Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Intersil |
IC EEPROM 256KBIT 90NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione3.136 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 5ms | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | - | 32-LCC (J-Lead) | 32-PLCC |
||
Cypress Semiconductor Corp |
IC SRAM 36MBIT 375MHZ 165FBGA
|
pacchetto: 165-LBGA |
Azione2.656 |
|
SRAM | SRAM - Synchronous, DDR II | 36Mb (1M x 36) | Parallel | 375MHz | - | - | 1.7 V ~ 1.9 V | -40°C ~ 85°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (15x17) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 18MBIT 7.5NS 100TQFP
|
pacchetto: 100-LQFP |
Azione4.400 |
|
SRAM | SRAM - Synchronous ZBT | 18Mb (512K x 36) | Parallel | - | - | 7.5ns | 2.375 V ~ 2.625 V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 8KBIT 35NS 132QFP
|
pacchetto: 132-BQFP Bumpered |
Azione2.912 |
|
SRAM | SRAM - Quad Port, Asynchronous | 8Kb (1K x 8) | Parallel | - | 35ns | 35ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 132-BQFP Bumpered | 132-PQFP (24.13x24.13) |
||
Maxim Integrated |
IC NVSRAM 2MBIT 70NS 40EDIP
|
pacchetto: 40-DIP Module (0.610", 15.495mm) |
Azione7.008 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 2Mb (128K x 16) | Parallel | - | 70ns | 70ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 40-DIP Module (0.610", 15.495mm) | 40-EDIP |
||
Maxim Integrated |
IC NVSRAM 256KBIT 120NS 28EDIP
|
pacchetto: 28-DIP Module (0.600", 15.24mm) |
Azione6.144 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 256Kb (32K x 8) | Parallel | - | 120ns | 120ns | 4.75 V ~ 5.25 V | 0°C ~ 70°C (TA) | Through Hole | 28-DIP Module (0.600", 15.24mm) | 28-EDIP |
||
Microchip Technology |
IC OTP 256KBIT 55NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione3.040 |
|
EPROM | EPROM - OTP | 256Kb (32K x 8) | Parallel | - | - | 55ns | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 256KBIT 3MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione4.944 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 3MHz | 5ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 16KBIT 25NS 52PLCC
|
pacchetto: 52-LCC (J-Lead) |
Azione6.640 |
|
SRAM | SRAM - Dual Port, Asynchronous | 16Kb (2K x 8) | Parallel | - | 25ns | 25ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 52-LCC (J-Lead) | 52-PLCC (19.13x19.13) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4.5MBIT 100MHZ 119BGA
|
pacchetto: 119-BGA |
Azione7.952 |
|
SRAM | SRAM - Synchronous ZBT | 4.5Mb (128K x 36) | Parallel | 100MHz | - | 5ns | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 119-BGA | 119-PBGA (14x22) |
||
Micron Technology Inc. |
IC SDRAM 128MBIT 166MHZ 60FBGA
|
pacchetto: 60-TFBGA |
Azione7.088 |
|
DRAM | SDRAM | 128Mb (16M x 8) | Parallel | 167MHz | 12ns | 5.4ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 60-TFBGA | 60-TFBGA (8x16) |
||
ISSI, Integrated Silicon Solution Inc |
IC SRAM 4MBIT 25NS 32STSOP
|
pacchetto: 32-LFSOP (0.465", 11.80mm Width) |
Azione2.576 |
|
SRAM | SRAM - Asynchronous | 4Mb (512K x 8) | Parallel | - | 25ns | 25ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 32-LFSOP (0.465", 11.80mm Width) | 32-sTSOP I |
||
Microchip Technology |
IC FLASH 4MBIT 50MHZ 8WSON
|
pacchetto: 8-WDFN Exposed Pad |
Azione6.672 |
|
FLASH | FLASH | 4Mb (512K x 8) | SPI | 50MHz | 10µs | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
Microchip Technology |
IC EEPROM 128KBIT 10MHZ 8SOIJ
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione6.480 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 10MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIJ |
||
Microchip Technology |
IC EEPROM 8KBIT 3MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione7.264 |
|
EEPROM | EEPROM | 8Kb (1K x 8, 512 x 16) | SPI | 3MHz | 5ms | - | 1.8 V ~ 6 V | 0°C ~ 70°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Cypress Semiconductor Corp |
IC FLASH 32MBIT 70NS 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione7.280 |
|
FLASH | FLASH - NOR | 32Mb (4M x 8, 2M x 16) | Parallel | - | 70ns | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Microchip Technology |
IC EEPROM 64KBIT 1MHZ 8MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione13.572 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I2C | 1MHz | 5ms | 400ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
IC EEPROM 64KBIT 400KHZ 8MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione469.368 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 8G PARALLEL 96LFBGA
|
pacchetto: 96-LFBGA |
Azione3.792 |
|
DRAM | SDRAM - DDR3L | 8Gb (512M x 16) | Parallel | 800MHz | 15ns | 20ns | 1.283 V ~ 1.45 V | 0°C ~ 95°C (TC) | Surface Mount | 96-LFBGA | 96-LFBGA (10x14) |
||
Cypress Semiconductor Corp |
IC FLASH 1G PARALLEL 63BGA
|
pacchetto: 63-VFBGA |
Azione3.920 |
|
FLASH | FLASH - NAND | 1Gb (128M x 8) | Parallel | - | 45ns | 45ns | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 63-VFBGA | 63-BGA (11x9) |
||
Macronix |
IC FLASH 128MBIT
|
pacchetto: - |
Azione14.136 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC SRAM 32K PARALLEL 64TQFP
|
pacchetto: 64-LQFP |
Azione5.024 |
|
SRAM | SRAM - Dual Port, Asynchronous | 32Kb (4K x 8) | Parallel | - | 55ns | 55ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | 64-TQFP (14x14) |
||
Cypress Semiconductor Corp |
IC SRAM 4MBIT PARALLEL 48VFBGA
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Asynchronous | 4Mbit | Parallel | - | 55ns | 55 ns | 2.2V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 48-VFBGA | 48-VFBGA (6x8) |
||
Winbond Electronics |
IC DRAM 4GBIT PAR 96VFBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - DDR3L | 4Gbit | Parallel | 1.06 GHz | 15ns | 20 ns | 1.283V ~ 1.45V | 0°C ~ 95°C (TC) | Surface Mount | 96-VFBGA | 96-VFBGA (7.5x13) |
||
Cypress Semiconductor Corp |
IC SRAM 1MBIT PARALLEL 32TSOP I
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Asynchronous | 1Mbit | Parallel | - | 70ns | 70 ns | 2.2V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP I |
||
Micron Technology Inc. |
LPDDR4 16G 512MX32 FBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4 | 16Gbit | Parallel | 2.133 GHz | - | - | - | -40°C ~ 105°C | Surface Mount | 200-TFBGA | 200-TFBGA (10x14.5) |
||
Micron Technology Inc. |
IC DRAM 4GBIT PARALLEL 96FBGA
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | Surface Mount | 96-TFBGA | 96-FBGA (7.5x13) |
||
Micron Technology Inc. |
IC DRAM 16GBIT 2.133GHZ 200WFBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4X | 16Gbit | Parallel | 2.133 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V | -40°C ~ 105°C (TC) | Surface Mount | 200-TFBGA | 200-TFBGA (10x14.5) |