Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Supply Voltage | Number of Bits | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|
IDT, Integrated Device Technology Inc |
IC REGIST BUFF 28BIT DDR2 96-BGA
|
pacchetto: 96-LFBGA |
Azione7.504 |
|
1.7 V ~ 1.9 V | 28 | 0°C ~ 70°C | Surface Mount | 96-LFBGA | 96-CABGA (13.5x5.5) |
||
IDT, Integrated Device Technology Inc |
IC BUFFER 13-26BIT SSTL 56VFQFPN
|
pacchetto: 56-VFQFN Exposed Pad |
Azione7.520 |
|
2.3 V ~ 2.7 V | 13, 26 | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-VFQFPN (8x8) |
||
IDT, Integrated Device Technology Inc |
IC BUFFER 28BIT 1:2 REG 160TFBGA
|
pacchetto: 160-LFBGA |
Azione7.696 |
|
1.7 V ~ 1.9 V | 28 | 0°C ~ 70°C | Surface Mount | 160-LFBGA | 160-CABGA (9x13) |
||
IDT, Integrated Device Technology Inc |
IC BUFFER 1:1/1:2 96-LFBGA
|
pacchetto: 96-LFBGA |
Azione7.952 |
|
1.7 V ~ 1.9 V | 25, 14 | 0°C ~ 70°C | Surface Mount | 96-LFBGA | 96-CABGA (13.5x5.5) |
||
ON Semiconductor |
IC DRIVER/RCVR DUAL BUS 20-DIP
|
pacchetto: 20-DIP (0.300", 7.62mm) |
Azione4.000 |
|
- | 2 | 0°C ~ 75°C | Through Hole | 20-DIP (0.300", 7.62mm) | 20-PDIP |
||
NXP |
IC REG BUFFER 26BIT 56HVQFN
|
pacchetto: 56-VFQFN Exposed Pad |
Azione4.272 |
|
2.3 V ~ 2.7 V | 13, 26 | 0°C ~ 70°C | Surface Mount | 56-VFQFN Exposed Pad | 56-HVQFN |
||
NXP |
IC BUFFER 1.8V 28BIT SOT802
|
pacchetto: 160-TFBGA |
Azione4.224 |
|
1.7 V ~ 1.9 V | 28 | 0°C ~ 70°C | Surface Mount | 160-TFBGA | 160-TFBGA (9x13) |
||
Microchip Technology |
IC RCVR DIFF 5V/3.3V 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.056 |
|
3.3V, 5V | 1 | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Fairchild/ON Semiconductor |
TXRX TRANSLATING IEEE 48TSSOP
|
pacchetto: 48-TFSOP (0.240", 6.10mm Width) |
Azione53.952 |
|
3 V ~ 3.6 V | 8 | -40°C ~ 85°C | Surface Mount | 48-TFSOP (0.240", 6.10mm Width) | 48-TSSOP |
||
ON Semiconductor |
IC RCVR/DRVR ECL DIFF 5V 8TSSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione5.888 |
|
3 V ~ 5.5 V | 1 | -40°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-TSSOP |
||
Texas Instruments |
IC 25BIT CONFIG REG BUFF 96-BGA
|
pacchetto: 96-LFBGA |
Azione5.040 |
|
1.7 V ~ 1.9 V | 25, 14 | 0°C ~ 70°C | Surface Mount | 96-LFBGA | 96-PBGA MICROSTAR (13.6x5.6) |
||
ON Semiconductor |
IC RCVR/DRV ECL QUAD DFF 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione6.208 |
|
3 V ~ 5.5 V | 4 | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Fairchild/ON Semiconductor |
IC TRANSCEIVER IEEE1284 20-SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione4.080 |
|
4.5 V ~ 5.5 V | 7 | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
NXP |
IC ARBITER BUS 5.5V 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione2.336 |
|
4.5 V ~ 5.5 V | 4 | 0°C ~ 70°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SO |
||
Microchip Technology |
IC RCVR DIFF 3.3/5V 8-MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione30.000 |
|
3.3V, 5V | 1 | -40°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
ON Semiconductor |
IC HEX BOUNCE ELIMINATOR 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione7.152 |
|
3 V ~ 18 V | 6 | -55°C ~ 125°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Intersil |
IC COMP DRVR/WINDOW 18V 72QFN
|
pacchetto: 72-VFQFN Exposed Pad |
Azione3.760 |
|
9 V ~ 18 V | 4 | -40°C ~ 85°C | Surface Mount | 72-VFQFN Exposed Pad | 72-QFN (10x10) |
||
Texas Instruments |
IC TERMINATOR PROG DUAL 14-DIP
|
pacchetto: 14-DIP (0.300", 7.62mm) |
Azione5.312 |
|
3 V ~ 18 V | 8 | -55°C ~ 125°C | Through Hole | 14-DIP (0.300", 7.62mm) | 14-PDIP |
||
Texas Instruments |
IC BCD RATE MULTIPLIER 16-TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione2.432 |
|
3 V ~ 18 V | 4 | -55°C ~ 125°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Texas Instruments |
IC 4BIT BINARY FULL ADDER 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione22.746 |
|
2 V ~ 6 V | 4 | -55°C ~ 125°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Diodes Incorporated |
XO CLOCK
|
pacchetto: - |
Azione5.616 |
|
- | - | - | - | - | - |
||
Diodes Incorporated |
XO CLOCK
|
pacchetto: - |
Azione5.952 |
|
- | - | - | - | - | - |
||
Diodes Incorporated |
XO CLOCK
|
pacchetto: - |
Azione7.984 |
|
- | - | - | - | - | - |
||
Texas Instruments |
LOOK-AHEAD CARRY GENERATOR
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - |
||
National Semiconductor |
ARITHMETIC LOGIC UNIT, TTL
|
pacchetto: - |
Request a Quote |
|
4.5V ~ 5.5V | 4 | -55°C ~ 125°C | Surface Mount | 24-CFlatpack | 24-CFP |
||
Texas Instruments |
SN74S1053 16-BIT SCHOTTKY BARRIE
|
pacchetto: - |
Request a Quote |
|
- | 16 | 0°C ~ 70°C | - | - | - |
||
Advanced Micro Devices |
AM29C982 - LOGIC CIRCUIT
|
pacchetto: - |
Request a Quote |
|
4.5V ~ 5.5V | 4 | -55°C ~ 125°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Harris Corporation |
16 X 16 BIT CMOS PARALLEL MULTIP
|
pacchetto: - |
Request a Quote |
|
- | - | - | Through Hole | 68-BCPGA | 68-CPGA (29.47x29.47) |