Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Data Rate | Input Type | Output Type | Number of Inputs | Number of Outputs | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments |
IC SERDE CPRI 100TQFP
|
pacchetto: 100-TQFP Exposed Pad |
Azione5.920 |
|
2.5Gbps | LVCMOS, LVTTL | LVCMOS, LVTTL | 10/1 | 1/10 | 1.8V, 3.3V | -40°C ~ 85°C (TA) | Surface Mount | 100-TQFP Exposed Pad | 100-TQFP-EP (14x14) |
||
Maxim Integrated |
IC SERIALIZER 22BIT GMSL 40TQFN
|
pacchetto: 40-WFQFN Exposed Pad |
Azione5.184 |
|
1.5Gbps | CMOS, LVCMOS | CML | 22 | 1 | 1.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 40-WFQFN Exposed Pad | 40-TQFN-EP (6x6) |
||
Cypress Semiconductor Corp |
IC SERDES HOTLINK 256LBGA
|
pacchetto: 256-LBGA Exposed Pad |
Azione5.952 |
|
1.485Gbps | LVTTL | PECL | 20/4 | 4/20 | 3.3V | 0°C ~ 70°C (TA) | Surface Mount | 256-LBGA Exposed Pad | 256-BGA |
||
Maxim Integrated |
IC SERIALIZER 3.12GBPS 48TQFN
|
pacchetto: - |
Azione4.496 |
|
3.12Gbps | LVDS | CML | 30 | 1 | 1.7 V ~ 1.9 V | -40°C ~ 105°C (TA) | - | - | - |
||
CEL |
IC SERIALIZER DUAL 105TFBGA
|
pacchetto: 105-TFBGA |
Azione16.680 |
|
3.4Gbps | CMOS/TTL | V-by-One?HS | 42 | 2 | 1.8V, 3.3V | - | Surface Mount | 105-TFBGA | 105-TFBGA (10x10) |
||
Texas Instruments |
IC SERIAL/DESERIAL 24BIT 60WQFN
|
pacchetto: 60-WFQFN Exposed Pad |
Azione6.032 |
|
2.975Gbps | FPD-Link III, LVDS | LVCMOS | 1 | 31 | 1.71 V ~ 1.89 V, 3 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 60-WFQFN Exposed Pad | 60-WQFN (9x9) |
||
Texas Instruments |
IC SERIALIZER HDMI TO CML 64VQFN
|
pacchetto: 64-VFQFN Exposed Pad |
Azione5.568 |
|
3.36Gbps | HDMI | FPD-Link III, LVDS | 4 | 1 | 1.71 V ~ 1.89 V, 3 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 64-VFQFN Exposed Pad | 64-VQFN (9x9) |
||
Maxim Integrated |
IC DESERIALIZER GMSL 3.12GBPS
|
pacchetto: 48-WFQFN Exposed Pad |
Azione2.528 |
|
3.12Gbps | LVDS | LVDS | - | - | 3 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 48-WFQFN Exposed Pad | 48-TQFN (7x7) |
||
Texas Instruments |
IC DESERIALIZER 1.82GBPS 60WQFN
|
pacchetto: 60-WFQFN Exposed Pad |
Azione2.064 |
|
1.82Gbps | FPD-Link II, LVDS | LVCMOS | 1 | 24 | 1.71 V ~ 1.89 V, 3 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 60-WFQFN Exposed Pad | 60-WQFN (9x9) |
||
Texas Instruments |
IC DESERIALIZ 40MHZ 24BIT 48TQFP
|
pacchetto: 48-TQFP |
Azione6.784 |
|
960Mbps | FPD-Link II, LVDS | LVCMOS | 1 | 24 | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TQFP | 48-TQFP (7x7) |
||
Texas Instruments |
IC SERIALIZER 10-50MHZ 32WQFN
|
pacchetto: 32-WFQFN Exposed Pad |
Azione7.836 |
|
800Mbps | Channel Link III (LVCMOS) | Channel Link III (CML) | 16 | 1 | 1.71 V ~ 1.89 V, 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 32-WFQFN Exposed Pad | 32-WQFN (5x5) |
||
Maxim Integrated |
IC SERIALIZER 1.5GBPS 24TQFN
|
pacchetto: 24-WFQFN Exposed Pad |
Azione5.520 |
|
1Mbps | - | - | - | - | 1.7 V ~ 1.9 V | -40°C ~ 115°C (TA) | Surface Mount | 24-WFQFN Exposed Pad | 24-TQFN (4x4) |
||
Texas Instruments |
IC LVDS SERDES RECEIVER 48-TSSOP
|
pacchetto: 48-TFSOP (0.240", 6.10mm Width) |
Azione113.424 |
|
1.428Gbps | LVDS | LVTTL | 3 | 21 | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.240", 6.10mm Width) | 48-TSSOP |
||
NJR Corporation/NJRC |
IC SRL/PARALLEL CONV 8BIT 14-DIP
|
pacchetto: 14-DIP (0.300", 7.62mm) |
Azione5.392 |
|
