Pagina 60 - Embedded - Microprocessori | Circuiti integrati (CI) | Heisener Electronics
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Embedded - Microprocessori

Record 8.238
Pagina  60/295
Immagine
Numero di parte
Produttore
Descrizione
pacchetto
Azione
Quantità
Number of Cores/Bus Width
Speed
Co-Processors/DSP
RAM Controllers
Graphics Acceleration
Display & Interface Controllers
Ethernet
SATA
USB
Voltage - I/O
Operating Temperature
Security Features
Package / Case
Supplier Device Package
96MP2DD-21FA-2M7T
Advantech Corp

IC PROCESSOR CORE 2 DUO DT

  • Core Processor: Core2 DUO DT
  • Number of Cores/Bus Width: 2 Core, 64-Bit
  • Speed: 2.13GHz
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: 775-LGA
pacchetto: -
Azione7.616
2 Core, 64-Bit
2.13GHz
-
-
-
-
-
-
-
-
-
-
-
775-LGA
MPC8545PXAQGD
NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

  • Core Processor: PowerPC e500
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.0GHz
  • Co-Processors/DSP: Signal Processing; SPE
  • RAM Controllers: DDR, DDR2, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (4)
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 783-BBGA, FCBGA
  • Supplier Device Package: 783-FCPBGA (29x29)
pacchetto: 783-BBGA, FCBGA
Azione3.392
1 Core, 32-Bit
1.0GHz
Signal Processing; SPE
DDR, DDR2, SDRAM
No
-
10/100/1000 Mbps (4)
-
-
1.8V, 2.5V, 3.3V
0°C ~ 105°C (TA)
-
783-BBGA, FCBGA
783-FCPBGA (29x29)
IDT79RC64T574-200DZ
IDT, Integrated Device Technology Inc

IC MPU MIPS-I 200MHZ 128QFP

  • Core Processor: MIPS-I
  • Number of Cores/Bus Width: 1 Core, 64-Bit
  • Speed: 200MHz
  • Co-Processors/DSP: System Control; CP0
  • RAM Controllers: SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 85°C (TC)
  • Security Features: -
  • Package / Case: 128-BQFP Exposed Pad
  • Supplier Device Package: 128-PQFP (28x28)
pacchetto: 128-BQFP Exposed Pad
Azione5.472
1 Core, 64-Bit
200MHz
System Control; CP0
SDRAM
No
-
-
-
-
2.5V, 3.3V
0°C ~ 85°C (TC)
-
128-BQFP Exposed Pad
128-PQFP (28x28)
hot XPC823ZT66B2T
NXP

IC MPU MPC8XX 66MHZ 256BGA

  • Core Processor: PowerPC
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 66MHz
  • Co-Processors/DSP: Communications; RISC CPM
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: LCD, Video
  • Ethernet: 10 Mbps (1)
  • SATA: -
  • USB: USB 1.x (1)
  • Voltage - I/O: 3.3V
  • Operating Temperature: 0°C ~ 95°C (TA)
  • Security Features: -
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-PBGA (23x23)
pacchetto: 256-BGA
Azione7.296
1 Core, 32-Bit
66MHz
Communications; RISC CPM
DRAM
No
LCD, Video
10 Mbps (1)
-
USB 1.x (1)
3.3V
0°C ~ 95°C (TA)
-
256-BGA
256-PBGA (23x23)
MPC8347VRAGD
NXP

IC MPU MPC83XX 400MHZ 620BGA

  • Core Processor: PowerPC e300
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 400MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: -
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 620-BBGA Exposed Pad
  • Supplier Device Package: 620-PBGA (29x29)
pacchetto: 620-BBGA Exposed Pad
Azione5.728
1 Core, 32-Bit
400MHz
-
DDR
No
-
10/100/1000 Mbps (2)
-
USB 2.0 + PHY (2)
2.5V, 3.3V
0°C ~ 105°C (TA)
-
620-BBGA Exposed Pad
620-PBGA (29x29)
hot MPC603RRX266LC
NXP

IC MPU MPC6XX 266MHZ 255FCCBGA

  • Core Processor: PowerPC 603e
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 266MHz
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 255-BCBGA Exposed Pad
  • Supplier Device Package: 255-FCCBGA (21x21)
pacchetto: 255-BCBGA Exposed Pad
Azione6.160
1 Core, 32-Bit
266MHz
-
-
No
-
-
-
-
3.3V
0°C ~ 105°C (TA)
-
255-BCBGA Exposed Pad
255-FCCBGA (21x21)
KMPC885ZP80
NXP

IC MPU MPC8XX 80MHZ 357BGA

  • Core Processor: MPC8xx
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 80MHz
  • Co-Processors/DSP: Communications; CPM, Security; SEC
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10 Mbps (3), 10/100 Mbps (2)
  • SATA: -
  • USB: USB 2.0 (1)
  • Voltage - I/O: 3.3V
  • Operating Temperature: 0°C ~ 95°C (TA)
  • Security Features: Cryptography
  • Package / Case: 357-BBGA
  • Supplier Device Package: 357-PBGA (25x25)
pacchetto: 357-BBGA
Azione7.232
1 Core, 32-Bit
80MHz
Communications; CPM, Security; SEC
DRAM
No
-
10 Mbps (3), 10/100 Mbps (2)
-
USB 2.0 (1)
3.3V
0°C ~ 95°C (TA)
Cryptography
357-BBGA
357-PBGA (25x25)
KMPC862PVR80B
NXP

IC MPU MPC8XX 80MHZ 357BGA

  • Core Processor: MPC8xx
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 80MHz
  • Co-Processors/DSP: Communications; CPM
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10 Mbps (4), 10/100 Mbps (1)
  • SATA: -
  • USB: -
  • Voltage - I/O: 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 357-BBGA
  • Supplier Device Package: 357-PBGA (25x25)
pacchetto: 357-BBGA
Azione6.528
1 Core, 32-Bit
80MHz
Communications; CPM
DRAM
No
-
10 Mbps (4), 10/100 Mbps (1)
-
-
3.3V
0°C ~ 105°C (TA)
-
357-BBGA
357-PBGA (25x25)
XPC8255CVVIFBC
NXP

IC MPU MPC82XX 200MHZ 408TBGA

  • Core Processor: PowerPC G2
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 200MHz
  • Co-Processors/DSP: Communications; RISC CPM
  • RAM Controllers: DRAM, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100 Mbps (3)
  • SATA: -
  • USB: -
  • Voltage - I/O: 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 480-LBGA
  • Supplier Device Package: 408-TBGA (37.5x37.5)
pacchetto: 480-LBGA
Azione5.104
1 Core, 32-Bit
200MHz
Communications; RISC CPM
DRAM, SDRAM
No
-
10/100 Mbps (3)
-
-
3.3V
-40°C ~ 105°C (TA)
-
480-LBGA
408-TBGA (37.5x37.5)
XC850DECVR50BUR2
NXP

IC MPU MPC8XX 50MHZ 256BGA

  • Core Processor: MPC8xx
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 50MHz
  • Co-Processors/DSP: Communications; CPM
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10 Mbps (1)
  • SATA: -
  • USB: USB 1.x (1)
  • Voltage - I/O: 3.3V
  • Operating Temperature: -40°C ~ 95°C (TA)
  • Security Features: -
  • Package / Case: 256-BBGA
  • Supplier Device Package: 256-PBGA (23x23)
pacchetto: 256-BBGA
Azione5.760
1 Core, 32-Bit
50MHz
Communications; CPM
DRAM
No
-
10 Mbps (1)
-
USB 1.x (1)
3.3V
-40°C ~ 95°C (TA)
-
256-BBGA
256-PBGA (23x23)
MC7447AVS1000LB
NXP

IC MPU MPC74XX 1.0GHZ 360FCCLGA

  • Core Processor: PowerPC G4
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.0GHz
  • Co-Processors/DSP: Multimedia; SIMD
  • RAM Controllers: -
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.8V, 2.5V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 360-CLGA, FCCLGA
  • Supplier Device Package: 360-FCCLGA (25x25)
pacchetto: 360-CLGA, FCCLGA
Azione3.248
1 Core, 32-Bit
1.0GHz
Multimedia; SIMD
-
No
-
-
-
-
1.8V, 2.5V
0°C ~ 105°C (TA)
-
360-CLGA, FCCLGA
360-FCCLGA (25x25)
hot MC7447AHX1167NB
NXP

