -40°C ~ 85°C (TA) | Surface Mount | 84-TFBGA | 84-FBGA (8x12.5) |
||
Renesas Electronics Corporation |
STANDARD SRAM, 512KX8
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Rochester Electronics, LLC |
MD2114A-5
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Silicon Motion, Inc. |
IC FLASH 40GBIT EMMC 153BGA
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NAND (SLC) | 40Gbit | eMMC | - | - | - | - | -40°C ~ 85°C | Surface Mount | 153-TFBGA | 153-BGA (11.5x13) |
||
Winbond Electronics |
IC FLASH 1GBIT SPI/QUAD 16SOIC
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 1Gbit | SPI - Quad I/O | 133 MHz | 3.5ms | 7.5 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Flexxon Pte Ltd |
IC FLASH 1TBIT EMMC 5.1 153FBGA
|
pacchetto: - |
Azione300 |
|
FLASH | FLASH - NAND (TLC) | 1Tbit | eMMC_5.1 | 200 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 85°C | Surface Mount | 153-VFBGA | 153-FBGA (11.5x13) |
||
Silicon Motion, Inc. |
IC FLASH 256GBIT UFS3.1 153BGA
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NAND (TLC) | 256Gbit | UFS3.1 | - | - | - | - | -40°C ~ 105°C | Surface Mount | 153-TFBGA | 153-BGA (11.5x13) |
||
Winbond Electronics |
IC DRAM 1GBIT SSTL 15 78VFBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - DDR3 | 1Gbit | SSTL_15 | 667 MHz | 15ns | 20 ns | 1.425V ~ 1.575V | 0°C ~ 95°C (TC) | Surface Mount | 78-VFBGA | 78-VFBGA (8x10.5) |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 64MBIT PAR 86TSOP II
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM | 64Mbit | LVTTL | 166 MHz | - | 5.4 ns | 3V ~ 3.6V | 0°C ~ 70°C (TA) | Surface Mount | 86-TFSOP (0.400", 10.16mm Width) | 86-TSOP II |
||
Winbond Electronics |
IC FLASH 128MBIT SPI/QUAD 8WSON
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NAND | 128Mbit | SPI - Quad I/O, QPI | 133 MHz | 3ms | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |