Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
IDT, Integrated Device Technology Inc |
IC SRAM 4.5MBIT 8.5NS 165CABGA
|
pacchetto: 165-TBGA |
Azione4.656 |
|
SRAM | SRAM - Synchronous ZBT | 4.5Mb (256K x 18) | Parallel | - | - | 8.5ns | 3.135 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 165-TBGA | 165-CABGA (13x15) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 1MBIT 15NS 44SOJ
|
pacchetto: 44-BSOJ (0.400", 10.16mm Width) |
Azione14.028 |
|
SRAM | SRAM - Asynchronous | 1Mb (64K x 16) | Parallel | - | 15ns | 15ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 44-BSOJ (0.400", 10.16mm Width) | 44-SOJ |
||
IDT, Integrated Device Technology Inc |
IC SRAM 512KBIT 15NS 144CABGA
|
pacchetto: 144-LFBGA |
Azione4.368 |
|
SRAM | SRAM - Dual Port, Asynchronous | 512Kb (32K x 16) | Parallel | - | 15ns | 15ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 144-LFBGA | 144-CABGA (12x12) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 9MBIT 233MHZ 576FCBGA
|
pacchetto: 576-BBGA, FCBGA |
Azione5.328 |
|
SRAM | SRAM - Dual Port, Synchronous QDR II | 9Mb (512K x 18) | Parallel | 233MHz | - | 7.2ns | 1.7 V ~ 1.9 V | -40°C ~ 85°C (TA) | Surface Mount | 576-BBGA, FCBGA | 576-FCBGA (25x25) |
||
Micron Technology Inc. |
IC SDRAM 128MBIT 143MHZ 90VFBGA
|
pacchetto: 90-VFBGA |
Azione7.376 |
|
DRAM | SDRAM | 128Mb (4M x 32) | Parallel | 143MHz | 14ns | 5.5ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 90-VFBGA | 90-VFBGA (8x13) |
||
Microchip Technology |
IC FLASH 2MBIT 150NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione5.072 |
|
FLASH | FLASH | 2Mb (256K x 8) | Parallel | - | 20ms | 150ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Microchip Technology |
IC FLASH 32MBIT 110NS 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione7.456 |
|
FLASH | FLASH | 32Mb (4M x 8, 2M x 16) | Parallel | - | 20µs | 110ns | 2.65 V ~ 3.3 V | -40°C ~ 85°C (TC) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Microchip Technology |
IC FLASH 512KBIT 150NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione7.184 |
|
FLASH | FLASH | 512Kb (64K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 256KBIT 12NS 100TQFP
|
pacchetto: 100-LQFP |
Azione2.816 |
|
SRAM | SRAM - Dual Port, Synchronous | 256Kb (16K x 16) | Parallel | - | - | 12ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 64KBIT 55NS 68PLCC
|
pacchetto: 68-LCC (J-Lead) |
Azione2.736 |
|
SRAM | SRAM - Dual Port, Asynchronous | 64Kb (8K x 8) | Parallel | - | 55ns | 55ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 68-LCC (J-Lead) | 68-PLCC (24.21x24.21) |
||
Cypress Semiconductor Corp |
IC NVSRAM 4MBIT 25NS 44TSOP
|
pacchetto: 44-TSOP (0.400", 10.16mm Width) |
Azione13.188 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 4Mb (256K x 16) | Parallel | - | 25ns | 25ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
Micron Technology Inc. |
IC FLASH 1GBIT 133MHZ 8WPDFN
|
pacchetto: - |
Azione2.224 |
|
FLASH | FLASH - NOR | 1Gb (128M x 8) | SPI | 133MHz | 8ms, 2.8ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | - | 8-WPDFN (6x8) (MLP8) |
||
Microchip Technology |
IC EEPROM 128KBIT 400KHZ 8DFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione6.256 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-DFN-S (6x5) |
||
Rohm Semiconductor |
IC EEPROM 128KBIT 5MHZ 8SOP
