Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Micron Technology Inc. |
IC SDRAM 8GBIT 800MHZ 78FBGA
|
pacchetto: 78-TFBGA |
Azione4.384 |
|
DRAM | SDRAM - DDR3L | 8Gb (1G x 8) | Parallel | 800MHz | - | 13.5ns | 1.283 V ~ 1.45 V | -40°C ~ 95°C (TC) | Surface Mount | 78-TFBGA | 78-FBGA (9.5x11.5) |
||
Cypress Semiconductor Corp |
IC SRAM 72MBIT 550MHZ 165FBGA
|
pacchetto: 165-LBGA |
Azione7.264 |
|
SRAM | SRAM - Synchronous, QDR II+ | 72Mb (2M x 36) | Parallel | 550MHz | - | - | 1.7 V ~ 1.9 V | 0°C ~ 70°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (13x15) |
||
Micron Technology Inc. |
IC FLASH 32MBIT 70NS 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione85.116 |
|
FLASH | FLASH - NOR | 32Mb (4M x 8, 2M x 16) | Parallel | - | 70ns | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Cypress Semiconductor Corp |
IC SRAM 18MBIT 250MHZ 100TQFP
|
pacchetto: 100-LQFP |
Azione6.032 |
|
SRAM | SRAM - Synchronous | 18Mb (512K x 36) | Parallel | 250MHz | - | 2.6ns | 2.375 V ~ 2.625 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x20) |
||
STMicroelectronics |
IC OTP 8MBIT 55NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione19.944 |
|
EPROM | EPROM - OTP | 8Mb (1M x 8) | Parallel | - | - | 55ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.35x13.89) |
||
Microchip Technology |
IC OTP 8MBIT 90NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione7.296 |
|
EPROM | EPROM - OTP | 8Mb (1M x 8) | Parallel | - | - | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC EEPROM 256KBIT 90NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione2.864 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 125°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 8KBIT 400KHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione9.480 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | I2C | 400kHz | 5ms | 4.5µs | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC SRAM 128KBIT 35NS 84PGA
|
pacchetto: 84-BPGA |
Azione3.744 |
|
SRAM | SRAM - Dual Port, Asynchronous | 128Kb (8K x 16) | Parallel | - | 35ns | 35ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TA) | Through Hole | 84-BPGA | 84-PGA (27.94x27.94) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 512KBIT 55NS 84PLCC
|
pacchetto: 84-LCC (J-Lead) |
Azione3.440 |
|
SRAM | SRAM - Dual Port, Asynchronous | 512Kb (64K x 8) | Parallel | - | 55ns | 55ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 84-LCC (J-Lead) | 84-PLCC (29.21x29.21) |
||
Cypress Semiconductor Corp |
IC SRAM 36MBIT 333MHZ 165FBGA
|
pacchetto: 165-LBGA |
Azione5.648 |
|
SRAM | SRAM - Synchronous, QDR II | 36Mb (2M x 18) | Parallel | 333MHz | - | - | 1.7 V ~ 1.9 V | 0°C ~ 70°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (13x15) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 18MBIT 150MHZ 100TQFP
|
pacchetto: 100-LQFP |
Azione2.256 |
|
SRAM | SRAM - Synchronous ZBT | 18Mb (512K x 36) | Parallel | 150MHz | - | 3.8ns | 2.375 V ~ 2.625 V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 128KBIT 35NS 68PLCC
|
pacchetto: 68-LCC (J-Lead) |
Azione3.456 |
|
SRAM | SRAM - Dual Port, Asynchronous | 128Kb (16K x 8) | Parallel | - | 35ns | 35ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 68-LCC (J-Lead) | 68-PLCC (24.21x24.21) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4.5MBIT 166MHZ 165CABGA
|
pacchetto: 165-TBGA |
Azione6.672 |
|
SRAM | SRAM - Synchronous | 4.5Mb (128K x 36) | Parallel | 166MHz | - | 3.5ns | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 165-TBGA | 165-CABGA (13x15) |
||
Cypress Semiconductor Corp |
IC FLASH NOR 133MCP
|
pacchetto: - |
Azione6.336 |
|
FLASH, RAM | FLASH, DRAM | 256Mbit Flash, 2565Mbit DDR DRAM | Parallel | 108MHz | - | - | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC SRAM 2MBIT 6NS 100TQFP
|
pacchetto: 100-LQFP |
Azione2.560 |
|
SRAM | SRAM - Synchronous | 2Mb (64K x 32) | Parallel | 83MHz | - | 6ns | 3.135 V ~ 3.63 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Adesto Technologies |
IC FLASH 256KBIT 85MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.344 |
|
FLASH | FLASH | 256Kb (32K x 8) | SPI | 104MHz | 8µs, 1.75ms | - | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Cypress Semiconductor Corp |
IC FLASH 128MBIT 133MHZ 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione5.664 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8) | SPI - Quad I/O | 133MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Microchip Technology |
IC EERAM 4KBIT 1MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione19.380 |
|
EERAM | EEPROM, SRAM | 4Kb (512 x 8) | I2C | 1MHz | 1ms | 400ns | 4.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-DIP |
||
Everspin Technologies Inc. |
IC MRAM 1MBIT 40MHZ 8DFN
|
pacchetto: 8-TDFN Exposed Pad |
Azione22.104 |
|
RAM | MRAM (Magnetoresistive RAM) | 1Mb (128K x 8) | SPI | 40MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 8-TDFN Exposed Pad | 8-DFN-EP, Large Flag (5x6) |
||
Fremont Micro Devices USA |
IC EEPROM 64KBIT 1MHZ 8SOP
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione41.418 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I2C | 800kHz | 5ms | 700ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
ON Semiconductor |
IC EEPROM 8K I2C 100KHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione7.488 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | I²C | 100kHz | 10ms | 3.5µs | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-DIP |
||
Micron Technology Inc. |
IC FLASH 512G MMC
|
pacchetto: - |
Azione6.400 |
|
FLASH | FLASH - NAND | 512Gb (64G x 8) | MMC | - | - | - | - | -40°C ~ 105°C (TA) | - | - | - |
||
Micron Technology Inc. |
SLC EMMC/LPDDR2 36G
|
pacchetto: - |
Azione2.096 |
|
- | - | - | - | - | - | - | - | - | Surface Mount | - | - |
||
Micron Technology Inc. |
IC FLASH 256M SPI 24TPBGA
|
pacchetto: 24-TBGA |
Azione6.512 |
|
FLASH | FLASH - NOR | 256Mb (32M x 8) | SPI | 133MHz | 8ms, 2.8ms | - | 2.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 24-TBGA | 24-T-PBGA (6x8) |
||
Micron Technology Inc. |
IC DRAM LPDDR4 WFBGA
|
pacchetto: - |
Azione7.680 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
MoSys, Inc. |
IC MEMORY BW BURST 0.5GB FCBGA
|
pacchetto: - |
Request a Quote |
|
RAM | SRAM, RLDRAM | 576Mbit | Parallel | - | - | 3.2 ns | - | - | Surface Mount | 288-BGA, FCBGA | 288-FCBGA (19x19) |
||
Fairchild Semiconductor |
IC EEPROM 64KBIT I2C 8SOIC
|
pacchetto: - |
Request a Quote |
|
EEPROM | EEPROM | 64Kbit | I2C | 100 kHz | 6ms | 3.5 µs | 4.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |