Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Voltage - Supply | Package / Case | Supplier Device Package | Mounting Type |
---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
CANHS 8SOIC
|
pacchetto: - |
Azione6.992 |
|
- | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC PCIE RETIMER 100CABGA
|
pacchetto: - |
Azione7.936 |
|
I2C | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC PCIE TO PCI BRIDGE 128TQFP
|
pacchetto: - |
Azione7.120 |
|
PCI Express | 5V | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC PCI SW 48LANE 12PORT 676BGA
|
pacchetto: 676-BBGA, FCBGA |
Azione3.936 |
|
PCI Express | - | 676-BBGA, FCBGA | 676-FCBGA (27x27) | Surface Mount |
||
IDT, Integrated Device Technology Inc |
IC PCI SW 32LANE 8PORT 484BGA
|
pacchetto: 484-BBGA, FCBGA |
Azione3.200 |
|
PCI Express | 3.3V | 484-BBGA, FCBGA | 484-FCBGA (23x23) | Surface Mount |
||
Maxim Integrated |
IC PORT BYPASS 2.125GBPS 16-QSOP
|
pacchetto: 16-SSOP (0.154", 3.90mm Width) |
Azione6.608 |
|
- | 3 V ~ 3.6 V | 16-SSOP (0.154", 3.90mm Width) | 16-QSOP | Surface Mount |
||
Maxim Integrated |
IC USB HOST ADAPTR EMULATOR TDFN
|
pacchetto: 8-WFDFN Exposed Pad |
Azione7.296 |
|
I2C | 3 V ~ 5.5 V | 8-WFDFN Exposed Pad | 8-TDFN-EP (2x2) | Surface Mount |
||
Maxim Integrated |
IC MAPPER ETHERNET 256CSBGA
|
pacchetto: 256-BGA, CSBGA |
Azione7.488 |
|
SPI Serial | 1.8V, 2.5V, 3.3V | 256-BGA, CSBGA | 256-CSBGA (17x17) | Surface Mount |
||
NXP |
IC I2C 2:1 SELECTOR 16-HVQFN
|
pacchetto: 16-VQFN Exposed Pad |
Azione3.808 |
|
I2C | 2.3 V ~ 3.6 V, 4.5 V ~ 5.5 V | 16-VQFN Exposed Pad | 16-HVQFN (4x4) | Surface Mount |
||
Texas Instruments |
IC RVR LVDS FPD 3.3V 64-FBGA
|
pacchetto: 64-LFBGA |
Azione4.032 |
|
- | 3 V ~ 3.6 V | 64-LFBGA | 64-NFBGA (8x8) | Surface Mount |
||
IDT, Integrated Device Technology Inc |
IC PCI SW 32LANE 24PORT 484BGA
|
pacchetto: 484-BBGA, FCBGA |
Azione5.360 |
|
PCI Express | 3.3V | 484-BBGA, FCBGA | 484-FCBGA (23x23) | Surface Mount |
||
IDT, Integrated Device Technology Inc |
IC PCIE SW 4LANE 4PORT 324FCBGA
|
pacchetto: 324-BBGA, FCBGA |
Azione6.368 |
|
PCI Express | 3.3V | 324-BBGA, FCBGA | 324-FCBGA (19x19) | Surface Mount |
||
IDT, Integrated Device Technology Inc |
IC PCI SW 4LANE 4PORT 132QFN
|
pacchetto: 132-VFQFN Dual Rows Exposed Pad |
Azione4.160 |
|
PCI Express | 3.3V | 132-VFQFN Dual Rows Exposed Pad | 132-VFQFPN (10x10) | Surface Mount |
||
ON Semiconductor |
IC PWR MANAGMENT 24SOIC
|
pacchetto: 24-SOIC (0.295", 7.50mm Width) |
Azione7.008 |
|
Microcontroller | 1.8 V ~ 6.6 V | 24-SOIC (0.295", 7.50mm Width) | 24-SOIC | Surface Mount |
||
NXP |
IC SBC CAN/LIN 5.0V HS 32HTSSOP
|
pacchetto: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad |
Azione7.456 |
|
SPI Serial | 4.5 V ~ 28 V | 32-TSSOP (0.240", 6.10mm Width) Exposed Pad | 32-HTSSOP | Surface Mount |
||
ON Semiconductor |
IC SMART CARD I2C 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione4.064 |
|
- | 1.6 V ~ 5.5 V | 24-VFQFN Exposed Pad | 24-QFN (4x4) | Surface Mount |
||
NXP |
IC INTERFACE CARD MP 48LQFP
|
pacchetto: 48-LQFP |
Azione4.528 |
|
Parallel | 2.7 V ~ 6 V | 48-LQFP | 48-LQFP (7x7) | Surface Mount |
||
Texas Instruments |
IC TX 28BIT CHAN LINK 56TSSOP
|
pacchetto: 56-TFSOP (0.240", 6.10mm Width) |
Azione37.896 |
|
- | 3 V ~ 3.6 V | 56-TFSOP (0.240", 6.10mm Width) | 56-TSSOP | Surface Mount |
||
NXP |
IC I2C SWITCH 8CH 24TSSOP
|
pacchetto: 24-TSSOP (0.173", 4.40mm Width) |
Azione51.882 |
|
I2C, SMBus | 2.3 V ~ 3.6 V, 4.5 V ~ 5.5 V | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP | Surface Mount |
||
Nuvoton Technology Corporation of America |
LPC SUPER I/O, ACPI, UART * 2, P
|
pacchetto: - |
Azione5.376 |
|
- | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
AS-INTERFACE SPEC. V3.0 COMPLIAN
|
pacchetto: 28-SSOP (0.209", 5.30mm Width) |
Azione2.048 |
|
AS-i | 16 V ~ 33.1 V | 28-SSOP (0.209", 5.30mm Width) | 28-SSOP | Surface Mount |
||
ON Semiconductor |
IC SWITCH SPDT 36-WLCSP
|
pacchetto: 36-UFBGA, WLCSP |
Azione5.392 |
|
- | 1.65 V ~ 4.5 V | 36-UFBGA, WLCSP | 36-WLCSP (2.36x2.36) | Surface Mount |
||
NXP |
USB PD TCPC PHY IC
|
pacchetto: 16-XFQFN Exposed Pad |
Azione5.600 |
|
I²C | - | 16-XFQFN Exposed Pad | 16-HX2QFN (2.6x2.6) | Surface Mount |
||
Texas Instruments |
STANDALONE HART AND PAFF MODEM
|
pacchetto: 24-VFQFN Exposed Pad |
Azione6.192 |
|
UART | 1.71 V ~ 5.5 V | 24-VFQFN Exposed Pad | 24-VQFN (4x4) | Surface Mount |
||
NXP |
DIGITAL RADIO PROCESSOR 144HLQFP
|
pacchetto: 144-LQFP Exposed Pad |
Azione5.040 |
|
I²C, SPI, UART | 1.2V, 3.3V | 144-LQFP Exposed Pad | 144-HLQFP (20x20) | Surface Mount |
||
Microchip Technology |
EMERSON HORNEY
|
pacchetto: - |
Azione7.392 |
|
- | - | - | - | - |
||
Maxim Integrated |
IC USB HOST ADAPT EMULATOR 8TDFN
|
pacchetto: - |
Azione7.216 |
|
- | - | - | - | - |
||
Intel |
NON-TRANSPARENT PCI-TO PCI BRIDG
|
pacchetto: - |
Request a Quote |
|
JTAG, PCI | 3V ~ 3.6V | 304-BBGA | 304-PBGA (31x31) | Surface Mount |