Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Micron Technology Inc. |
IC FLASH 128MBIT 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione4.816 |
|
FLASH | FLASH - NAND | 128Mb (16M x 8) | Parallel | - | 50ns | 50ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Alliance Memory, Inc. |
IC SDRAM 1GBIT 800MHZ 78BGA
|
pacchetto: 78-TFBGA |
Azione2.656 |
|
DRAM | SDRAM - DDR3L | 1Gb (128M x 8) | Parallel | 800MHz | 15ns | 20ns | 1.283 V ~ 1.45 V | -40°C ~ 95°C (TC) | Surface Mount | 78-TFBGA | 78-FBGA (8x10.5) |
||
Micron Technology Inc. |
IC FLASH 128GBIT 169TFBGA
|
pacchetto: 169-TFBGA |
Azione7.136 |
|
FLASH | FLASH - NAND | 128Gb (16G x 8) | MMC | - | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 169-TFBGA | 169-TFBGA (14x18) |
||
STMicroelectronics |
IC EEPROM 512KBIT 5MHZ 8MLP
|
pacchetto: 8-UFDFN Exposed Pad |
Azione3.024 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | SPI | 16MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-MLP (2x3) |
||
Winbond Electronics |
IC FLASH 8MBIT 104MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione29.724 |
|
FLASH | FLASH - NOR | 8Mb (1M x 8) | SPI | 104MHz | 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Cypress Semiconductor Corp |
IC SRAM 72MBIT 333MHZ 165FBGA
|
pacchetto: 165-LBGA |
Azione4.240 |
|
SRAM | SRAM - Synchronous, DDR II | 72Mb (4M x 18) | Parallel | 333MHz | - | - | 1.7 V ~ 1.9 V | -40°C ~ 85°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (13x15) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4.5MBIT 8NS 100TQFP
|
pacchetto: 100-LQFP |
Azione2.100 |
|
SRAM | SRAM - Synchronous | 4.5Mb (128K x 36) | Parallel | - | - | 8ns | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Micron Technology Inc. |
IC FLASH 128MBIT 85NS 64EASYBGA
|
pacchetto: 64-TBGA |
Azione4.560 |
|
FLASH | FLASH - NOR | 128Mb (8M x 16) | Parallel | 52MHz | 85ns | 85ns | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 64-TBGA | 64-EasyBGA (8x10) |
||
Micron Technology Inc. |
IC FLASH 2MBIT 70NS 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione4.816 |
|
FLASH | FLASH - NOR | 2Mb (256K x 8, 128K x 16) | Parallel | - | 70ns | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Maxim Integrated |
IC NVSRAM 64KBIT 70NS 28EDIP
|
pacchetto: 28-DIP Module (0.600", 15.24mm) |
Azione2.768 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 64Kb (8K x 8) | Parallel | - | 70ns | 70ns | 4.75 V ~ 5.25 V | 0°C ~ 70°C (TA) | Through Hole | 28-DIP Module (0.600", 15.24mm) | 28-EDIP |
||
Microchip Technology |
IC OTP 512KBIT 150NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione3.248 |
|
EPROM | EPROM - OTP | 512Kb (64K x 8) | Parallel | - | - | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 125°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Cypress Semiconductor Corp |
IC SRAM 4MBIT 15NS 44SOJ
|
pacchetto: 44-BSOJ (0.400", 10.16mm Width) |
Azione20.508 |
|
SRAM | SRAM - Asynchronous | 4Mb (256K x 16) | Parallel | - | 15ns | 15ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 44-BSOJ (0.400", 10.16mm Width) | 44-SOJ |
||
Microchip Technology |
IC OTP 4MBIT 150NS 32VSOP
|
pacchetto: 32-TFSOP (0.488", 12.40mm Width) |
Azione6.432 |
|
EPROM | EPROM - OTP | 4Mb (512K x 8) | Parallel | - | - | 150ns | 2.7 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.488", 12.40mm Width) | 32-VSOP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 64KBIT 20NS 28SOJ
|
pacchetto: 28-BSOJ (0.300", 7.62mm Width) |
Azione7.744 |
|
SRAM | SRAM - Asynchronous | 64Kb (8K x 8) | Parallel | - | 20ns | 20ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 28-BSOJ (0.300", 7.62mm Width) | 28-SOJ |
||
Winbond Electronics |
IC SDRAM 2GBIT 667MHZ 96BGA
|
pacchetto: 96-TFBGA |
Azione2.100 |
|
DRAM | SDRAM - DDR3L | 2Gb (128M x 16) | Parallel | 667MHz | - | 20ns | 1.283 V ~ 1.45 V | 0°C ~ 95°C (TC) | Surface Mount | 96-TFBGA | 96-WBGA (9x13) |
||
ISSI, Integrated Silicon Solution Inc |
IC SRAM 1MBIT 12NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione110.220 |
|
SRAM | SRAM - Asynchronous | 1Mb (128K x 8) | Parallel | - | 12ns | 12ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP I |
||
Cypress Semiconductor Corp |
IC SRAM 4.5MBIT 133MHZ 100LQFP
|
pacchetto: 100-LQFP |
Azione5.584 |
|
SRAM | SRAM - Synchronous | 4.5Mb (128K x 36) | Parallel | 133MHz | - | 4ns | 3.15 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Microchip Technology |
IC EEPROM 8KBIT 400KHZ 8TDFN
|
pacchetto: 8-WFDFN Exposed Pad |
Azione4.816 |
|
EEPROM | EEPROM | 8Kb (256 x 8 x 4) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Rohm Semiconductor |
IC EEPROM 8KBIT 400KHZ 8SOP-J
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione25.572 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | I2C | 400kHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP-J |
||
IDT, Integrated Device Technology Inc |
IC SRAM 1MBIT 20NS 32SOJ
|
pacchetto: 32-BSOJ (0.400", 10.16mm Width) |
Azione16.476 |
|
SRAM | SRAM - Asynchronous | 1Mb (128K x 8) | Parallel | - | 20ns | 20ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 32-BSOJ (0.400", 10.16mm Width) | 32-SOJ |
||
Micron Technology Inc. |
IC DRAM 4G PARALLEL 533MHZ
|
pacchetto: - |
Azione4.896 |
|
DRAM | SDRAM - Mobile LPDDR2 | 4Gb (64M x 64) | Parallel | 533MHz | - | - | 1.14 V ~ 1.95 V | -40°C ~ 85°C (TC) | - | - | - |
||
Micron Technology Inc. |
IC DRAM LPDDR4 WFBGA
|
pacchetto: - |
Azione3.520 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Winbond Electronics |
IC SDRAM 2G DDR3 96WFBGA
|
pacchetto: 96-VFBGA |
Azione7.744 |
|
DRAM | SDRAM - DDR3L | 2Gb (128M x 16) | Parallel | 800MHz | 15ns | 20ns | 1.283V ~ 1.45V | -40°C ~ 95°C (TC) | Surface Mount | 96-VFBGA | 96-VFBGA (7.5x13) |
||
ProLabs |
Cisco MEM-CF-256U2GB Compatible
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC SRAM 4MBIT PAR 100TQFP
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Synchronous, ZBT | 4Mbit | Parallel | 100 MHz | - | 5 ns | 3.135V ~ 3.6V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x20.1) |
||
Kaga FEI America, Inc. |
IC RAM 8MBIT SPI TYPE A 11WLCSP
|
pacchetto: - |
Request a Quote |
|
RAM | ReRAM (Resistive RAM) | 8Mbit | SPI | 10 MHz | 10ms | 35 ns | 1.6V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 11-XFBGA, WLBGA | 11-WLP (2.07x2.88) |
||
Fujitsu Semiconductor Memory Solution |
64KBIT FRAM WITH SPI SERIAL INTE
|
pacchetto: - |
Request a Quote |
|
FRAM | FRAM (Ferroelectric RAM) | 64Kbit | SPI | 20 MHz | - | 20 ns | 3V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Micron Technology Inc. |
IC FLASH 1TBIT PARALLEL 132VBGA
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NAND | 1Tbit | Parallel | 333 MHz | - | - | 2.5V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 132-VBGA | 132-VBGA (12x18) |