IC MPU MPC74XX 1.167GHZ 360BGA

  • Core Processor: PowerPC G4
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.167GHZ
  • Co-Processors/DSP: Multimedia; SIMD
  • RAM Controllers: -
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.8V, 2.5V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 360-BCBGA, FCCBGA
  • Supplier Device Package: 360-FCCBGA (25x25)
pacchetto: 360-BCBGA, FCCBGA
Azione5.728
1 Core, 32-Bit
1.167GHZ
Multimedia; SIMD
-
No
-
-
-
-
1.8V, 2.5V
0°C ~ 105°C (TA)
-
360-BCBGA, FCCBGA
360-FCCBGA (25x25)
hot MPC860DEZQ50D4
NXP

IC MPU MPC8XX 50MHZ 357BGA

  • Core Processor: MPC8xx
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 50MHz
  • Co-Processors/DSP: Communications; CPM
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10 Mbps (2)
  • SATA: -
  • USB: -
  • Voltage - I/O: 3.3V
  • Operating Temperature: 0°C ~ 95°C (TA)
  • Security Features: -
  • Package / Case: 357-BBGA
  • Supplier Device Package: 357-PBGA (25x25)
pacchetto: 357-BBGA
Azione4.784
1 Core, 32-Bit
50MHz
Communications; CPM
DRAM
No
-
10 Mbps (2)
-
-
3.3V
0°C ~ 95°C (TA)
-
357-BBGA
357-PBGA (25x25)
hot MPC8343VRAGDB
NXP

IC MPU MPC83XX 400MHZ 620BGA

  • Core Processor: PowerPC e300
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 400MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (3)
  • SATA: -
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 620-BBGA Exposed Pad
  • Supplier Device Package: 620-PBGA (29x29)
pacchetto: 620-BBGA Exposed Pad
Azione4.336
1 Core, 32-Bit
400MHz
-
DDR, DDR2
No
-
10/100/1000 Mbps (3)
-
USB 2.0 + PHY (2)
1.8V, 2.5V, 3.3V
0°C ~ 105°C (TA)
-
620-BBGA Exposed Pad
620-PBGA (29x29)
hot MC9328MX21CVM
NXP

IC MPU I.MX21 266MHZ 289MAPBGA

  • Core Processor: ARM926EJ-S
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 266MHz
  • Co-Processors/DSP: -
  • RAM Controllers: SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: Keypad, LCD
  • Ethernet: -
  • SATA: -
  • USB: USB 1.x (2)
  • Voltage - I/O: 1.8V, 3.0V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Security Features: -
  • Package / Case: 289-LFBGA
  • Supplier Device Package: -
pacchetto: 289-LFBGA
Azione4.144
1 Core, 32-Bit
266MHz
-
SDRAM
No
Keypad, LCD
-
-
USB 1.x (2)
1.8V, 3.0V
-40°C ~ 85°C (TA)
-
289-LFBGA
-
Z8S18020FEC00TR
Zilog

IC MPU Z180 20MHZ 80QFP

  • Core Processor: Z8S180
  • Number of Cores/Bus Width: 1 Core, 8-Bit
  • Speed: 20MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 5.0V
  • Operating Temperature: -40°C ~ 100°C (TA)
  • Security Features: -
  • Package / Case: 80-BQFP
  • Supplier Device Package: 80-QFP
pacchetto: 80-BQFP
Azione4.352
1 Core, 8-Bit
20MHz
-
DRAM
No
-
-
-
-
5.0V
-40°C ~ 100°C (TA)
-
80-BQFP
80-QFP
hot MPC8275VRMIBA
NXP

IC MPU MPC82XX 266MHZ 516BGA

  • Core Processor: PowerPC G2_LE
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 266MHz
  • Co-Processors/DSP: Communications; RISC CPM
  • RAM Controllers: DRAM, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100 Mbps (3)
  • SATA: -
  • USB: USB 2.0 (1)
  • Voltage - I/O: 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 516-BBGA
  • Supplier Device Package: 516-FPBGA (27x27)
pacchetto: 516-BBGA
Azione4.016
1 Core, 32-Bit
266MHz
Communications; RISC CPM
DRAM, SDRAM
No
-
10/100 Mbps (3)
-
USB 2.0 (1)
3.3V
0°C ~ 105°C (TA)
-
516-BBGA
516-FPBGA (27x27)
hot P1020NSE2HFB
NXP

IC MPU Q OR IQ 800MHZ 689TEBGA

  • Core Processor: PowerPC e500v2
  • Number of Cores/Bus Width: 2 Core, 32-Bit
  • Speed: 800MHz
  • Co-Processors/DSP: Security; SEC 3.3
  • RAM Controllers: DDR2, DDR3
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (3)
  • SATA: -
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 125°C (TA)
  • Security Features: Cryptography, Random Number Generator
  • Package / Case: 689-BBGA Exposed Pad
  • Supplier Device Package: 689-TEPBGA II (31x31)
pacchetto: 689-BBGA Exposed Pad
Azione4.976
2 Core, 32-Bit
800MHz
Security; SEC 3.3
DDR2, DDR3
No
-
10/100/1000 Mbps (3)
-
USB 2.0 + PHY (2)
2.5V, 3.3V
0°C ~ 125°C (TA)
Cryptography, Random Number Generator
689-BBGA Exposed Pad
689-TEPBGA II (31x31)
P2020NXN2KFC
NXP

IC MPU Q OR IQ 1.2GHZ 689TEBGA

  • Core Processor: PowerPC e500v2
  • Number of Cores/Bus Width: 2 Core, 32-Bit
  • Speed: 1.2GHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR2, DDR3
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (3)
  • SATA: -
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: -
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Security Features: -
  • Package / Case: 689-BBGA Exposed Pad
  • Supplier Device Package: 689-TEPBGA II (31x31)
pacchetto: 689-BBGA Exposed Pad
Azione7.344
2 Core, 32-Bit
1.2GHz
-
DDR2, DDR3
No
-
10/100/1000 Mbps (3)
-
USB 2.0 + PHY (2)
-
-40°C ~ 125°C (TA)
-
689-BBGA Exposed Pad
689-TEPBGA II (31x31)
MCIMX6Y7DVK05AA
NXP

I.MX 32-BIT MPU ARM CORTEX-A7 C

  • Core Processor: ARM® Cortex®-A7
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 528MHz
  • Co-Processors/DSP: Multimedia; NEON™ MPE
  • RAM Controllers: LPDDR2, DDR3, DDR3L
  • Graphics Acceleration: No
  • Display & Interface Controllers: Electrophoretic, LCD
  • Ethernet: 10/100 Mbps (2)
  • SATA: -
  • USB: USB 2.0 OTG + PHY (2)
  • Voltage - I/O: 1.8V, 2.8V, 3.3V
  • Operating Temperature: 0°C ~ 95°C (TJ)
  • Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
  • Package / Case: 272-LFBGA
  • Supplier Device Package: 272-MAPBGA (9x9)
pacchetto: 272-LFBGA
Azione6.816
1 Core, 32-Bit
528MHz
Multimedia; NEON™ MPE
LPDDR2, DDR3, DDR3L
No
Electrophoretic, LCD
10/100 Mbps (2)
-
USB 2.0 OTG + PHY (2)
1.8V, 2.8V, 3.3V
0°C ~ 95°C (TJ)
A-HAB, ARM TZ, CSU, SJC, SNVS
272-LFBGA
272-MAPBGA (9x9)
MCF5206CFT16A
Motorola

IC MPU MCF520X 16MHZ 160QFP

  • Core Processor: Coldfire V2
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 16MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DRAM
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 5V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Security Features: -
  • Package / Case: 160-BQFP
  • Supplier Device Package: 160-QFP (28x28)
pacchetto: -
Request a Quote
1 Core, 32-Bit
16MHz
-
DRAM
-
-
-
-
-
5V
-40°C ~ 85°C (TA)
-
160-BQFP
160-QFP (28x28)
R9A09G057H44GBG-AC0
Renesas Electronics Corporation

RZ/V2H CA55 QUAD ISP&GPU 19MM BU

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
pacchetto: -
Request a Quote
-
-
-
-
-
-
-
-
-
-
-
-
-
-
RH80536GC0292M
Intel

IC MPU 735 1.7GHZ 478FCPGA

  • Core Processor: Intel® Pentium® M Processor 735
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.7GHz
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 0.988V, 1.34V
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Security Features: -
  • Package / Case: 478-BFCPGA
  • Supplier Device Package: 478-FCPGA (35x35)
pacchetto: -
Request a Quote
1 Core, 32-Bit
1.7GHz
-
-
-
-
-
-
-
0.988V, 1.34V
0°C ~ 100°C (TJ)
-
478-BFCPGA
478-FCPGA (35x35)
HD64F3642AWV
Renesas Electronics Corporation

8-BIT, FLASH, 8MHZ

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
pacchetto: -
Request a Quote
-
-
-
-
-
-
-
-
-
-
-
-
-
-
DRA744BJGABCQ1
Texas Instruments

IC MPU DRA74X CORTEX-A15 760BGA

  • Core Processor: ARM® Cortex®-A15
  • Number of Cores/Bus Width: 2 Core, 32-Bit
  • Speed: 1GHz
  • Co-Processors/DSP: ARM® Cortex®-M4, BB2D, GPU, IVA
  • RAM Controllers: DDR2, DDR3, DDR3L
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: HDMI, LCD
  • Ethernet: 10/100/1000Mbps (1), 1Gbps (2)
  • SATA: SATA
  • USB: USB 2.0 (3), USB 3.0 (1)
  • Voltage - I/O: 1.35V, 1.8V, 3.3V
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Security Features: Cryptography, Debug Security, Device Identity, Isolation Firewalls, Secure Boot, Secure Storage, Software IP Protection
  • Package / Case: 760-BFBGA, FCBGA
  • Supplier Device Package: 760-FCBGA (23x23)
pacchetto: -
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2 Core, 32-Bit
1GHz
ARM® Cortex®-M4, BB2D, GPU, IVA
DDR2, DDR3, DDR3L
Yes
HDMI, LCD
10/100/1000Mbps (1), 1Gbps (2)
SATA
USB 2.0 (3), USB 3.0 (1)
1.35V, 1.8V, 3.3V
-40°C ~ 125°C (TJ)
Cryptography, Debug Security, Device Identity, Isolation Firewalls, Secure Boot, Secure Storage, Software IP Protection
760-BFBGA, FCBGA
760-FCBGA (23x23)
25PPC440GX-3CA500C
IBM

IC MPU 500MHZ 552CBGA

  • Core Processor: PowerPC 440GX
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 500MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 3.3V
  • Operating Temperature: -40°C ~ 85°C (TC)
  • Security Features: -
  • Package / Case: 552-BCBGA
  • Supplier Device Package: 552-CBGA (25x25)
pacchetto: -
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1 Core, 32-Bit
500MHz
-
DDR, SDRAM
No
-
-
-
-
3.3V
-40°C ~ 85°C (TC)
-
552-BCBGA
552-CBGA (25x25)
MIMX8UD5DVK08SC
NXP

I.MX8ULP,DUAL 800MHZ

  • Core Processor: ARM® Cortex®-A35
  • Number of Cores/Bus Width: 2 Core, 64-Bit
  • Speed: 800MHz
  • Co-Processors/DSP: 3D GPU, ARM® Cortex®-M33, Hi-Fi4 DSP
  • RAM Controllers: LPDDR3, LPDDR4
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: MIPI-CSI, MIPI-DSI
  • Ethernet: 10/100Mbps
  • SATA: -
  • USB: USB 2.0 (2)
  • Voltage - I/O: -
  • Operating Temperature: 0°C ~ 95°C (TJ)
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
pacchetto: -
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2 Core, 64-Bit
800MHz
3D GPU, ARM® Cortex®-M33, Hi-Fi4 DSP
LPDDR3, LPDDR4
Yes
MIPI-CSI, MIPI-DSI
10/100Mbps
-
USB 2.0 (2)
-
0°C ~ 95°C (TJ)
-
-
-
B30688-D5354-X923
Qualcomm

MODULES

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
pacchetto: -
Request a Quote
-
-
-
-
-
-
-
-
-
-
-
-
-
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