Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Input Type | Output Type | Interface | Current - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments |
IC AMP SENSOR INTERFACE 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione5.040 |
|
Voltage | Voltage | - | 500µA | -40°C ~ 125°C | Surface Mount | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Maxim Integrated |
IC CTRLR KEY-SWITCH I2C 36-WLP
|
pacchetto: 36-WFBGA, WLCSP |
Azione7.120 |
|
Logic | Logic | I2C, 2-Wire Serial | 50µA | -40°C ~ 85°C | Surface Mount | 36-WFBGA, WLCSP | 36-WLP (2.57x2.57) |
||
Analog Devices Inc. |
IC AMP DIFF SGL SUPPLY 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione2.160 |
|
Voltage | Analog | Differential | 200µA | -40°C ~ 125°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Maxim Integrated |
IC VR SENSOR INTERFACE 16QSOP
|
pacchetto: 16-SSOP (0.154", 3.90mm Width) |
Azione3.856 |
|
Differential | Logic | Differential | 10mA | -40°C ~ 125°C | Surface Mount | 16-SSOP (0.154", 3.90mm Width) | 16-QSOP |
||
Maxim Integrated |
IC TIME-TO-DIGITAL CNVTR 32TQFN
|
pacchetto: - |
Azione6.128 |
|
Logic | CMOS | SPI | 1µA | -40°C ~ 85°C | - | - | - |
||
Maxim Integrated |
IC VR SENSOR INTERFACE 10UMAX
|
pacchetto: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
Azione9.324 |
|
Differential | Logic | Differential | 5mA | -40°C ~ 125°C | Surface Mount | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | 10-uMAX |
||
Microchip Technology |
IC THRMOCPLE TO DIG CONV 20MQFN
|
pacchetto: 20-VQFN Exposed Pad |
Azione5.216 |
|
Thermocouple | Digital | I2C | 300µA | -40°C ~ 85°C | Surface Mount | 20-VQFN Exposed Pad | 20-MQFN (5x5) |
||
Rohm Semiconductor |
IC CAP SENSOR SWITCH 8CH 32-SSOP
|
pacchetto: 32-SOP (0.213", 5.40mm Width) |
Azione5.008 |
|
Logic | Logic | Port | 550µA | -40°C ~ 85°C | Surface Mount | 32-SOP (0.213", 5.40mm Width) | 32-SSOPA |
||
Microchip Technology |
IC DRVR LVL SHIFTER
|
pacchetto: 28-UFQFN Exposed Pad |
Azione7.472 |
|
- | - | SPI | 200µA | -40°C ~ 85°C | Surface Mount | 28-UFQFN Exposed Pad | 28-UQFN (4x4) |
||
Melexis Technologies NV |
IC SENSOR INTERFACE AUTO 14SSOP
|
pacchetto: 14-SSOP (0.209", 5.30mm Width) |
Azione5.136 |
|
- | - | - | - | - | Surface Mount | 14-SSOP (0.209", 5.30mm Width) | 14-SSOP |
||
Melexis Technologies NV |
IC SENSOR INTERFACE AUTO 14SSOP
|
pacchetto: 14-SSOP (0.209", 5.30mm Width) |
Azione6.048 |
|
- | - | - | - | - | Surface Mount | 14-SSOP (0.209", 5.30mm Width) | 14-SSOP |
||
Analog Devices Inc. |
IC TRANSMITTER 4-20MA 16-CDIP
|
pacchetto: 16-CDIP (0.300", 7.62mm) |
Azione12.492 |
|
Voltage | Voltage | - | 23mA | -40°C ~ 85°C | Through Hole | 16-CDIP (0.300", 7.62mm) | 16-CDIP |
||
Microchip Technology |
IC THERMOCOUPLE TO I2C 20MQFN
|
pacchetto: 20-VQFN Exposed Pad |
Azione7.308 |
|
Thermocouple | Digital | I2C | 300µA | -40°C ~ 125°C | Surface Mount | 20-VQFN Exposed Pad | 20-MQFN (5x5) |
||
Analog Devices Inc. |
IC CCD SIGNAL PROC 12BIT 48-LQFP
|
pacchetto: 48-LQFP |
Azione21.024 |
|
Logic | Logic | 3-Wire Serial | - | -20°C ~ 85°C | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
Microchip Technology |
IC THRMOCPLE TO DIG CONV 20MQFN
|
pacchetto: 20-VQFN Exposed Pad |
Azione20.148 |
|
Thermocouple | Digital | I2C | 300µA | -40°C ~ 85°C | Surface Mount | 20-VQFN Exposed Pad | 20-MQFN (5x5) |
||
Texas Instruments |
IC PREC VOLT-CURR CONV/TX 10-SON
|
pacchetto: 10-VFDFN Exposed Pad |
Azione9.468 |
|
Voltage | Voltage | 3-Wire | 550µA | -40°C ~ 85°C | Surface Mount | 10-VFDFN Exposed Pad | 10-VSON (3x3) |
||
Renesas Electronics Corporation |
DICE (WAFER SAWN) - WAFFLE PACK
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
DICE (WAFER SAWN) - FRAME
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
IC SENSOR SIGNAL CONDITIONER
|
pacchetto: - |
Request a Quote |
|
Analog | 1-Wire®, I2C, SPI | - | 2.8 mA | -40°C ~ 125°C (TA) | Surface Mount | Die | Die |
||
Renesas Electronics Corporation |
DICE ON 725 MICRO METER WAFER WI
|
pacchetto: - |
Request a Quote |
|
Analog, Digital | 1-Wire®, I2C, SPI | - | 15 mA | -40°C ~ 125°C (TA) | Surface Mount | Die | Die |
||
Renesas Electronics Corporation |
WAFER (UNSAWN) - BOX
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Texas Instruments |
PROTOTYPE
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
PQFN / 24 / 4X4MM G1 - TAPE&REEL
|
pacchetto: - |
Request a Quote |
|
Analog, Digital | 1-Wire®, I2C, SPI | - | 18 mA | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Renesas Electronics Corporation |
DICE (WAFER SAWN) - FRAME
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
EM Microelectronic |
LINEAR IC
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
DICE (WAFER SAWN) - FRAME
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
DICE (WAFER SAWN) - FRAME
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
DICE (WAFER SAWN) - FRAME
|
pacchetto: - |
Request a Quote |
|
Capacitive | I2C, SPI | - | 1.1 mA | -40°C ~ 125°C (TA) | Surface Mount | Die | Die |