Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Applications | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|
Semtech Corporation |
IC AMP TIA 2.5GBPS SONET CHIP
|
pacchetto: - |
Azione5.312 |
|
Ethernet | - | - | - |
||
Semtech Corporation |
IC TRANSIMPEDANCE AMP MODULE
|
pacchetto: Module |
Azione7.456 |
|
Fiber Optics | - | Module | Module |
||
Maxim Integrated |
IC AMP/COMP/REF +100V/V 10-UMAX
|
pacchetto: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
Azione2.544 |
|
Current Sensing, Power Management | Surface Mount | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | 10-uMAX |
||
Maxim Integrated |
IC AMP GAIN +50V/V PREC 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.680 |
|
Current Sensing, Power Management | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC AMP LIMITING POST HS 10-MSOP
|
pacchetto: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
Azione2.272 |
|
Optical Networks | Surface Mount | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | 10-MSOP |
||
Microchip Technology |
IC POST AMP CML LP LIMIT 10-MSOP
|
pacchetto: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad |
Azione2.576 |
|
Optical Networks | Surface Mount | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad | 10-MSOP-EP |
||
Microchip Technology |
IC AMP POST PECL 3.3V/5V 10-MSOP
|
pacchetto: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
Azione3.856 |
|
Optical Networks | Surface Mount | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | 10-MSOP |
||
Microchip Technology |
IC AMP POST PECL 3.3V/5V 16-MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione4.896 |
|
Optical Networks | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC AMP POST PECL 3.3V/5V 10-MSOP
|
pacchetto: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
Azione59.760 |
|
Optical Networks | Surface Mount | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | 10-MSOP |
||
Analog Devices Inc. |
IC ADC DIFF DRIVER 16-LFCSP
|
pacchetto: 16-VFQFN Exposed Pad, CSP |
Azione7.856 |
|
Data Acquisition | Surface Mount | 16-VFQFN Exposed Pad, CSP | 16-LFCSP-VQ (3x3) |
||
Analog Devices Inc. |
IC VGA QUAD W/PREAMP 64-LFCSP
|
pacchetto: 64-VFQFN Exposed Pad, CSP |
Azione5.936 |
|
Signal Processing | Surface Mount | 64-VFQFN Exposed Pad, CSP | 64-LFCSP-VQ (9x9) |
||
Linear Technology |
IC AMP/DRIVER DIFF 16-QFN
|
pacchetto: 16-WFQFN Exposed Pad |
Azione6.864 |
|
Data Acquisition | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN-EP (3x3) |
||
Linear Technology |
IC AMP/DRIVER DIFF 16-QFN
|
pacchetto: 16-WFQFN Exposed Pad |
Azione4.768 |
|
Data Acquisition | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN-EP (3x3) |
||
Linear Technology |
IC OPAMP/COMP/REF MICROPWR 8-DFN
|
pacchetto: 8-WFDFN Exposed Pad |
Azione6.656 |
|
GSM | Surface Mount | 8-WFDFN Exposed Pad | 8-DFN (3x3) |
||
Maxim Integrated |
IC AMP CATV UPSTREAM 3.0 20TQFN
|
pacchetto: 20-WQFN Exposed Pad |
Azione5.600 |
|
CATV | Surface Mount | 20-WQFN Exposed Pad | 20-TQFN (5x5) |
||
Texas Instruments |
IC OPAMP/COMP/REF DUAL 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione57.168 |
|
Power Management | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Semtech Corporation |
IC AMP TIA AGC OC-3/FE BARE DIE
|
pacchetto: Die |
Azione5.840 |
|
- | Surface Mount | Die | Die |
||
Texas Instruments |
IC AMP DVGA 200MHZ QUAD 54WQFN
|
pacchetto: 54-WFQFN Exposed Pad |
Azione20.472 |
|
Signal Processing | Surface Mount | 54-WFQFN Exposed Pad | 54-WQFN (10x5.5) |
||
Analog Devices Inc. |
IC VGA QUAD W/PREAMP 64LFCSP
|
pacchetto: 64-VFQFN Exposed Pad, CSP |
Azione49.128 |
|
Signal Processing | Surface Mount | 64-VFQFN Exposed Pad, CSP | 64-LFCSP-VQ (9x9) |
||
M/A-Com Technology Solutions |
IC AMP OPTICAL POST MMIC PECL
|
pacchetto: 16-VFQFN Exposed Pad |
Azione6.464 |
|
Ethernet | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Maxim Integrated |
IC AMP LIMITING 3.3V LP 16TQFN
|
pacchetto: 16-WFQFN Exposed Pad |
Azione59.052 |
|
Optical Networks | Surface Mount | 16-WFQFN Exposed Pad | 16-TQFN (3x3) |
||
Maxim Integrated |
IC AMP LIMITING 3.3V LP 16TQFN
|
pacchetto: 16-WFQFN Exposed Pad |
Azione9.900 |
|
Optical Networks | Surface Mount | 16-WFQFN Exposed Pad | 16-TQFN (3x3) |
||
Maxim Integrated |
IC OP AMP LP HI SPEED 10-UMAX
|
pacchetto: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
Azione6.848 |
|
Smart Card | Surface Mount | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | 10-uMAX |
||
Linear Technology |
IC AMP/DRIVER DIFF 16-QFN
|
pacchetto: 16-WFQFN Exposed Pad |
Azione6.000 |
|
Data Acquisition | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN-EP (3x3) |
||
Linear Technology |
IC DRIVER DIFF CONVERT/ADC 8-DFN
|
pacchetto: 8-WFDFN Exposed Pad |
Azione6.512 |
|
Data Acquisition | Surface Mount | 8-WFDFN Exposed Pad | 8-DFN (3x3) |
||
Analog Devices Inc. |
IC VGA GP SGL-ENDED 16-LFCSP
|
pacchetto: 16-VQFN Exposed Pad, CSP |
Azione9.000 |
|
Signal Processing | Surface Mount | 16-VQFN Exposed Pad, CSP | 16-LFCSP-VQ (4x4) |
||
Analog Devices Inc. |
IC AMP LOGARITHMIC 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione185.916 |
|
Receiver Signal Strength Indication (RSSI) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Texas Instruments |
AUTOMOTIVE 250-MV INPUT, PRECISI
|
pacchetto: - |
Azione3.810 |
|
- | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |