Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Voltage - Supply | Package / Case | Supplier Device Package | Mounting Type |
---|---|---|---|---|---|---|---|---|---|---|---|
Maxim Integrated |
IC EQUALIZER 3.2GBPS 24TQFN
|
pacchetto: 24-VQFN Exposed Pad |
Azione8.088 |
|
- | 3.3V | 24-VQFN Exposed Pad | 24-QFN (4x4) | Surface Mount |
||
Broadcom Limited |
PCI9656-BA66BI
|
pacchetto: - |
Azione82.080 |
|
PCI | 3.3V, 5V | - | 272-BGA (27x27) | Surface Mount |
||
Diodes Incorporated |
IC DVI/HDMI MUX/DEMUX 64TQFN
|
pacchetto: 64-WFQFN Exposed Pad |
Azione2.224 |
|
- | 3.3V | 64-WFQFN Exposed Pad | 64-TQFN (7.5x7.5) | Surface Mount |
||
Silicon Labs |
IC BRIDGE USB TO UART 64QFN
|
pacchetto: 64-VFQFN Exposed Pad |
Azione9.780 |
|
- | - | 64-VFQFN Exposed Pad | 64-QFN (9x9) | Surface Mount |
||
NXP |
IC I-CODE SLI FCS2
|
pacchetto: - |
Azione2.736 |
|
- | - | - | - | - |
||
NXP |
IC I2C 2:1 SELECTOR 16-SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione7.312 |
|
I2C, SMBus | 2.3 V ~ 5.5 V | 16-SOIC (0.154", 3.90mm Width) | 16-SO | Surface Mount |
||
NXP |
IC I2C 2:1 SELECTOR 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione5.600 |
|
I2C, SMBus | 2.3 V ~ 5.5 V | 16-SOIC (0.154", 3.90mm Width) | 16-SO | Surface Mount |
||
IDT, Integrated Device Technology Inc |
IC PCIE SW 48LANE 12PORT 1156BGA
|
pacchetto: 1156-BBGA, FCBGA |
Azione5.840 |
|
PCI Express | 3.3V | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | Surface Mount |
||
IDT, Integrated Device Technology Inc |
IC PCI SW 32LANE 24PORT 484BGA
|
pacchetto: 484-BBGA, FCBGA |
Azione4.560 |
|
PCI Express | 3.3V | 484-BBGA, FCBGA | 484-FCBGA (23x23) | Surface Mount |
||
IDT, Integrated Device Technology Inc |
IC PCI SW 24LANE 6PORT 484BGA
|
pacchetto: 484-BBGA, FCBGA |
Azione6.144 |
|
PCI Express | 3.3V | 484-BBGA, FCBGA | 484-FCBGA (23x23) | Surface Mount |
||
IDT, Integrated Device Technology Inc |
IC PCI SW 24LANE 6PORT 324-FCBGA
|
pacchetto: 324-BBGA, FCBGA |
Azione4.960 |
|
PCI Express | 3.3V | 324-BBGA, FCBGA | 324-FCBGA (19x19) | Surface Mount |
||
IDT, Integrated Device Technology Inc |
IC PROC BRIDGE PCI - HOST 256BGA
|
pacchetto: 256-BBGA |
Azione3.808 |
|
PCI, Serial | 3.3V | 256-BBGA | 256-PBGA (27x27) | Surface Mount |
||
Intersil |
IC CTRLR INTERRUPT 8MHZ 28-PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione5.696 |
|
- | 4.5 V ~ 5.5 V | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) | Surface Mount |
||
Zilog |
IC 8MHZ Z80 CMOS DMA 44-PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione3.440 |
|
- | 5V | 44-LCC (J-Lead) | 44-PLCC | Surface Mount |
||
Nuvoton Technology Corporation of America |
IC LPC SUPER I/O 128LQFP
|
pacchetto: 128-LQFP |
Azione6.112 |
|
- | 5V | 128-LQFP | 128-LQFP (14x14) | Surface Mount |
||
NXP |
IC SBC CAN HS 3.3V 54SOIC
|
pacchetto: 54-SSOP (0.295", 7.50mm Width) Exposed Pad |
Azione2.992 |
|
CAN, LIN | 5.5 V ~ 28 V | 54-SSOP (0.295", 7.50mm Width) Exposed Pad | 54-SOIC W EP | Surface Mount |
||
Diodes Incorporated |
IC DEMULTIPLEXER 48TQFN
|
pacchetto: - |
Azione4.992 |
|
- | 3 V ~ 3.6 V | - | - | - |
||
NXP |
IC SMARD CARD INTERFACE 24HVQFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione3.168 |
|
Analog | 1.8V, 3V, 5V | 24-VFQFN Exposed Pad | 24-HVQFN (4x4) | Surface Mount |
||
Texas Instruments |
IC DISPL PORT TO TMDS OUT 36QFN
|
pacchetto: 36-VFQFN Exposed Pad |
Azione40.044 |
|
I2C, 2-Wire Serial | 1.65 V ~ 3.6 V | 36-VFQFN Exposed Pad | 36-VQFN (6x6) | Surface Mount |
||
Linear Technology |
IC MUX 4CH 2-WIRE BUS 24-SSOP
|
pacchetto: 24-SSOP (0.154", 3.90mm Width) |
Azione15.018 |
|
SMBus (2-Wire/I2C) | 2.2 V ~ 5.5 V | 24-SSOP (0.154", 3.90mm Width) | 24-SSOP | Surface Mount |
||
Maxim Integrated |
IC SW DEBOUNCE 20-SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione188.244 |
|
Octal | 2.7 V ~ 5.5 V | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP | Surface Mount |
||
ON Semiconductor |
IC SWITCH DP3T 16 UMLP
|
pacchetto: 16-UFQFN |
Azione3.968 |
|
- | 5.25V | 16-UFQFN | 16-UMLP (1.8x2.6) | Surface Mount |
||
IDT, Integrated Device Technology Inc |
SENSOR SIGNAL CONDITIONER
|
pacchetto: - |
Azione2.816 |
|
- | - | - | - | - |
||
NXP |
HIGH INTEGRATED AND LOW POWER SM
|
pacchetto: 32-VFQFN Exposed Pad |
Azione7.328 |
|
Analog | 2.7 V ~ 5.5 V | 32-VFQFN Exposed Pad | 32-HVQFN (5x5) | Surface Mount |
||
Rochester Electronics, LLC |
9519ADC
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - |
||
NXP |
IC MCU 32BIT 64QFP
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - |
||
Harris Corporation |
CMOS HIGH PERFORMANCE PROGRAMMAB
|
pacchetto: - |
Request a Quote |
|
CMOS | 4.5V ~ 5.5V | 40-CDIP (0.600", 15.24mm) | 40-CERDIP | Through Hole |
||
Texas Instruments |
USB 2.0 HIGH-SPEED SIGNAL CONDIT
|
pacchetto: - |
Azione8.031 |
|
USB 2.0 | 2.3V ~ 6.5V | 12-XFQFN | 12-X2QFN (1.6x1.6) | Surface Mount |