Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Elements | Number of Bits per Element | Input Type | Output Type | Current - Output High, Low | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments |
IC BUFF/DVR TRI-ST DUAL 24SO
|
pacchetto: 24-SOIC (0.209", 5.30mm Width) |
Azione2.560 |
|
2 | 4 | - | Push-Pull | 24mA, 24mA | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 24-SOIC (0.209", 5.30mm Width) | 24-SO |
||
Texas Instruments |
IC 16BIT REG TXRX 3-ST 56-TSSOP
|
pacchetto: 56-TFSOP (0.240", 6.10mm Width) |
Azione6.512 |
|
2 | 8 | - | Push-Pull | 32mA, 64mA | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 56-TFSOP (0.240", 6.10mm Width) | 56-TSSOP |
||
ON Semiconductor |
IC TXRX/REGISTER 3ST 8BIT 24DIP
|
pacchetto: 24-DIP (0.300", 7.62mm) |
Azione2.032 |
|
1 | 8 | - | Push-Pull | 24mA, 24mA | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 24-DIP (0.300", 7.62mm) | 24-PDIP |
||
ON Semiconductor |
IC BUFF/DVR TRI-ST 8BIT 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione8.784 |
|
1 | 8 | - | Push-Pull | 24mA, 24mA | 2 V ~ 6 V | -40°C ~ 85°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC REGISTERED TRANSCVR 5B 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione5.184 |
|
1 | 5 | - | Push-Pull | - | -4.2 V ~ -5.5 V | 0°C ~ 85°C (TA) | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.5x11.5) |
||
Fairchild/ON Semiconductor |
IC BUFF/DVR TRI-ST DUAL 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione18.612 |
|
2 | 4 | - | Push-Pull | 15mA, 24mA | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Fairchild/ON Semiconductor |
IC TRANSCVR TRI-ST 16BIT 56TSSOP
|
pacchetto: 56-TFSOP (0.240", 6.10mm Width) |
Azione3.728 |
|
2 | 8 | - | Push-Pull | 32mA, 64mA | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 56-TFSOP (0.240", 6.10mm Width) | 56-TSSOP |
||
Texas Instruments |
IC TXRX NON-INVERT 3.6V 24SSOP
|
pacchetto: 24-SSOP (0.209", 5.30mm Width) |
Azione3.120 |
|
1 | 8 | - | Push-Pull | 32mA, 64mA | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 24-SSOP (0.209", 5.30mm Width) | 24-SSOP |
||
NXP |
IC BUFFER HEX NON-INV 16DIP
|
pacchetto: 16-DIP (0.300", 7.62mm) |
Azione2.496 |
|
6 | 1 | - | Push-Pull | 3mA, 20mA | 3 V ~ 15 V | -40°C ~ 85°C (TA) | Through Hole | 16-DIP (0.300", 7.62mm) | 16-DIP |
||
Nexperia USA Inc. |
IC TRANSCVR TRI-ST 32BIT 96LFBGA
|
pacchetto: 96-LFBGA |
Azione4.448 |
|
4 | 8 | - | Push-Pull | 24mA, 24mA | 1.2 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 96-LFBGA | 96-LFBGA (13.5x5.5) |
||
Texas Instruments |
IC BUFF/DVR TRI-ST 16BIT 48SSOP
|
pacchetto: 48-BSSOP (0.295", 7.50mm Width) |
Azione4.896 |
|
4 | 4 | - | Push-Pull | 32mA, 64mA | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 48-BSSOP (0.295", 7.50mm Width) | 48-SSOP |
||
IDT, Integrated Device Technology Inc |
IC REGSTERD TRSCVR 16BIT 56TSSOP
|
pacchetto: 56-TFSOP (0.240", 6.10mm Width) |
Azione2.848 |
|
2 | 8 | - | Push-Pull | 32mA, 64mA | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 56-TFSOP (0.240", 6.10mm Width) | 56-TSSOP |
||
Texas Instruments |
IC REGISTERED TRANSCVR 56TSSOP
|
pacchetto: 56-TFSOP (0.240", 6.10mm Width) |
Azione6.928 |
|
2 | 8 | - | Push-Pull | 32mA, 64mA | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 56-TFSOP (0.240", 6.10mm Width) | 56-TSSOP |
||
Texas Instruments |
IC BUFF/DVR TRI-ST 8BIT 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione6.880 |
|
2 | 4 | - | Push-Pull | 32mA, 64mA | 4.75 V ~ 5.25 V | 0°C ~ 70°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Texas Instruments |
IC BUS BUFF TRI-ST QD 14SOIC
|
pacchetto: 14-SOIC (0.154", 3.90mm Width) |
Azione6.656 |
|
4 | 1 | - | Push-Pull | 2.6mA, 24mA | 4.75 V ~ 5.25 V | 0°C ~ 70°C (TA) | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC |
||
Nexperia USA Inc. |
IC BUFFER/DVR GATE TRPL X2SON8
|
pacchetto: 8-XFDFN |
Azione3.968 |
|
3 | 1 | - | Open Drain | -, 4mA | 0.8 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 8-XFDFN | 8-XSON, SOT1116 (1.2x1) |
||
ON Semiconductor |
IC HEX BUFF/LINE DVR 3ST 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione2.160 |
|
1 | 6 | - | Push-Pull | 6mA, 6mA | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Diodes Incorporated |
IC BUFF/DVR 3ST 1BIT DFN1010-6
|
pacchetto: 6-XFDFN |
Azione480.000 |
|
1 | 1 | - | Push-Pull | 32mA, 32mA | 1.65 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 6-XFDFN | X2-DFN1010-6 |
||
Texas Instruments |
IC BUS TRANSCVR 16BIT 48SSOP
|
pacchetto: 48-BSSOP (0.295", 7.50mm Width) |
Azione4.400 |
|
2 | 8 | - | Push-Pull | 16mA, 16mA | 4.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 48-BSSOP (0.295", 7.50mm Width) | 48-SSOP |
||
Fairchild/ON Semiconductor |
IC BUFFER ULP SGL 6-MICROPAK2
|
pacchetto: 6-UFDFN |
Azione7.152 |
|
1 | 1 | Schmitt Trigger | Push-Pull | 2.6mA, 2.6mA | 0.9 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 6-UFDFN | 6-MicroPak2? |
||
Texas Instruments |
IC ADDRESS DVR 1-4BIT 56SSOP
|
pacchetto: 56-BSSOP (0.295", 7.50mm Width) |
Azione7.644 |
|
4 | 2:8 | - | Push-Pull | 24mA, 24mA | 1.65 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 56-BSSOP (0.295", 7.50mm Width) | 56-SSOP |
||
Texas Instruments |
IC BUS BUFFER TRI-ST QD 14SOIC
|
pacchetto: 14-SOIC (0.154", 3.90mm Width) |
Azione180.492 |
|
4 | 1 | - | Push-Pull | 8mA, 8mA | 2 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC |
||
ON Semiconductor |
IC BUF NON-INVERT 5.5V 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione8.904 |
|
2 | 4 | - | 3-State | 7.2mA, 7.2mA | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Toshiba Semiconductor and Storage |
X34 PB-F UNIVERSAL SCHMITT BUFFE
|
pacchetto: 14-TSSOP (0.173", 4.40mm Width) |
Azione26.670 |
|
1 | 5 | Schmitt Trigger | 3-State | 8mA, 8mA | 2V ~ 5.5V | -40°C ~ 125°C | Surface Mount | 14-TSSOP (0.173", 4.40mm Width) | 14-TSSOPB |
||
Texas Instruments |
HIGH SPEED CMOS LOGIC OCTAL INVE
|
pacchetto: - |
Request a Quote |
|
1 | 8 | - | 3-State | 7.8mA, 7.8mA | 2V ~ 6V | -55°C ~ 125°C | Through Hole | 20-CDIP (0.300", 7.62mm) | 20-CDIP |
||
Texas Instruments |
IC TXRX INVERT 5.25V 20DIP
|
pacchetto: - |
Request a Quote |
|
1 | 8 | - | Open Collector | 100µA, 24mA | 4.75V ~ 5.25V | 0°C ~ 70°C (TA) | Through Hole | 20-DIP (0.300", 7.62mm) | 20-PDIP |
||
onsemi |
IC BUFFER NON-INVERT 5.5V 20QFN
|
pacchetto: - |
Request a Quote |
|
1 | 6 | - | 3-State | 32mA, 32mA | 1.65V ~ 5.5V | -55°C ~ 125°C (TA) | Surface Mount | 20-VFQFN Exposed Pad | 20-QFN (2.5x3.5) |
||
Harris Corporation |
IC TXRX NON-INVERT 5.25V 24SSOP
|
pacchetto: - |
Request a Quote |
|
1 | 8 | - | 3-State | 15mA, 64mA | 4.75V ~ 5.25V | 0°C ~ 70°C (TA) | Surface Mount | 24-SSOP (0.209", 5.30mm Width) | 24-SSOP |