- | Serial | Parallel | 1 | 8 | 4.5 V ~ 5.5 V | -25°C ~ 85°C (TA) | Through Hole | 14-DIP (0.300", 7.62mm) | 14-DIP |
||
Texas Instruments |
IC DESERIALIZER 18BIT 48WQFN
|
pacchetto: 48-WFQFN Exposed Pad |
Azione16.908 |
|
1.2Gbps | FPD-Link II, LVDS | FPD-Link, LVDS | 1 | 4 | 1.71 V ~ 1.89 V, 3 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 48-WFQFN Exposed Pad | 48-WQFN (7x7) |
||
Texas Instruments |
IC SER/DES 10-100MHZ FPD 48WQFN
|
pacchetto: 48-WFQFN Exposed Pad |
Azione6.096 |
|
1.4Gbps | FPD-Link III, LVDS | LVCMOS | 1 | 12 | 1.71 V ~ 1.89 V, 3 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 48-WFQFN Exposed Pad | 48-WQFN (7x7) |
||
CEL |
IC DESERIALIZER LVDS 56TSSOP
|
pacchetto: 56-TFSOP (0.240", 6.10mm Width) |
Azione78.000 |
|
3.1Gbps | LVDS | CMOS/TTL | 4 | 28 | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 56-TFSOP (0.240", 6.10mm Width) | 56-TSSOP |
||
CEL |
IC DESERIALIZER LVDS 56TSSOP
|
pacchetto: 56-TFSOP (0.240", 6.10mm Width) |
Azione12.738 |
|
3.1Gbps | LVDS | CMOS/TTL | 4 | 28 | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 56-TFSOP (0.240", 6.10mm Width) | 56-TSSOP |
||
Maxim Integrated |
IC DESERIALIZER GMSL 56QFND
|
pacchetto: 56-VFQFN Exposed Pad |
Azione5.872 |
|
3.12Gbps | CML | LVCMOS | 1 | 32 | 1.7 V ~ 1.9 V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-QFND-EP (8x8) |
||
Maxim Integrated |
IC SUPERVISOR
|
pacchetto: 56-WFQFN Exposed Pad |
Azione4.608 |
|
3.12Gbps | CML | Parallel | 1 | 29 | 1.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 56-WFQFN Exposed Pad | 56-TQFN-EP (8x8) |
||
Maxim Integrated |
DE-SERIALIZER
|
pacchetto: 56-WFQFN Exposed Pad |
Azione7.376 |
|
3.12Gbps | CML | LVCMOS | 1 | 32 | 1.7 V ~ 1.9 V | -40°C ~ 105°C (TA) | Surface Mount | 56-WFQFN Exposed Pad | 56-TQFN-EP (8x8) |
||
Renesas Electronics America |
IC VIDEO SERDES LONG 16BIT 48QFN
|
pacchetto: 48-VFQFN Exposed Pad |
Azione7.376 |
|
- | LVCMOS | LVCMOS | 16/1 | 1/16 | 1.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
Maxim Integrated |
3.12 GBPS DESERIALIZER W/GMSL IN
|
pacchetto: 48-WFQFN Exposed Pad |
Azione6.912 |
|
3.12Gbps | CML | CML | 3 | 1 | 1.7V ~ 1.9V | -40°C ~ 105°C (TA) | Surface Mount | 48-WFQFN Exposed Pad | 48-TQFN-EP (7x7) |
||
Analog Devices Inc./Maxim Integrated |
SERIALIZER WITH CLOCK SYNTHESIS
|
pacchetto: - |
Request a Quote |
|
2.5Gbps | LVDS | PECL | 16 | 1 | 3V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 64-TQFP Exposed Pad | 64-TQFP-EP (10x10) |
||
Fairchild Semiconductor |
TELECOM CIRCUIT, 1-FUNC
|
pacchetto: - |
Request a Quote |
|
- | LVCMOS | LVCMOS | 12/2 | 2/12 | 1.65V ~ 3.6V, 2.5V ~ 3.6V | -30°C ~ 70°C (TA) | Surface Mount | 32-WFQFN Exposed Pad | 32-MLP (5x5) |
||
Texas Instruments |
PROTOTYPE
|
pacchetto: - |
Request a Quote |
|
2.975Gbps | FPD-Link III, LVDS | LVCMOS | 1 | 31 | 1.71V ~ 1.89V, 3V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 60-WFQFN Exposed Pad | 60-WQFN (9x9) |
||
Texas Instruments |
IC SOC PROCESSOR
|
pacchetto: - |
Request a Quote |
|
4.16Gbps | - | - | 4 | 8 | 1.045V ~ 1.155V, 1.71V ~ 1.89V | -20°C ~ 85°C (TA) | Surface Mount | 64-VFQFN Exposed Pad | 64-VQFN (9x9) |
||
Texas Instruments |
PROTOTYPE
|
pacchetto: - |
Request a Quote |
|
2.975Gbps | FPD-Link III, LVDS | LVCMOS | 1 | 24 | 1.71V ~ 1.89V, 3V ~ 3.6V | -40°C ~ 105°C | Surface Mount | 60-WFQFN Exposed Pad | 60-WQFN (9x9) |