Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Alliance Memory, Inc. |
IC SDRAM 64MBIT 200MHZ 66TSOP
|
pacchetto: 66-TSSOP (0.400", 10.16mm Width) |
Azione4.496 |
|
DRAM | SDRAM - DDR | 64Mb (4M x 16) | Parallel | 200MHz | 15ns | 700ps | 2.3 V ~ 2.7 V | -40°C ~ 85°C (TA) | Surface Mount | 66-TSSOP (0.400", 10.16mm Width) | 66-TSOP II |
||
Cypress Semiconductor Corp |
IC FLASH 512MBIT 100NS 56TSOP
|
pacchetto: 56-TFSOP (0.724", 18.40mm Width) |
Azione17.904 |
|
FLASH | FLASH - NOR | 512Mb (32M x 16) | Parallel | - | 100ns | 100ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 56-TFSOP (0.724", 18.40mm Width) | 56-TSOP |
||
Micron Technology Inc. |
IC FLASH 32GBIT 83MHZ 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione6.672 |
|
FLASH | FLASH - NAND | 32Gb (4G x 8) | Parallel | 83MHz | - | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP I |
||
Micron Technology Inc. |
IC SDRAM 512MBIT 133MHZ 54TSOP
|
pacchetto: 54-TSOP (0.400", 10.16mm Width) |
Azione2.496 |
|
DRAM | SDRAM | 512Mb (128M x 4) | Parallel | 133MHz | 15ns | 5.4ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 512MBIT 143MHZ 90BGA
|
pacchetto: 90-LFBGA |
Azione5.376 |
|
DRAM | SDRAM | 512Mb (16M x 32) | Parallel | 143MHz | - | 5.4ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 90-LFBGA | 90-LFBGA (13x11) |
||
Microchip Technology |
IC FLASH 2MBIT 70NS 32DIP
|
pacchetto: 32-DIP (0.600", 15.24mm) |
Azione3.744 |
|
FLASH | FLASH | 2Mb (256K x 8) | Parallel | - | 50µs | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC FLASH 16MBIT 70NS 48CBGA
|
pacchetto: 48-TFBGA, CSPBGA |
Azione5.376 |
|
FLASH | FLASH | 16Mb (2M x 8, 1M x 16) | Parallel | - | 50µs | 70ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 48-TFBGA, CSPBGA | 48-CBGA (6x8) |
||
Microchip Technology |
IC FLASH 512KBIT 90NS 32DIP
|
pacchetto: 32-DIP (0.600", 15.24mm) |
Azione108.624 |
|
FLASH | FLASH | 512Kb (64K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 512KBIT 7.5NS 128TQFP
|
pacchetto: 128-LQFP |
Azione3.888 |
|
SRAM | SRAM - Dual Port, Synchronous | 512Kb (32K x 16) | Parallel | - | - | 7.5ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 128-LQFP | 128-TQFP (14x20) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 128KBIT 17NS 68PLCC
|
pacchetto: 68-LCC (J-Lead) |
Azione7.552 |
|
SRAM | SRAM - Dual Port, Asynchronous | 128Kb (16K x 8) | Parallel | - | 17ns | 17ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 68-LCC (J-Lead) | 68-PLCC (24.21x24.21) |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 512MBIT 143MHZ 54TSOP
|
pacchetto: 54-TSOP (0.400", 10.16mm Width) |
Azione2.256 |
|
DRAM | SDRAM | 512Mb (32M x 16) | Parallel | 143MHz | - | 5.4ns | 3 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4.5MBIT 200MHZ 100TQFP
|
pacchetto: 100-LQFP |
Azione4.944 |
|
SRAM | SRAM - Synchronous | 4.5Mb (128K x 36) | Parallel | 200MHz | - | 3.1ns | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 256MBIT 143MHZ 54TSOP
|
pacchetto: 54-TSOP (0.400", 10.16mm Width) |
Azione5.104 |
|
DRAM | SDRAM | 256Mb (32M x 8) | Parallel | 143MHz | - | 5.4ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
||
Microchip Technology |
IC EEPROM 2MBIT 5MHZ 12WLCSP
|
pacchetto: - |
Azione6.208 |
|
EEPROM | EEPROM | 2Mb (256K x 8) | SPI | 5MHz | 10ms | - | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TC) | - | - | - |
