Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Micron Technology Inc. |
IC FLASH 32GBIT 153WFBGA
|
pacchetto: - |
Azione2.560 |
|
FLASH | FLASH - NAND | 64Gb (8G x 8) | MMC | - | - | - | 2.7 V ~ 3.6 V | -25°C ~ 85°C (TA) | - | - | - |
||
Adesto Technologies |
IC FLASH 32MBIT 66MHZ 8VDFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione4.448 |
|
FLASH | FLASH | 32Mb (528 Bytes x 8192 pages) | SPI | 66MHz | 6ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-VDFN Exposed Pad | 8-VDFN (6x5) |
||
Micron Technology Inc. |
IC FLASH 2GBIT 100NS 64FBGA
|
pacchetto: 64-LBGA |
Azione6.288 |
|
FLASH | FLASH - NOR | 2Gb (256M x 8, 128M x 16) | Parallel | - | 100ns | 100ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 64-LBGA | 64-FBGA (11x13) |
||
Micron Technology Inc. |
IC SDRAM 512MBIT 400MHZ 84FBGA
|
pacchetto: 84-TFBGA |
Azione64.824 |
|
DRAM | SDRAM - DDR2 | 512Mb (32M x 16) | Parallel | 400MHz | 15ns | 400ps | 1.7 V ~ 1.9 V | -40°C ~ 95°C (TC) | Surface Mount | 84-TFBGA | 84-FBGA (8x12.5) |
||
Cypress Semiconductor Corp |
IC SRAM 18MBIT 200MHZ 256FBGA
|
pacchetto: 256-LBGA |
Azione2.384 |
|
SRAM | SRAM - Dual Port, Synchronous | 18Mb (256K x 36 x 2, 256K x 72) | Parallel | 200MHz | - | 500ps | 1.42 V ~ 1.58 V, 1.7 V ~ 1.9 V | 0°C ~ 70°C (TA) | Surface Mount | 256-LBGA | 256-FBGA (17x17) |
||
Micron Technology Inc. |
IC SDRAM 256MBIT 100MHZ 90VFBGA
|
pacchetto: 90-VFBGA |
Azione5.392 |
|
DRAM | SDRAM - Mobile LPSDR | 256Mb (8M x 32) | Parallel | 100MHz | 15ns | 7ns | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 90-VFBGA | 90-VFBGA (8x13) |
||
Microchip Technology |
IC EEPROM 1MBIT 120NS 32FLATPACK
|
pacchetto: 32-CFlatpack |
Azione5.328 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed |
||
Micron Technology Inc. |
IC SDRAM 32GBIT 933MHZ FBGA
|
pacchetto: - |
Azione5.952 |
|
DRAM | SDRAM - Mobile LPDDR3 | 32Gb (512M x 64) | - | 933MHz | - | - | 1.2V | -30°C ~ 85°C (TC) | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC SRAM 18MBIT 7.5NS 119BGA
|
pacchetto: 119-BGA |
Azione3.424 |
|
SRAM | SRAM - Synchronous ZBT | 18Mb (1M x 18) | Parallel | - | - | 7.5ns | 2.375 V ~ 2.625 V | 0°C ~ 70°C (TA) | Surface Mount | 119-BGA | 119-PBGA (14x22) |
||
Micron Technology Inc. |
IC SDRAM 2GBIT 400MHZ 60FBGA
|
pacchetto: 60-TFBGA |
Azione2.352 |
|
DRAM | SDRAM - DDR2 | 2Gb (256M x 8) | Parallel | 400MHz | 15ns | 400ps | 1.7 V ~ 1.9 V | -40°C ~ 95°C (TC) | Surface Mount | 60-TFBGA | 60-FBGA (9x11.5) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 8KBIT 35NS 64TQFP
|
pacchetto: 64-LQFP |
Azione4.864 |
|
SRAM | SRAM - Dual Port, Asynchronous | 8Kb (1K x 8) | Parallel | - | 35ns | 35ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 64-LQFP | 64-TQFP (10x10) |
||
Micron Technology Inc. |
IC SDRAM 2GBIT 533MHZ 134VFBGA
|
pacchetto: 134-VFBGA |
Azione5.904 |
|
DRAM | SDRAM - Mobile LPDDR2 | 2Gb (64M x 32) | Parallel | 533MHz | - | - | 1.14 V ~ 1.95 V | -40°C ~ 105°C (TC) | Surface Mount | 134-VFBGA | 134-VFBGA (10x11.5) |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 256MBIT 166MHZ 86TSOP
|
pacchetto: 86-TFSOP (0.400", 10.16mm Width) |
Azione7.920 |
|
DRAM | SDRAM | 256Mb (8M x 32) | Parallel | 166MHz | - | 5.4ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 86-TFSOP (0.400", 10.16mm Width) | 86-TSOP II |
||
Micron Technology Inc. |
IC FLASH 128MBIT 70NS 56TSOP
|
