Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Supply Voltage | Number of Bits | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC RCVR HS DIFF 2.5/3.3V 8MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione4.512 |
|
2.375 V ~ 3.6 V | 1 | -40°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
IC RCVR HS DIFF 2.5/3.3V 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.896 |
|
2.375 V ~ 3.6 V | 1 | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC BUFFER DDR 13-26BIT 56VFQFPN
|
pacchetto: 56-VFQFN Exposed Pad |
Azione4.096 |
|
2.3 V ~ 2.7 V | 13, 26 | 0°C ~ 70°C | Surface Mount | 56-VFQFN Exposed Pad | 56-VFQFPN (8x8) |
||
IDT, Integrated Device Technology Inc |
IC REGIST BUFF 25BIT DDR2 96-BGA
|
pacchetto: 96-LFBGA |
Azione3.024 |
|
1.7 V ~ 1.9 V | 25, 14 | 0°C ~ 70°C | Surface Mount | 96-LFBGA | 96-CABGA (13.5x5.5) |
||
IDT, Integrated Device Technology Inc |
IC REGIST BUFF 25BIT DDR2 96-BGA
|
pacchetto: 96-LFBGA |
Azione2.864 |
|
1.7 V ~ 1.9 V | 25, 14 | 0°C ~ 70°C | Surface Mount | 96-LFBGA | 96-CABGA (13.5x5.5) |
||
IDT, Integrated Device Technology Inc |
IC BUFFER 1:1/1:2 96-LFBGA
|
pacchetto: 96-LFBGA |
Azione2.400 |
|
1.7 V ~ 1.9 V | 25, 14 | 0°C ~ 70°C | Surface Mount | 96-LFBGA | 96-CABGA (13.5x5.5) |
||
Microchip Technology |
IC RCVR DIFF 3.3/5V 10-MSOP
|
pacchetto: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
Azione4.944 |
|
3.3V, 5V | 1 | -40°C ~ 85°C | Surface Mount | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | 10-MSOP |
||
ON Semiconductor |
IC ADDER/SUBTR DUAL 2BIT 16-DIP
|
pacchetto: 16-DIP (0.300", 7.62mm) |
Azione2.944 |
|
- | 2 | 0°C ~ 75°C | Through Hole | 16-DIP (0.300", 7.62mm) | 16-DIP |
||
NXP |
IC 9BIT DUAL LATCH TXRX 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione5.136 |
|
4.5 V ~ 5.5 V | 9 | -40°C ~ 85°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SO |
||
NXP |
IC BUFFER 1.8V 1/14BIT SOT536-1
|
pacchetto: 96-LFBGA |
Azione6.480 |
|
1.7 V ~ 1.9 V | 25, 14 | 0°C ~ 70°C | Surface Mount | 96-LFBGA | 96-LFBGA (13.5x5.5) |
||
Microchip Technology |
IC RCVR DIFF 5V/3.3V 10-MSOP
|
pacchetto: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
Azione2.784 |
|
3.3V, 5V | 1 | -40°C ~ 85°C | Surface Mount | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | 10-MSOP |
||
Microchip Technology |
IC LINE RCVR QUINT DIFF 28-PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione4.112 |
|
4.2 V ~ 5.5 V | 5 | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.5x11.5) |
||
Microchip Technology |
IC COUNTER/SHIFT REG 28-PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione5.568 |
|
4.2 V ~ 5.5 V | 4 | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.5x11.5) |
||
Microchip Technology |
IC RCVR DIFF 5V/3.3V 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.536 |
|
3.3V, 5V | 1 | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC RCVR DIFF 5V/3.3V 8-MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione30.000 |
|
3.3V, 5V | 1 | -40°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
ON Semiconductor |
IC RCVR ECL QUAD DIFF 5V 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione12.708 |
|
4.2 V ~ 5.7 V | 4 | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
ON Semiconductor |
IC CML DVR PRE-EMPH 1CH 16-QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione5.040 |
|
1.71 V ~ 2.625 V | - | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
ON Semiconductor |
IC RCVR/DRVR 3.3/5 DIFF ECL 8DFN
|
pacchetto: 8-VFDFN Exposed Pad |
Azione7.072 |
|
3 V ~ 5.5 V | - | -40°C ~ 85°C | Surface Mount | 8-VFDFN Exposed Pad | 8-DFN (2x2) |
||
Microchip Technology |
IC RCVR DIFF 5V/3.3V 10-MSOP
|
pacchetto: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
Azione2.576 |
|
3.3V, 5V | 1 | -40°C ~ 85°C | Surface Mount | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | 10-MSOP |
||
Texas Instruments |
IC 19-BIT BUS INTERFACE 48-TSSOP
|
pacchetto: 48-TFSOP (0.240", 6.10mm Width) |
Azione31.824 |
|
4.5 V ~ 5.5 V | 19 | -40°C ~ 85°C | Surface Mount | 48-TFSOP (0.240", 6.10mm Width) | 48-TSSOP |
||
Renesas Electronics America |
IC COMP DRVR/WINDOW 18V 72-QFN
|
pacchetto: 72-VFQFN Exposed Pad |
Azione3.984 |
|
9 V ~ 18 V | 4 | -40°C ~ 85°C | Surface Mount | 72-VFQFN Exposed Pad | 72-QFN (10x10) |
||
Dialog Semiconductor GmbH |
CMIC, PWROK GENERATOR AND STARTU
|
pacchetto: 12-WFDFN Exposed Pad |
Azione27.834 |
|
3 V ~ 3.6 V | - | -40°C ~ 85°C (TA) | Surface Mount | 12-WFDFN Exposed Pad | 12-TDFN (2.5x2.5) |
||
Maxim Integrated |
IC INTEGRATED CIRCUIT
|
pacchetto: - |
Azione7.312 |
|
- | - | - | - | - | - |
||
Advanced Micro Devices |
ERROR DETECTION & CORRECTION
|
pacchetto: - |
Request a Quote |
|
4.75V ~ 5.25V | 32 | 0°C ~ 70°C | Surface Mount | 68-LCC (J-Lead) | 68-PLCC (24.21x24.21) |
||
National Semiconductor |
ADDER/SUBTRACTOR
|
pacchetto: - |
Request a Quote |
|
5V ~ 15V | 4 | - | Through Hole | 16-CDIP | 16-CDIP |
||
SMSC |
32-BIT CRC GENERATOR CIRCUIT
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - |
||
National Semiconductor |
ARITHMETIC LOGIC UNIT, TTL
|
pacchetto: - |
Request a Quote |
|
4.5V ~ 5.5V | 4 | -55°C ~ 125°C | Surface Mount | - | - |
||
Texas Instruments |
LOOK-AHEAD CARRY GENERATORS 20-L
|
pacchetto: - |
Request a Quote |
|
4.5V ~ 5.5V | 4 | -55°C ~ 125°C | Surface Mount | 20-CLCC | 20-LCCC (8.89x8.89) |