||
Winbond Electronics |
IC FLASH 256MBIT 90NS 56TSOP
|
pacchetto: 56-TFSOP (0.724", 18.40mm Width) |
Azione3.840 |
|
FLASH | FLASH - NOR | 256Mb (16M x 16) | Parallel | - | 90ns | 90ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 56-TFSOP (0.724", 18.40mm Width) | 56-TSOP (14x20) |
||
Alliance Memory, Inc. |
IC SRAM 1MBIT 15NS 44SOJ
|
pacchetto: 44-BSOJ (0.400", 10.16mm Width) |
Azione3.376 |
|
SRAM | SRAM - Asynchronous | 1Mb (64K x 16) | Parallel | - | 15ns | 15ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 44-BSOJ (0.400", 10.16mm Width) | 44-SOJ |
||
Microchip Technology |
IC EEPROM 2KBIT 400KHZ SOT23-5
|
pacchetto: SC-74A, SOT-753 |
Azione5.712 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | SC-74A, SOT-753 | SOT-23-5 |
||
Alliance Memory, Inc. |
IC SRAM 256KBIT 12NS 28SOJ
|
pacchetto: 28-BSOJ (0.300", 7.62mm Width) |
Azione15.204 |
|
SRAM | SRAM - Asynchronous | 256Kb (32K x 8) | Parallel | - | 12ns | 12ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 28-BSOJ (0.300", 7.62mm Width) | 28-SOJ |
||
Rohm Semiconductor |
IC EEPROM 16KBIT 400KHZ 35UCSP
|
pacchetto: 6-XFBGA, CSPBGA |
Azione23.742 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I2C | 400kHz | 5ms | - | 1.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 6-XFBGA, CSPBGA | UCSP35L1 |
||
Winbond Electronics |
IC FLASH 2GBIT 25NS 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione4.240 |
|
FLASH | FLASH - NAND (SLC) | 2Gb (256M x 8) | Parallel | - | 25ns | 25ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Cypress Semiconductor Corp |
IC FLASH 16M PARALLEL 48FBGA
|
pacchetto: 48-VFBGA |
Azione656.856 |
|
FLASH | FLASH - NOR | 16Mb (2M x 8, 1M x 16) | Parallel | - | 70ns | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 48-VFBGA | 48-FBGA (8.15x6.15) |
||
Cypress Semiconductor Corp |
IC FLASH 64M PARALLEL 64BGA
|
pacchetto: 64-LBGA |
Azione5.856 |
|
FLASH | FLASH - NOR | 64Mb (8M x 8, 4M x 16) | Parallel | - | 90ns | 90ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 64-LBGA | 64-FBGA (13x11) |
||
Cypress Semiconductor Corp |
IC FLASH 64M PARALLEL 64BGA
|
pacchetto: 64-LBGA |
Azione3.440 |
|
FLASH | FLASH - NOR | 64Mb (8M x 8, 4M x 16) | Parallel | - | 90ns | 90ns | 2.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 64-LBGA | 64-FBGA (9x9) |
||
Micron Technology Inc. |
IC FLASH MLC 64G DIE 8GX8
|
pacchetto: - |
Azione5.184 |
|
FLASH | FLASH - NAND (MLC) | 64Gb (8G x 8) | Parallel | - | - | - | 2.7V ~ 3.6V | 0°C ~ 70°C (TA) | - | - | - |
||
Galvantech |
IC SRAM 4MBIT 66MHZ
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM | 4Mbit | - | 66 MHz | - | 7 ns | 3.3V | 0°C ~ 70°C | Surface Mount | 100-TQFP | - |
||
Winbond Electronics |
IC FLASH 2MBIT SPI/QUAD 8XSON
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 2Mbit | SPI - Quad I/O | 104 MHz | - | - | 1.65V ~ 1.95V | -40°C ~ 125°C (TA) | Surface Mount | 8-XFDFN Exposed Pad | 8-XSON (2x3) |
||
Infineon Technologies |
IC FLASH MEM NOR
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Swissbit |
IC FLASH 512GBIT EMMC 100BGA
|
pacchetto: - |
Azione12 |
|
FLASH | FLASH - NAND (TLC) | 512Gbit | eMMC | 200 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 85°C | Surface Mount | 100-LBGA | 100-BGA (14x18) |