Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Micron Technology Inc. |
LPDDR2 30NM
|
pacchetto: - |
Azione2.100 |
|
DRAM | SDRAM - Mobile LPDDR2 | 4Gb (64M x 64) | Parallel | 533MHz | - | - | 1.14 V ~ 1.3 V | -25°C ~ 85°C (TC) | - | - | - |
||
Micron Technology Inc. |
IC FLASH 256GBIT 83MHZ 48TSOP
|
pacchetto: - |
Azione5.904 |
|
FLASH | FLASH - NAND | 256Gb (32G x 8) | Parallel | 83MHz | - | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | - | - | - |
||
ISSI, Integrated Silicon Solution Inc |
IC FLASH 4MBIT 104MHZ 8SOIC
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione4.768 |
|
FLASH | FLASH - NOR | 4Mb (512K x 8) | SPI - Quad I/O | 104MHz | 700µs | - | 2.3 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Cypress Semiconductor Corp |
IC SRAM 18MBIT 167MHZ 100LQFP
|
pacchetto: 100-LQFP |
Azione5.424 |
|
SRAM | SRAM - Synchronous | 18Mb (512K x 36) | Parallel | 167MHz | - | 3.4ns | 3.135 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Microchip Technology |
IC FLASH 16MBIT 100MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione36.600 |
|
FLASH | FLASH | 16Mb (2M x 8) | SPI | 100MHz | 7µs, 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC SRAM 2MBIT 133MHZ 144TQFP
|
pacchetto: 144-LQFP Exposed Pad |
Azione5.904 |
|
SRAM | SRAM - Dual Port, Synchronous | 2Mb (128K x 18) | Parallel | 133MHz | - | 4.2ns | 2.4 V ~ 2.6 V | -40°C ~ 85°C (TA) | Surface Mount | 144-LQFP Exposed Pad | 144-TQFP (20x20) |
||
Micron Technology Inc. |
IC FLASH 64MBIT 70NS 56VFBGA
|
pacchetto: 56-VFBGA |
Azione7.296 |
|
FLASH | FLASH - NOR | 64Mb (4M x 16) | Parallel | 66MHz | 70ns | 70ns | 1.65 V ~ 2.2 V | -40°C ~ 85°C (TA) | Surface Mount | 56-VFBGA | 56-VFBGA (7.7x9) |
||
Micron Technology Inc. |
IC FLASH 1MBIT 70NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione7.216 |
|
FLASH | FLASH - NOR | 1Mb (128K x 8) | Parallel | - | 70ns | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.35x13.89) |
||
Micron Technology Inc. |
IC SDRAM 512MBIT 333MHZ 60FBGA
|
pacchetto: 60-FBGA |
Azione6.672 |
|
DRAM | SDRAM - DDR2 | 512Mb (64M x 8) | Parallel | 333MHz | 15ns | 450ps | 1.7 V ~ 1.9 V | 0°C ~ 85°C (TC) | Surface Mount | 60-FBGA | 60-FBGA |
||
Cypress Semiconductor Corp |
IC SRAM 256KBIT 12NS 28SOJ
|
pacchetto: 28-BSOJ (0.300", 7.62mm Width) |
Azione5.664 |
|
SRAM | SRAM - Asynchronous | 256Kb (32K x 8) | Parallel | - | 12ns | 12ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 28-BSOJ (0.300", 7.62mm Width) | 28-SOJ |
||
Microchip Technology |
IC EEPROM 1MBIT 150NS 32SOIC
|
pacchetto: 32-SOIC (0.295", 7.50mm Width) |
Azione5.456 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-SOIC (0.295", 7.50mm Width) | 32-SOIC |
||
Cypress Semiconductor Corp |
IC FRAM MEM SER 4KBIT 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.944 |
|
FRAM | FRAM (Ferroelectric RAM) | 4Kb (512 x 8) | SPI | 16MHz | - | - | 3 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 4MBIT 50MHZ 8SOIC
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione5.216 |
|
FLASH | FLASH | 4Mb (512K x 8) | SPI | 50MHz | 10µs | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 2KBIT 2MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione3.216 |
|
EEPROM | EEPROM | 2Kb (256 x 8, 128 x 16) | SPI | 2MHz | 10ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
ISSI, Integrated Silicon Solution Inc |
32MB QSPI 8-PIN SOP 208MIL ET
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione8.112 |
|
FLASH | FLASH - NOR | 32Mb (4M x 8) | SPI - Quad I/O, QPI, DTR | 133MHz | 800µs | - | 2.3 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOP |
||
ON Semiconductor |
IC RAM 64 PARALLEL 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione4.736 |
|
RAM | RAM | 64b (16 x 4) | Parallel | - | 29ns | 27ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Cypress Semiconductor Corp |
IC FLASH 2G PARALLEL 64FBGA
|
pacchetto: 64-LBGA |
Azione5.456 |
|
FLASH | FLASH - NOR | 2Gb (128M x 16) | Parallel | - | - | 110ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 64-LBGA | 64-FBGA (13x11) |
||
Cypress Semiconductor Corp |
IC 256 MB FLASH MEMORY
|
pacchetto: 24-TBGA |
Azione7.712 |
|
FLASH | FLASH - NOR | 256Mb (32M x 8) | SPI - Quad I/O | 80MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 24-TBGA | 24-BGA (8x6) |
||
Cypress Semiconductor Corp |
IC NOR
|
pacchetto: 24-TBGA |
Azione3.552 |
|
FLASH | FLASH - NOR | 512Mb (64M x 8) | SPI - Quad I/O | 133MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-BGA (8x6) |
||
Cypress Semiconductor Corp |
IC SRAM 4M PARALLEL 48VFBGA
|
pacchetto: 48-VFBGA |
Azione2.800 |
|
SRAM | SRAM - Asynchronous | 4Mb (256K x 16) | Parallel | - | 45ns | 45ns | 2.2 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-VFBGA | 48-VFBGA (6x8) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 32K PARALLEL 68PLCC
|
pacchetto: 68-LCC (J-Lead) |
Azione7.200 |
|
SRAM | SRAM - Dual Port, Asynchronous | 32Kb (2K x 16) | Parallel | - | 55ns | 55ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 68-LCC (J-Lead) | 68-PLCC (24.21x24.21) |
||
Winbond Electronics |
1G-BIT SERIAL NAND FLASH, 3V
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NAND (SLC) | 1Gbit | SPI - Quad I/O | 104 MHz | 700µs | 7 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (8x6) |
||
Winbond Electronics |
1GB LPDDR4X, X16, 2133MHZ, -40C~
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4X | 1Gbit | LVSTL_06 | 2.133 GHz | 18ns | 3.6 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | Surface Mount | 200-WFBGA | 200-WFBGA (10x14.5) |
||
Renesas Electronics Corporation |
EEPROM, 256X8, SERIAL
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
STMicroelectronics |
FLASH 1 MB (64KB X16, BOOT BLOCK
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 1Mbit | Parallel | - | - | 45 ns | 5V | 0°C ~ 70°C (TA) | Surface Mount | 44-PLCC | 44-PLCC |
||
ISSI, Integrated Silicon Solution Inc |
8Mb,High-Speed/Low Power,Async w
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Asynchronous | 8Mbit | Parallel | - | 20ns | 20 ns | 1.65V ~ 2.2V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA (6x8) |
||
GigaDevice Semiconductor (HK) Limited |
IC FLASH 128MBIT SPI/QUAD 8WSON
|
pacchetto: - |
Azione9.528 |
|
FLASH | FLASH - NOR | 128Mbit | SPI - Quad I/O | 120 MHz | 2.4ms | - | 1.65V ~ 2V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x8) |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 64MBIT PARALLEL 54TFBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM | 64Mbit | LVTTL | 166 MHz | - | 5.4 ns | 3V ~ 3.6V | 0°C ~ 70°C (TA) | Surface Mount | 54-TFBGA | 54-TFBGA (8x8) |