Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Elements | Number of Bits per Element | Input Type | Output Type | Current - Output High, Low | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC BUFF/DVR TRI-ST DUAL 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione5.824 |
|
2 | 4 | - | Push-Pull | 7.8mA, 7.8mA | 2 V ~ 6 V | -40°C ~ 125°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC BUS TRANSCVR 3-ST 8BIT 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione7.936 |
|
1 | 8 | - | Push-Pull | 24mA, 24mA | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Texas Instruments |
IC BUS TRANSCVR 8BIT 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione7.136 |
|
1 | 8 | - | Push-Pull | 24mA, 24mA | 1.5 V ~ 5.5 V | -55°C ~ 125°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Texas Instruments |
IC BUS TRANSCVR 16BIT 56BGA
|
pacchetto: 56-VFBGA |
Azione3.360 |
|
2 | 8 | - | Push-Pull | 12mA, 12mA; 32mA, 64mA | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 56-VFBGA | 56-BGA MICROSTAR JUNIOR (7.0x4.5) |
||
ON Semiconductor |
IC BUFF TRI-ST QD N-INV 14SOEIAJ
|
pacchetto: 14-SOIC (0.209", 5.30mm Width) |
Azione11.988 |
|
4 | 1 | - | Push-Pull | 7.8mA, 7.8mA | 2 V ~ 6 V | -55°C ~ 125°C (TA) | Surface Mount | 14-SOIC (0.209", 5.30mm Width) | SOEIAJ-14 |
||
NXP |
IC TXRX NON-INV 8BIT 24TSSOP
|
pacchetto: 24-TSSOP (0.173", 4.40mm Width) |
Azione5.424 |
|
1 | 8 | - | Push-Pull | 7.8mA, 7.8mA | 2 V ~ 6 V | -40°C ~ 125°C (TA) | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
NXP |
IC TRANSCVR TRI-ST 16BIT 48TSSOP
|
pacchetto: 48-TFSOP (0.240", 6.10mm Width) |
Azione7.760 |
|
2 | 8 | - | Push-Pull | 32mA, 64mA | 2.3 V ~ 2.7 V, 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.240", 6.10mm Width) | 48-TSSOP |
||
Nexperia USA Inc. |
IC BUFF DVR TRI-ST 16BIT 56VFBGA
|
pacchetto: 56-VFBGA |
Azione4.096 |
|
4 | 4 | - | Push-Pull | 24mA, 24mA | 1.2 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 56-VFBGA | 56-VFBGA (4.5x7) |
||
Nexperia USA Inc. |
IC INVERTER QUAD 4-INPUT 48SSOP
|
pacchetto: 48-BSSOP (0.295", 7.50mm Width) |
Azione3.680 |
|
4 | 4 | - | Push-Pull | 24mA, 24mA | 1.2 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 48-BSSOP (0.295", 7.50mm Width) | 48-SSOP |
||
Texas Instruments |
IC REGISTERED TXRX 8BIT 24SOIC
|
pacchetto: 24-SOIC (0.295", 7.50mm Width) |
Azione5.120 |
|
1 | 8 | - | Push-Pull | 32mA, 64mA | 4.75 V ~ 5.25 V | -40°C ~ 85°C (TA) | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | 24-SOIC |
||
Texas Instruments |
IC BUFF/DVR TRI-ST 8BIT 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione5.840 |
|
1 | 8 | - | Push-Pull | 32mA, 64mA | 4.75 V ~ 5.25 V | -40°C ~ 85°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Texas Instruments |
IC BUFF/DVR TRI-ST QD 14SOIC
|
pacchetto: 14-SOIC (0.154", 3.90mm Width) |
Azione3.696 |
|
4 | 1 | - | Push-Pull | 6mA, 6mA | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TA) | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC |
||
IDT, Integrated Device Technology Inc |
IC INVERTER 8-INPUT 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione4.560 |
|
1 | 8 | - | Push-Pull | 15mA, 64mA | 4.75 V ~ 5.25 V | -40°C ~ 85°C (TA) | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
Texas Instruments |
IC BUFF/DVR TRI-ST DUAL 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione10.404 |
|
2 | 4 | - | Push-Pull | 32mA, 64mA | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Texas Instruments |
IC BUFF/DVR TRI-ST DUAL 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione6.848 |
|
2 | 4 | - | Push-Pull | 24mA, 24mA | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Fairchild/ON Semiconductor |
IC BUFF/DVR TRI-ST 8BIT 20SOP
|
pacchetto: 20-SOIC (0.209", 5.30mm Width) |
Azione5.344 |
|
1 | 8 | - | Push-Pull | 7.8mA, 7.8mA | 2 V ~ 6 V | -40°C ~ 85°C (TA) | Surface Mount | 20-SOIC (0.209", 5.30mm Width) | 20-SOP |
||
Fairchild/ON Semiconductor |
IC TXRX BIDIR LV BUSHOLD 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione3.600 |
|
1 | 8 | - | Push-Pull | 24mA, 24mA | 2 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Texas Instruments |
IC BUFF/DVR OPN DRN DL LP 6SON
|
pacchetto: 6-UFDFN |
Azione4.160 |
|
2 | 1 | - | Open Drain | -, 4mA | 0.8 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 6-UFDFN | 6-SON (1.45x1) |
||
Texas Instruments |
IC BUFF/DVR NON-INVERT SOT23-5
|
pacchetto: SC-74A, SOT-753 |
Azione17.748 |
|
1 | 1 | - | Open Drain | -, 32mA | 1.65 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | SC-74A, SOT-753 | SOT-23-5 |
||
ON Semiconductor |
IC BUFFER INVERT 3.6V 48TSSOP
|
pacchetto: 48-TFSOP (0.240", 6.10mm Width) |
Azione7.552 |
|
4 | 4 | - | 3-State | 24mA, 24mA | 1.65 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.240", 6.10mm Width) | 48-TSSOP |
||
ON Semiconductor |
IC BUFFER NON-INVERT 5.5V 20SOP
|
pacchetto: 20-SOIC (0.209", 5.30mm Width) |
Azione7.024 |
|
2 | 4 | - | 3-State | 15mA, 64mA | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 20-SOIC (0.209", 5.30mm Width) | 20-SOP |
||
ON Semiconductor |
IC BUFFER NON-INVERT 3.6V US8
|
pacchetto: 8-VFSOP (0.091", 2.30mm Width) |
Azione2.144 |
|
3 | 1 | - | Push-Pull | 2.6mA, 2.6mA | 0.9 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VFSOP (0.091", 2.30mm Width) | US8 |
||
Texas Instruments |
PROTOTYPE
|
pacchetto: - |
Request a Quote |
|
4 | 1 | - | 3-State | 7.8mA, 7.8mA | 2V ~ 6V | -40°C ~ 85°C (TA) | Surface Mount | 14-SOIC (0.209", 5.30mm Width) | 14-SO |
||
Motorola |
IC BUFF NON-INVERT 5.25V 14SOIC
|
pacchetto: - |
Request a Quote |
|
4 | 1 | - | 3-State | 2.6mA, 24mA | 4.75V ~ 5.25V | 0°C ~ 70°C (TA) | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC |
||
IDT, Integrated Device Technology Inc |
FAST 16-BIT LATCHED TRANSCVR
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - |
||
Texas Instruments |
PROTOTYPE
|
pacchetto: - |
Request a Quote |
|
1 | 8 | - | 3-State | 24mA, 24mA | 1.65V ~ 3.6V | -40°C ~ 125°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Texas Instruments |
PROTOTYPE
|
pacchetto: - |
Request a Quote |
|
2 | 4 | - | 3-State | 7.8mA, 7.8mA | 2V ~ 6V | -40°C ~ 85°C (TA) | Surface Mount | 20-SOIC (0.209", 5.30mm Width) | 20-SO |
||
Fairchild Semiconductor |
IC BUFF INVT/NON-IN -5.7V 24CDIP
|
pacchetto: - |
Request a Quote |
|
1 | 4 | - | - | 50mA, - | -4.2V ~ -5.7V | 0°C ~ 85°C (TC) | Through Hole | 24-CDIP (0.400", 10.16mm) | 24-CERDIP |