Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Input Type | Output Type | Interface | Current - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Analog Devices Inc. |
IC CCD SIGNAL PROCESSOR 40-LFCSP
|
pacchetto: 40-VFQFN Exposed Pad, CSP |
Azione56.508 |
|
Logic | Logic | 3-Wire Serial | - | -20°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad, CSP | 40-LFCSP (6x6) |
||
Maxim Integrated |
IC AUTO SNSR SIGNAL COND 16SSOP
|
pacchetto: 16-SSOP (0.209", 5.30mm Width) |
Azione5.584 |
|
Analog | Analog | - | 6mA | -40°C ~ 125°C | Surface Mount | 16-SSOP (0.209", 5.30mm Width) | 16-SSOP |
||
Maxim Integrated |
IC CTRLR KEY-SW I2C 24TQFN
|
pacchetto: 24-WFQFN Exposed Pad |
Azione5.392 |
|
Logic | Logic | I2C, 2-Wire Serial | 50µA | -40°C ~ 85°C | Surface Mount | 24-WFQFN Exposed Pad | 24-TQFN-EP (3.5x3.5) |
||
Semtech Corporation |
IC DAS PRESSURE/TEMP SENS 16MLPQ
|
pacchetto: 16-VQFN Exposed Pad |
Azione4.960 |
|
Differential | Digital | I2C | - | -40°C ~ 125°C | Surface Mount | 16-VQFN Exposed Pad | 16-MLPQ (4x4) |
||
NXP |
IC SMOKE DETECT PHOTOELEC 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione6.624 |
|
Photoelectric | Voltage | - | 8µA | -10°C ~ 60°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
NXP |
IC SMOKE DETECT IONIZATN 16-DIP
|
pacchetto: 16-DIP (0.300", 7.62mm) |
Azione67.116 |
|
Ionization | Voltage | - | 12µA | -10°C ~ 60°C | Through Hole | 16-DIP (0.300", 7.62mm) | 16-PDIP |
||
Analog Devices Inc. |
IC CCD SIGNAL PROC/GEN 64CSBGA
|
pacchetto: 64-LFBGA, CSPBGA |
Azione6.592 |
|
Logic | Logic | 3-Wire Serial | - | -20°C ~ 85°C | Surface Mount | 64-LFBGA, CSPBGA | 64-CSPBGA (9x9) |
||
Analog Devices Inc. |
IC THRMOCPLE AMP 8MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione5.472 |
|
Differential | Analog | - | 180µA | -40°C ~ 125°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Melexis Technologies NV |
IC OPTICAL PROXIMITY 24QFN
|
pacchetto: - |
Azione6.912 |
|
- | - | - | - | - | - | - | - |
||
Texas Instruments |
IC SENSOR SIGNAL COND 20SOPWRPAD
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) Exposed Pad |
Azione3.568 |
|
Logic | Logic | - | 6.8mA | -40°C ~ 125°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) Exposed Pad | 20-SO PowerPad |
||
Maxim Integrated |
IC PRECISION SIGNAL COND WLP
|
pacchetto: - |
Azione4.256 |
|
- | - | - | - | - | - | - | - |
||
Texas Instruments |
IC PROG SENSOR SGL COND 10SON
|
pacchetto: 10-VFDFN Exposed Pad |
Azione10.632 |
|
Voltage | Voltage | UART | 1.6mA | -40°C ~ 125°C | Surface Mount | 10-VFDFN Exposed Pad | 10-VSON (3x4) |
||
Microchip Technology |
IC ION SMOKE DETECT ASIC 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione2.592 |
|
Ionization | Voltage | - | 3.8µA | -10°C ~ 60°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Microchip Technology |
IC SMOKE DETECTOR CMOS 16-SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione2.832 |
|
Photoelectric | Voltage | - | 8µA | -25°C ~ 75°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Analog Devices Inc. |
IC THRMOCPLE AMP 8MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione6.504 |
|
Differential | Analog | - | 180µA | -40°C ~ 125°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Maxim Integrated |
IC TRANSLATOR/SERIALIZER 28TSSOP
|
pacchetto: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad |
Azione6.552 |
|
Analog | Digital | SPI | 1.6mA | -40°C ~ 125°C | Surface Mount | 28-TSSOP (0.173", 4.40mm Width) Exposed Pad | 28-TSSOP |
||
Texas Instruments |
IC AFE ULTRA SENSING 28TSSOP
|
pacchetto: 28-TSSOP (0.173", 4.40mm Width) |
Azione3.280 |
|
Ultrasound | Digital | SPI | 5mA | -40°C ~ 125°C | Surface Mount | 28-TSSOP (0.173", 4.40mm Width) | 28-TSSOP |
||
Maxim Integrated |
IC THERMOCOUP TO DGTL 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.904 |
|
Thermocouple (K) | Digital | SPI | 1.5mA | -20°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Analog Devices Inc. |
IC THRMOCPLE AMP 8MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione8.676 |
|
Differential | Analog | - | 180µA | -40°C ~ 125°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Texas Instruments |
IC ADAPTIVE SENSE AMP 14SOIC
|
pacchetto: 14-SOIC (0.154", 3.90mm Width) |
Azione26.160 |
|
Logic | Logic | - | 6mA | -40°C ~ 125°C | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC |
||
Broadcom Limited |
IC PROXIMITY SENSOR OPT 8QFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione3.309.384 |
|
Logic | Analog, Digital | - | - | -40°C ~ 105°C | Surface Mount | 8-UFDFN Exposed Pad | 8-QFN (2x2) |
||
Renesas Electronics Corporation |
IC CAP SENSOR SIGNAL CONDITIONER
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
DICE (WAFER SAWN) - FRAME
|
pacchetto: - |
Request a Quote |
|
Differential | I2C, Serial, SPI | - | 1.5 mA | -40°C ~ 125°C (TA) | Surface Mount | Die | Die |
||
Renesas Electronics Corporation |
DICE (WAFER SAWN) - FRAME
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Analog Devices Inc./Maxim Integrated |
CORTEX M4F 96MHZ ME11, TQFN 3X3
|
pacchetto: - |
Azione7.434 |
|
Digital | I2C | - | - | -40°C ~ 105°C (TA) | Surface Mount | 24-WFQFN Exposed Pad | 24-TQFN (3x3) |
||
Analog Devices Inc. |
IC CCD SIGNAL PROCESSOR 56-LFCSP
|
pacchetto: - |
Request a Quote |
|
Logic | Logic | - | 30 mA | -20°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad, CSP | 56-LFCSP-VQ (8x8) |
||
Renesas Electronics Corporation |
DICE (WAFER SAWN) - FRAME
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
OPN - WAFER (UNSAWN) - BOX
|
pacchetto: - |
Request a Quote |
|
Capacitive | I2C, SPI | - | 1.1 mA | -40°C ~ 125°C (TA) | Surface Mount | Die | Die |