Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Input Type | Output Type | Interface | Current - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
AKM Semiconductor Inc. |
IC INTERFACE PRESS SENSOR WAFER
|
pacchetto: Die |
Azione6.784 |
|
Analog Voltage | Analog Voltage | Serial | 2.85mA | -40°C ~ 105°C | Surface Mount | Die | Wafer |
||
Semtech Corporation |
IC DAS PRESSURE/TEMP SENS 12MLPD
|
pacchetto: 12-WFDFN Exposed Pad |
Azione26.820 |
|
Differential | Digital | I2C | - | -40°C ~ 125°C | Surface Mount | 12-WFDFN Exposed Pad | 12-MLPD-WEP (4x4) |
||
Texas Instruments |
IC 4-20MA I-TRANSMITTER 14-SOIC
|
pacchetto: 14-SOIC (0.154", 3.90mm Width) |
Azione3.632 |
|
Voltage | Voltage | 2-Wire | 20mA | -40°C ~ 85°C | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC |
||
Texas Instruments |
IC AFE ULTRA SENSING 28TSSOP
|
pacchetto: 28-TSSOP (0.173", 4.40mm Width) |
Azione3.360 |
|
Ultrasound | Digital | SPI | 5mA | -40°C ~ 125°C | Surface Mount | 28-TSSOP (0.173", 4.40mm Width) | 28-TSSOP |
||
Linear Technology |
IC COMPENSATR THERM MCRPWR 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.568 |
|
Voltage | Voltage | - | 150µA | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
NXP |
IC DSI SLAVE SENSOR 16-SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione65.268 |
|
Logic | Logic | Parallel | 250mA | -40°C ~ 150°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
STMicroelectronics |
IC SMART SENSOR II 2CH 16QFN
|
pacchetto: 16-VQFN Exposed Pad |
Azione17.280 |
|
Analog | Digital | - | - | -40°C ~ 85°C | Surface Mount | 16-VQFN Exposed Pad | 16-QFN (4x4) |
||
Microchip Technology |
IC SMOKE DETECT PHOTO MEM 16DIP
|
pacchetto: 16-DIP (0.300", 7.62mm) |
Azione4.256 |
|
Photoelectric | Voltage | - | 6µA | -25°C ~ 75°C | Through Hole | 16-DIP (0.300", 7.62mm) | 16-PDIP |
||
Microchip Technology |
IC SMOKE DETECTOR CMOS 16-SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione6.112 |
|
Photoelectric | Voltage | - | 4µA | -25°C ~ 75°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Microchip Technology |
IC SMOKE DETECTOR CMOS 16-SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione7.344 |
|
Photoelectric | Voltage | - | 8µA | -25°C ~ 75°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Maxim Integrated |
TIME-TO-DIGITAL CONVERTER WITH G
|
pacchetto: 40-WFQFN Exposed Pad |
Azione6.048 |
|
CMOS | CMOS | 4-Wire SPI Serial | 62µA | -40°C ~ 85°C | Surface Mount | 40-WFQFN Exposed Pad | 40-TQFN (5x5) |
||
Maxim Integrated |
IC CONV THERMOCOUPLE-DGTL 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.248 |
|
Thermocouple (Multiple) | Digital | SPI | 900µA | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Texas Instruments |
IC OP AMP AUTO-ZERO SGL 10VSSOP
|
pacchetto: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
Azione2.112 |
|
Voltage | Voltage | UART | 1.6mA | -40°C ~ 125°C | Surface Mount | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | 10-VSSOP |
||
Analog Devices Inc. |
IC PROCESSOR CCD 14BIT 48-LFCSP
|
pacchetto: 48-VFQFN Exposed Pad, CSP |
Azione19.716 |
|
Logic | Logic | 3-Wire Serial | 48mA | -25°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad, CSP | 48-LFCSP-VQ (7x7) |
||
Analog Devices Inc. |
IC CCDSP DUAL 14BIT 84CSBGA
|
pacchetto: 84-LFBGA, CSPBGA |
Azione14.664 |
|
Serial | LVDS | Serial | - | -25°C ~ 85°C | Surface Mount | 84-LFBGA, CSPBGA | 84-CSPBGA (6x6) |
||
Diodes Incorporated |
PIR CONTROLLER DIP-16
|
pacchetto: 16-DIP (0.300", 7.62mm) |
Azione6.736 |
|
CMOS | - | - | 100µA | -25°C ~ 70°C (TA) | Through Hole | 16-DIP (0.300", 7.62mm) | 16-DIP |
||
Triad Semiconductor, Inc. |
INFRARED RECEIVER IC FOR STEAMVR
|
pacchetto: - |
Azione233.772 |
|
Photodiode | Digital | - | 7 mA | 0°C ~ 85°C (TA) | Surface Mount | 9-UFBGA, WLCSP | 9-WLCSP (1.66x1.66) |
||
Renesas Electronics Corporation |
VIDEO IMAGE UPSCALER
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
WAFER (UNSAWN) - BOX
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
SMART SENSOR -> BUMPED DIE
|
pacchetto: - |
Request a Quote |
|
Analog, Digital | 1-Wire®, I2C, SPI | - | 15 mA | -40°C ~ 125°C (TA) | - | - | - |
||
Renesas Electronics Corporation |
DICE ON 725 MICRO METER WAFER NO
|
pacchetto: - |
Request a Quote |
|
Analog, Digital | 1-Wire®, I2C, SPI | - | 15 mA | -40°C ~ 125°C (TA) | Surface Mount | Die | Die |
||
Renesas Electronics Corporation |
WAFER (UNSAWN) - WAFER BOX
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
DICE (WAFER SAWN) - WAFFLE PACK
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Analog Devices Inc. |
IC CCD SIGNAL PROC 12BIT 48-LQFP
|
pacchetto: - |
Request a Quote |
|
Logic | Logic | - | - | -20°C ~ 85°C | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
Renesas Electronics Corporation |
WAFER (UNSAWN) - BOX
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Melexis Technologies NV |
SENSOR LIGHT PROXIMITY 24QFN
|
pacchetto: - |
Request a Quote |
|
- | SPI | - | 6 mA | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Analog Devices Inc. |
IC IMAGE SGNL PROC 12BIT 48-LQFP
|
pacchetto: - |
Request a Quote |
|
Logic | Logic | - | - | -20°C ~ 85°C | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
Renesas Electronics Corporation |
OPN - WAFER (UNSAWN) - BOX
|
pacchetto: - |
Request a Quote |
|
Capacitive | I2C, SPI | - | 1.1 mA | -40°C ~ 125°C (TA) | Surface Mount | Die | Die |