pacchetto: 56-TFSOP (0.724", 18.40mm Width) |
Azione2.128 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8, 8M x 16) | Parallel | - | 70ns | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 56-TFSOP (0.724", 18.40mm Width) | 56-TSOP |
||
Cypress Semiconductor Corp |
IC FLASH 64MBIT 80MHZ 24BGA
|
pacchetto: 24-TBGA |
Azione4.848 |
|
FLASH | FLASH - NOR | 64Mb (8M x 8) | SPI - Quad I/O | 80MHz | - | - | 1.7 V ~ 2 V | -40°C ~ 105°C (TA) | Surface Mount | 24-TBGA | 24-FBGA (6x8) |
||
Macronix |
IC FLASH 64MBIT 104MHZ 8WSON
|
pacchetto: 8-WDFN Exposed Pad |
Azione4.640 |
|
FLASH | FLASH - NOR | 64Mb (8M x 8) | SPI | 104MHz | 300µs, 5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
ON Semiconductor |
IC EEPROM 128KBIT 400KHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione512.436 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I2C | 1MHz | 5ms | 400ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 256KBIT 10MHZ 8SOIJ
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione8.604 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 10MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIJ |
||
Microchip Technology |
IC EEPROM 8KBIT 1MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione2.310.540 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | I2C | 1MHz | 5ms | 550ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 64KBIT 400KHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione26.208 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 6.0 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Rohm Semiconductor |
IC EEPROM 32KBIT 1MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione41.880 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I2C | 1MHz | 5ms | - | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP-B |
||
Microchip Technology |
IC EEPROM 16K SPI 10MHZ WAFER
|
pacchetto: Die |
Azione4.192 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 10MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Cypress Semiconductor Corp |
IC FLASH 512M SPI 133MHZ 24BGA
|
pacchetto: 24-TBGA |
Azione6.464 |
|
FLASH | FLASH - NOR | 512Mb (64M x 8) | SPI - Quad I/O | 133MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 24-TBGA | 24-BGA (6x8) |
||
Renesas Electronics America |
IC SRAM 256KBIT 55NS 28TSOP
|
pacchetto: 28-TSSOP (0.465", 11.80mm Width) |
Azione6.960 |
|
SRAM | SRAM | 256Kb (32K x 8) | Parallel | - | 55ns | 55ns | 4.5V ~ 5.5V | 0°C ~ 70°C (TA) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
GSI Technology Inc. |
IC SRAM 72MBIT PARALLEL 165FPBGA
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Quad Port, Synchronous, DDR II | 72Mbit | Parallel | 400 MHz | - | - | 1.7V ~ 1.9V | -40°C ~ 100°C (TJ) | Surface Mount | 165-LBGA | 165-FPBGA (13x15) |
||
GSI Technology Inc. |
IC SRAM 36MBIT PARALLEL 165FPBGA
|
pacchetto: - |
Azione54 |
|
SRAM | SRAM - Synchronous, ZBT | 36Mbit | Parallel | 333 MHz | - | - | 2.3V ~ 2.7V, 3V ~ 3.6V | -40°C ~ 100°C (TJ) | Surface Mount | 165-LBGA | 165-FPBGA (13x15) |
||
Infineon Technologies |
IC FLASH 128MBIT PARALLEL 64FBGA
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 128Mbit | Parallel | - | 60ns | 110 ns | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 64-LBGA | 64-FBGA (13x11) |
||
Intel |
DUAL MARKED (5962-8670512RA)
|
pacchetto: - |
Request a Quote |
|
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