Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cypress Semiconductor Corp |
IC FLASH NOR
|
pacchetto: - |
Azione4.656 |
|
FLASH | FLASH - NOR | 64Mb (8M x 8) | SPI - Quad I/O | 104MHz | 5µs, 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | - | - | - |
||
AKM Semiconductor Inc. |
IC EEPROM 16KB SCI SSOP
|
pacchetto: - |
Azione3.424 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Cypress Semiconductor Corp |
IC FLASH 1GBIT 130NS 56TSOP
|
pacchetto: 56-TFSOP (0.724", 18.40mm Width) |
Azione37.140 |
|
FLASH | FLASH - NOR | 1Gb (128M x 8) | Parallel | - | 130ns | 130ns | 1.65 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 56-TFSOP (0.724", 18.40mm Width) | 56-TSOP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 1MBIT 10NS 32TSOP
|
pacchetto: 32-SOIC (0.400", 10.16mm Width) |
Azione2.864 |
|
SRAM | SRAM - Asynchronous | 1Mb (128K x 8) | Parallel | - | 10ns | 10ns | 3.15 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 32-SOIC (0.400", 10.16mm Width) | 32-TSOP II |
||
Cypress Semiconductor Corp |
IC SRAM 72MBIT 200MHZ 165FBGA
|
pacchetto: 165-LBGA |
Azione4.896 |
|
SRAM | SRAM - Synchronous | 72Mb (2M x 36) | Parallel | 200MHz | - | 3ns | 2.375 V ~ 2.625 V | 0°C ~ 70°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (15x17) |
||
Cypress Semiconductor Corp |
IC SRAM 36MBIT 167MHZ 165FBGA
|
pacchetto: 165-LBGA |
Azione3.776 |
|
SRAM | SRAM - Synchronous, QDR II | 36Mb (1M x 36) | Parallel | 167MHz | - | - | 1.7 V ~ 1.9 V | 0°C ~ 70°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (15x17) |
||
Cypress Semiconductor Corp |
IC SRAM 9MBIT 200MHZ 100LQFP
|
pacchetto: 100-LQFP |
Azione2.720 |
|
SRAM | SRAM - Synchronous | 9Mb (256K x 36) | Parallel | 200MHz | - | 3.2ns | 2.375 V ~ 2.625 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x20) |
||
Microchip Technology |
IC EEPROM 256KBIT 20MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione1.870.752 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 20MHz | 5ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 128KBIT 1MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione6.368 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I2C | 1MHz | 10ms | 550ns | 2.7 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Cypress Semiconductor Corp |
IC SRAM 144MBIT 933MHZ 361FCBGA
|
pacchetto: 361-BBGA, FCBGA |
Azione5.744 |
|
SRAM | SRAM - Synchronous, QDR IV | 144Mb (4M x 36) | Parallel | 933MHz | - | - | 1.26 V ~ 1.34 V | -40°C ~ 85°C (TA) | Surface Mount | 361-BBGA, FCBGA | 361-FCBGA (21x21) |
||
Micron Technology Inc. |
IC FLASH 256GBIT 169TFBGA
|
pacchetto: - |
Azione6.512 |
|
FLASH | FLASH - NAND | 256Gb (32G x 8) | MMC | - | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | - | - | - |
||
Everspin Technologies Inc. |
IC MRAM 4MBIT 35NS 44TSOP
|
pacchetto: 44-TSOP (0.400", 10.16mm Width) |
Azione2.096 |
|
RAM | MRAM (Magnetoresistive RAM) | 4Mb (512K x 8) | Parallel | - | 35ns | 35ns | 3 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP2 |
||
Micron Technology Inc. |
LPDDR3 SPECIAL/CUSTOM PLASTIC VF
|
pacchetto: - |
Azione6.912 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 2GBIT 667MHZ 96BGA
|
pacchetto: 96-TFBGA |
Azione19.956 |
|
DRAM | SDRAM - DDR3 | 2Gb (128M x 16) | Parallel | 667MHz | 15ns | 20ns | 1.425 V ~ 1.575 V | -40°C ~ 95°C (TC) | Surface Mount | 96-TFBGA | 96-TWBGA (9x13) |
||
Cypress Semiconductor Corp |
IC 1GB MEMORY
|
pacchetto: 56-TFSOP (0.724", 18.40mm Width) |
Azione4.800 |
|
FLASH | FLASH - NOR | 1Gb (128M x 8) | Parallel | - | 60ns | 120ns | 1.65 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 56-TFSOP (0.724", 18.40mm Width) | 56-TSOP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 16KBIT 55NS 52PLCC
|
pacchetto: 52-LCC (J-Lead) |
Azione2.608 |
|
SRAM | SRAM - Dual Port, Asynchronous | 16Kb (2K x 8) | Parallel | - | 55ns | 55ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 52-LCC (J-Lead) | 52-PLCC (19.13x19.13) |
||
Micron Technology Inc. |
IC FLASH 4GBIT 63VFBGA
|
pacchetto: 63-VFBGA |
Azione31.560 |
|
FLASH | FLASH - NAND | 4Gb (512M x 8) | Parallel | - | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 63-VFBGA | 63-VFBGA (9x11) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4.5MBIT 8.5NS 119BGA
|
pacchetto: 119-BGA |
Azione7.056 |
|
SRAM | SRAM - Synchronous | 4.5Mb (128K x 36) | Parallel | 87MHz | - | 8.5ns | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 119-BGA | 119-PBGA (14x22) |
||
Micron Technology Inc. |
IC FLASH 128MBIT 54MHZ 16SO
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione17.400 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8) | SPI | 54MHz | 15ms, 5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SO W |
||
Microchip Technology |
IC EEPROM 8KBIT 4MHZ M2P
|
pacchetto: M2 P, Smart Card Module (TWI) |
Azione2.240 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | I2C | 4MHz | 5ms | 250ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | M2 P, Smart Card Module (TWI) | M2 - P Module (TWI) |
||
Microchip Technology |
IC EEPROM 128KBIT 20MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione1.710.900 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 20MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
STMicroelectronics |
IC EEPROM 64KBIT 400KHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione377.664 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I2C | 1MHz | 5ms | 450ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
STMicroelectronics |
IC EEPROM 2KBIT 400KHZ 8SO
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione822.108 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 400kHz | 5ms | 900ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SO |
||
Micron Technology Inc. |
LPDDR5 32G 512MX64 FBGA QDP
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR5 | 32Gbit | Parallel | 3.2 GHz | - | - | - | -25°C ~ 85°C | - | - | - |
||
Infineon Technologies |
INFINEON
|
pacchetto: - |
Request a Quote |
|
FLASH | HyperFlash | 512Mbit | HyperBus | 100 MHz | - | 96 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 24-VBGA | 24-VFBGA (6x8) |
||
Infineon Technologies |
IC PSOC4 8SOIC
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
GSI Technology Inc. |
IC SRAM 288MBIT PAR 165FPBGA
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Synchronous, Standard | 288Mbit | Parallel | 200 MHz | - | - | 1.7V ~ 2V, 2.3V ~ 2.7V | -40°C ~ 100°C (TJ) | Surface Mount | 165-LBGA | 165-FPBGA (15x13) |
||
Micron Technology Inc. |
UMCP 2144G
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |