Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cypress Semiconductor Corp |
IC FLASH MEMORY 48TSOP
|
pacchetto: - |
Azione5.152 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
ON Semiconductor |
IC FLASH 4MBIT 120NS 32TSSOP
|
pacchetto: 32-TFSOP (0.488", 12.40mm Width) |
Azione7.232 |
|
FLASH | FLASH | 4Mb (512K x 8) | Parallel | - | - | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 32-TFSOP (0.488", 12.40mm Width) | 32-TSSOP |
||
Micron Technology Inc. |
IC FLASH 16MBIT 55NS 80QFP
|
pacchetto: 80-BQFP |
Azione5.280 |
|
FLASH | FLASH - NOR | 16Mb (512K x 32) | Parallel | - | 55ns | 55ns | 2.5 V ~ 3.3 V | -40°C ~ 125°C (TA) | Surface Mount | 80-BQFP | 80-PQFP (19.9x13.9) |
||
Micron Technology Inc. |
IC FLASH 128MBIT 70NS 64TBGA
|
pacchetto: 64-TBGA |
Azione4.032 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8, 8M x 16) | Parallel | - | 70ns | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 64-TBGA | 64-TBGA (10x13) |
||
Micron Technology Inc. |
IC FLASH 128GBIT 153VFBGA
|
pacchetto: - |
Azione6.912 |
|
FLASH | FLASH - NAND | 128Gb (16G x 8) | MMC | - | - | - | 2.7 V ~ 3.6 V | -25°C ~ 85°C (TA) | Surface Mount | - | - |
||
Micron Technology Inc. |
IC SDRAM 2GBIT 167MHZ 168WFBGA
|
pacchetto: 168-WFBGA |
Azione6.048 |
|
DRAM | SDRAM - Mobile LPDDR | 2Gb (64M x 32) | Parallel | 166MHz | 15ns | 5.0ns | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 168-WFBGA | 168-WFBGA (12x12) |
||
Winbond Electronics |
IC FLASH 128MBIT 104MHZ 8WSON
|
pacchetto: 8-WDFN Exposed Pad |
Azione4.336 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8) | SPI | 104MHz | 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (8x6) |
||
ON Semiconductor |
IC EEPROM 64KBIT 90NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione7.072 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 5ms | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Cypress Semiconductor Corp |
IC SRAM 9MBIT 167MHZ 165FBGA
|
pacchetto: 165-LBGA |
Azione4.496 |
|
SRAM | SRAM - Synchronous, DDR | 9Mb (256K x 36) | Parallel | 167MHz | - | - | 2.4 V ~ 2.6 V | 0°C ~ 70°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (13x15) |
||
Cypress Semiconductor Corp |
IC SRAM 1MBIT 15NS 44SOJ
|
pacchetto: 44-BSOJ (0.400", 10.16mm Width) |
Azione4.944 |
|
SRAM | SRAM - Asynchronous | 1Mb (64K x 16) | Parallel | - | 15ns | 15ns | 2.5 V ~ 2.7 V | -40°C ~ 125°C (TA) | Surface Mount | 44-BSOJ (0.400", 10.16mm Width) | 44-SOJ |
||
Micron Technology Inc. |
IC SDRAM 512MBIT 133MHZ 60FBGA
|
pacchetto: 60-TFBGA |
Azione6.528 |
|
DRAM | SDRAM - DDR | 512Mb (64M x 8) | Parallel | 133MHz | 15ns | 750ps | 2.3 V ~ 2.7 V | 0°C ~ 70°C (TA) | Surface Mount | 60-TFBGA | 60-FBGA (10x12.5) |
||
Microchip Technology |
IC EEPROM 256KBIT 1MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione228.696 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I2C | 1MHz | 10ms | 550ns | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC OTP 256KBIT 70NS 28DIP
|
pacchetto: 28-DIP (0.600", 15.24mm) |
Azione5.296 |
|
EPROM | EPROM - OTP | 256Kb (32K x 8) | Parallel | - | - | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 125°C (TC) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Microchip Technology |
IC EEPROM 256KBIT 2.1MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione7.696 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 2.1MHz | 10ms | - | 1.8 V ~ 3.6 V | 0°C ~ 70°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 64KBIT 45NS 84PLCC
|
pacchetto: 84-LCC (J-Lead) |
Azione4.656 |
|
SRAM | SRAM - Dual Port, Asynchronous | 64Kb (4K x 16) | Parallel | - | 45ns | 45ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 84-LCC (J-Lead) | 84-PLCC (29.21x29.21) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 9MBIT 8NS 165CABGA
|
pacchetto: 165-TBGA |
Azione6.464 |
|
SRAM | SRAM - Synchronous ZBT | 9Mb (256K x 36) | Parallel | - | - | 8ns | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 165-TBGA | 165-CABGA (13x15) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 32KBIT 25NS 52PLCC
|
pacchetto: 52-LCC (J-Lead) |
Azione5.328 |
|
SRAM | SRAM - Dual Port, Asynchronous | 32Kb (4K x 8) | Parallel | - | 25ns | 25ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 52-LCC (J-Lead) | 52-PLCC (19.13x19.13) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 8KBIT 25NS 52PLCC
|
pacchetto: 52-LCC (J-Lead) |
Azione4.320 |
|
SRAM | SRAM - Dual Port, Asynchronous | 8Kb (1K x 8) | Parallel | - | 25ns | 25ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 52-LCC (J-Lead) | 52-PLCC (19.13x19.13) |
||
Microchip Technology |
IC EEPROM 16KBIT 100KHZ 8TDFN
|
pacchetto: 8-WFDFN Exposed Pad |
Azione2.880 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Single Wire | 100kHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
IC EEPROM 64KBIT 400KHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.056 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I2C | 400kHz | 5ms | 900ns | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 2KBIT 100KHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione20.832 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | Single Wire | 100kHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Infineon Technologies |
INFINEON
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
FLASH MEMORY NOR
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
DDR5 16GB EUDIMM
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Silicon Motion, Inc. |
IC FLASH 320GBIT EMMC 153BGA
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NAND (SLC) | 320Gbit | eMMC | - | - | - | - | -25°C ~ 85°C | Surface Mount | 153-TFBGA | 153-BGA (11.5x13) |
||
Winbond Electronics |
IC FLASH 64MBIT SPI/QUAD 8SOIC
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 64Mbit | SPI - Quad I/O | 133 MHz | 3ms | 6 ns | 2.7V ~ 3.6V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Cypress Semiconductor Corp |
IC SRAM 64KBIT PARALLEL 24SOJ
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Standard | 64Kbit | Parallel | - | 25ns | 25 ns | 4.5V ~ 5.5V | 0°C ~ 70°C (TA) | Surface Mount | 24-BSOJ (0.300", 7.62mm Width) | 24-SOJ |
||
GSI Technology Inc. |
IC SRAM 36MBIT PARALLEL 165FPBGA
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Quad Port, Synchronous, QDR II | 36Mbit | Parallel | 357 MHz | - | - | 1.7V ~ 1.9V | -40°C ~ 100°C (TJ) | Surface Mount | 165-LBGA | 165-FPBGA (13x15) |