|
pacchetto: 8-SOIC (0.173", 4.40mm Width) |
Azione19.974 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 5MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.173", 4.40mm Width) | 8-SOP |
||
Winbond Electronics |
IC FLASH 32MBIT 133MHZ 8WSON
|
pacchetto: 8-WDFN Exposed Pad |
Azione71.742 |
|
FLASH | FLASH - NOR | 32Mb (4M x 8) | SPI | 133MHz | 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 1G PARALLEL 533MHZ
|
pacchetto: 134-TFBGA |
Azione4.064 |
|
DRAM | SDRAM - Mobile LPDDR2-S4 | 1Gb (32M x 32) | Parallel | 533MHz | 15ns | - | 1.14 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 134-TFBGA | 134-TFBGA (10x11.5) |
||
Cypress Semiconductor Corp |
IC FLASH 512M PARALLEL 64FBGA
|
pacchetto: 64-LBGA |
Azione4.880 |
|
FLASH | FLASH - NOR | 512Mb (32M x 16) | Parallel | - | 60ns | 110ns | 2.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 64-LBGA | 64-FBGA (9x9) |
||
Cypress Semiconductor Corp |
IC MEMORY FLASH NOR
|
pacchetto: - |
Azione6.992 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
onsemi |
IC EEPROM 4KBIT SPI 10MHZ 8SOIC
|
pacchetto: - |
Request a Quote |
|
EEPROM | EEPROM | 4Kbit | SPI | 10 MHz | 5ms | 40 ns | 1.8V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Micron Technology Inc. |
IC FLASH 4GBIT 168BGA
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Cypress Semiconductor Corp |
IC SRAM 2MBIT PARALLEL 48FBGA
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Asynchronous | 2Mbit | Parallel | - | 70ns | 70 ns | 1.65V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFBGA | 48-FBGA (7x7) |
||
Winbond Electronics |
IC FLASH 8MBIT SPI/QUAD 8WSON
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 8Mbit | SPI - Quad I/O | 104 MHz | - | - | 1.65V ~ 1.95V | -40°C ~ 125°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
Renesas Electronics Corporation |
IC RAM
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Dual Port, Asynchronous | 512Kbit | Parallel | - | 12ns | 12 ns | 4.5V ~ 5.5V | 0°C ~ 70°C (TA) | Surface Mount | 84-LCC (J-Lead) | 84-PLCC (29.31x29.31) |
||
Silicon Motion, Inc. |
IC FLASH 640GBIT EMMC 153BGA
|
pacchetto: - |
Azione15 |
|
FLASH | FLASH - NAND (SLC) | 640Gbit | eMMC | - | - | - | - | -40°C ~ 85°C | Surface Mount | 153-TFBGA | 153-BGA (11.5x13) |
||
Renesas Electronics Corporation |
32K X 8 EEPROM,CMOS,HIGHSPEED,32
|
pacchetto: - |
Request a Quote |
|
EEPROM | EEPROM | 256Kbit | Parallel | - | 5ms | 90 ns | 4.5V ~ 5.5V | 0°C ~ 70°C (TA) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (13.97x11.43) |
||
ISSI, Integrated Silicon Solution Inc |
Automotive (Tc: -40 to +95C), 4G
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4 | 4Gbit | LVSTL | 1.6 GHz | - | - | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 95°C (TC) | Surface Mount | 200-VFBGA | 200-VFBGA (10x14.5) |
||
GigaDevice Semiconductor (HK) Limited |
IC FLSH 256MBIT SPI/QUAD 48WLCSP
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 256Mbit | SPI - Quad I/O, QPI, DTR | 166 MHz | 70µs, 1.2ms | 6 ns | 1.65V ~ 2V | -40°C ~ 85°C (TA) | Surface Mount | 48-XFBGA, WLCSP | 48-WLCSP |
||
GigaDevice Semiconductor (HK) Limited |
LINEAR IC
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NAND (SLC) | 4Gbit | SPI - Quad I/O, DTR | 133 MHz | 600µs | 7 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x8) |