Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cypress Semiconductor Corp |
IC SRAM 64KBIT 15NS DIE
|
pacchetto: Die |
Azione3.696 |
|
SRAM | SRAM - Asynchronous | 64Kb (8K x 8) | Parallel | - | 15ns | 15ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Micron Technology Inc. |
IC FLASH/LPDRAM 3GBIT 130VFBGA
|
pacchetto: 130-VFBGA |
Azione3.952 |
|
FLASH, RAM | FLASH - NAND, Mobile LPDRAM | 2Gb (256M x 8)(NAND), 1Gb (64M x 16)(LPDRAM) | Parallel | 200MHz | - | - | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 130-VFBGA | 130-VFBGA (8x9) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 256KBIT 10NS 28SOJ
|
pacchetto: 28-BSOJ (0.300", 7.62mm Width) |
Azione15.804 |
|
SRAM | SRAM - Asynchronous | 256Kb (32K x 8) | Parallel | - | 10ns | 10ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 28-BSOJ (0.300", 7.62mm Width) | 28-SOJ |
||
Winbond Electronics |
IC FLASH 16MBIT 75MHZ 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione6.768 |
|
FLASH | FLASH | 16Mb (2M x 8) | SPI | 75MHz | 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Cypress Semiconductor Corp |
IC SRAM 1MBIT 12NS 44TSOP
|
pacchetto: 44-TSOP (0.400", 10.16mm Width) |
Azione19.728 |
|
SRAM | SRAM - Asynchronous | 1Mb (64K x 16) | Parallel | - | 12ns | 12ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
Microchip Technology |
IC FLASH 2MBIT 250NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione4.032 |
|
FLASH | FLASH | 2Mb (256K x 8) | Parallel | - | 20ms | 250ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
IDT, Integrated Device Technology Inc |
IC SRAM 512KBIT 12NS 100TQFP
|
pacchetto: 100-LQFP |
Azione7.664 |
|
SRAM | SRAM - Dual Port, Synchronous | 512Kb (64K x 8) | Parallel | - | - | 12ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 64KBIT 25NS 64TQFP
|
pacchetto: 64-LQFP |
Azione3.824 |
|
SRAM | SRAM - Dual Port, Asynchronous | 64Kb (8K x 8) | Parallel | - | 25ns | 25ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 64-LQFP | 64-TQFP (14x14) |
||
Cypress Semiconductor Corp |
NAND
|
pacchetto: - |
Azione3.024 |
|
FLASH | FLASH - NAND | 8Gb (1G x 8) | Parallel | - | 25ns | - | 2.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | - | - | - |
||
Micron Technology Inc. |
IC SDRAM 1GBIT 200MHZ 90VFBGA
|
pacchetto: 90-VFBGA |
Azione5.184 |
|
DRAM | SDRAM - Mobile LPDDR | 1Gb (32M x 32) | Parallel | 200MHz | 15ns | 5.0ns | 1.7 V ~ 1.95 V | -40°C ~ 105°C (TA) | Surface Mount | 90-VFBGA | 90-VFBGA (8x13) |
||
Micron Technology Inc. |
IC FLASH 512MBIT 108MHZ 8WDFN
|
pacchetto: 8-WDFN Exposed Pad |
Azione7.152 |
|
FLASH | FLASH - NOR | 512Mb (64M x 8) | SPI | 133MHz | 8ms, 2.8ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WPDFN (6x8) (MLP8) |
||
Macronix |
IC FLASH 128MBIT 110NS 56FBGA
|
pacchetto: 56-TFBGA, CSPBGA |
Azione7.632 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8) | Parallel | - | 110ns | 110ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 56-TFBGA, CSPBGA | 56-FBGA, CSP (7x9) |
||
Microchip Technology |
IC FLASH 16MBIT 70NS 48TFBGA
|
pacchetto: 48-TFBGA |
Azione7.312 |
|
FLASH | FLASH | 16Mb (1M x 16) | Parallel | - | 10µs | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA (6x8) |
||
Winbond Electronics |
IC FLASH 64MBIT SPI 24TBGA
|
pacchetto: 24-TBGA |
Azione3.728 |
|
FLASH | FLASH - NOR | 64Mb (8M x 8) | SPI | 133MHz | 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-TFBGA (6x8) |
||
Microchip Technology |
IC EEPROM 8KBIT 3MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione6.704 |
|
EEPROM | EEPROM | 8Kb (1K x 8, 512 x 16) | SPI | 3MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 2KBIT 3MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione7.104 |
|
EEPROM | EEPROM | 2Kb (256 x 8, 128 x 16) | SPI | 3MHz | 6ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
STMicroelectronics |
IC EEPROM 256KBIT 10MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione5.664 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 10MHz | 4ms | - | 2.5 V ~ 5.5 V | -40°C ~ 145°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Rohm Semiconductor |
IC EEPROM 4KBIT 400KHZ 8SOP-J
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione26.328 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | I2C | 400kHz | 5ms | - | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP-J |
||
ON Semiconductor |
IC EEPROM 2K SPI 1MHZ 8SO
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.168 |
|
EEPROM | EEPROM | 2Kb (128 x 16) | SPI | 1MHz | 10ms | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SO |
||
Cypress Semiconductor Corp |
IC FLASH 32M PARALLEL 64BGA
|
pacchetto: 64-LBGA |
Azione7.200 |
|
FLASH | FLASH - NOR | 32Mb (4M x 8, 2M x 16) | Parallel | - | 110ns | 110ns | 1.65 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 64-LBGA | 64-FBGA (13x11) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 512K PARALLEL 100TQFP
|
pacchetto: 100-LQFP |
Azione2.992 |
|
SRAM | SRAM - Dual Port, Asynchronous | 512Kb (32K x 16) | Parallel | - | 15ns | 15ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Micron Technology Inc. |
LPDDR5 128G 4GX32 FBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR5 | 128Gbit | Parallel | 4.266 GHz | - | - | - | -40°C ~ 105°C | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC SRAM 1MBIT PARALLEL 100TQFP
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Synchronous, SDR | 1Mbit | Parallel | - | - | 7 ns | 3.135V ~ 3.63V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Winbond Electronics |
IC DRAM 1GBIT PAR 78VFBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - DDR3L | 1Gbit | Parallel | 667 MHz | 15ns | 20 ns | 1.283V ~ 1.45V, 1.425V ~ 1.575V | 0°C ~ 95°C (TC) | Surface Mount | 78-VFBGA | 78-VFBGA (8x10.5) |
||
Advanced Micro Devices |
IC PROM 8KBIT PARALLEL 32CLCC
|
pacchetto: - |
Request a Quote |
|
PROM | - | 8Kbit | Parallel | - | - | 50 ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-CLCC |
||
Silicon Motion, Inc. |
IC FLASH 640GBIT EMMC 100BGA
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NAND (SLC) | 640Gbit | eMMC | - | - | - | - | -40°C ~ 105°C | Surface Mount | 100-LBGA | 100-BGA (14x18) |
||
Micron Technology Inc. |
MASSFLASH/LPDDR4 16G
|
pacchetto: - |
Request a Quote |
|
FLASH, RAM | FLASH - NAND (SLC), DRAM - LPDDR4 | 8Gbit | ONFI | - | 30ns | 25 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 149-VFBGA | 149-VFBGA (8x9.5) |
||
Renesas Electronics Corporation |
IC FLASH 8MBIT SPI/QUAD 8UDFN
|
pacchetto: - |
Azione17.265 |
|
FLASH | FLASH - NOR | 8Mbit | SPI - Quad I/O | 133 MHz | 22µs, 6.5ms | - | 1.65V ~ 3.6V | -40°C ~ 85°C (TC) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |