Pagina 33 - Embedded - Microprocessori | Circuiti integrati (CI) | Heisener Electronics
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Embedded - Microprocessori

Record 8.238
Pagina  33/295
Immagine
Numero di parte
Produttore
Descrizione
pacchetto
Azione
Quantità
Number of Cores/Bus Width
Speed
Co-Processors/DSP
RAM Controllers
Graphics Acceleration
Display & Interface Controllers
Ethernet
SATA
USB
Voltage - I/O
Operating Temperature
Security Features
Package / Case
Supplier Device Package
hot AM1808BZCEA3
Texas Instruments

IC MPU SITARA 375MHZ 361NFBGA

  • Core Processor: ARM926EJ-S
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 375MHz
  • Co-Processors/DSP: System Control; CP15
  • RAM Controllers: LPDDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: LCD
  • Ethernet: 10/100 Mbps (1)
  • SATA: SATA 3Gbps (1)
  • USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1)
  • Voltage - I/O: 1.8V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TJ)
  • Security Features: -
  • Package / Case: 361-LFBGA
  • Supplier Device Package: 361-NFBGA (13x13)
pacchetto: 361-LFBGA
Azione4.416
1 Core, 32-Bit
375MHz
System Control; CP15
LPDDR, DDR2
No
LCD
10/100 Mbps (1)
SATA 3Gbps (1)
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
1.8V, 3.3V
-40°C ~ 105°C (TJ)
-
361-LFBGA
361-NFBGA (13x13)
MPC8535CVTANGA
NXP

IC MPU MPC85XX 800MHZ 783FCBGA

  • Core Processor: PowerPC e500
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 800MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR2, DDR3
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: SATA 3Gbps (1)
  • USB: USB 2.0 (2)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 783-BBGA, FCBGA
  • Supplier Device Package: 783-FCPBGA (29x29)
pacchetto: 783-BBGA, FCBGA
Azione2.368
1 Core, 32-Bit
800MHz
-
DDR2, DDR3
No
-
10/100/1000 Mbps (2)
SATA 3Gbps (1)
USB 2.0 (2)
1.8V, 2.5V, 3.3V
-40°C ~ 105°C (TA)
-
783-BBGA, FCBGA
783-FCPBGA (29x29)
KMPC8540VT833LC
NXP

IC MPU MPC85XX 833MHZ 783FCBGA

  • Core Processor: PowerPC e500
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 833MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100 Mbps (1), 10/100/1000 Mbps (2)
  • SATA: -
  • USB: -
  • Voltage - I/O: 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 783-FCPBGA (29x29)
pacchetto: 784-BBGA, FCBGA
Azione2.736
1 Core, 32-Bit
833MHz
-
DDR, SDRAM
No
-
10/100 Mbps (1), 10/100/1000 Mbps (2)
-
-
2.5V, 3.3V
0°C ~ 105°C (TA)
-
784-BBGA, FCBGA
783-FCPBGA (29x29)
MPC8535CVTATHA
NXP

IC MPU MPC85XX 1.25GHZ 783FCBGA

  • Core Processor: PowerPC e500
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.25GHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR2, DDR3
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: SATA 3Gbps (1)
  • USB: USB 2.0 (2)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 783-BBGA, FCBGA
  • Supplier Device Package: 783-FCPBGA (29x29)
pacchetto: 783-BBGA, FCBGA
Azione3.088
1 Core, 32-Bit
1.25GHz
-
DDR2, DDR3
No
-
10/100/1000 Mbps (2)
SATA 3Gbps (1)
USB 2.0 (2)
1.8V, 2.5V, 3.3V
-40°C ~ 105°C (TA)
-
783-BBGA, FCBGA
783-FCPBGA (29x29)
KMC8358CZUAGDGA
NXP

IC MPU MPC83XX 400MHZ 740TBGA

  • Core Processor: PowerPC e300
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 400MHz
  • Co-Processors/DSP: Communications; QUICC Engine
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (1)
  • SATA: -
  • USB: USB 1.x (1)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 740-LBGA
  • Supplier Device Package: 740-TBGA (37.5x37.5)
pacchetto: 740-LBGA
Azione6.080
1 Core, 32-Bit
400MHz
Communications; QUICC Engine
DDR, DDR2
No
-
10/100/1000 Mbps (1)
-
USB 1.x (1)
1.8V, 2.5V, 3.3V
-40°C ~ 105°C (TA)
-
740-LBGA
740-TBGA (37.5x37.5)
KMPC8321VRAFDC
NXP

IC MPU MPC83XX 333MHZ 516BGA

  • Core Processor: PowerPC e300c2
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 333MHz
  • Co-Processors/DSP: Communications; QUICC Engine
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100 Mbps (3)
  • SATA: -
  • USB: USB 2.0 (1)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 516-BBGA
  • Supplier Device Package: 516-FPBGA (27x27)
pacchetto: 516-BBGA
Azione5.376
1 Core, 32-Bit
333MHz
Communications; QUICC Engine
DDR, DDR2
No
-
10/100 Mbps (3)
-
USB 2.0 (1)
1.8V, 2.5V, 3.3V
0°C ~ 105°C (TA)
-
516-BBGA
516-FPBGA (27x27)
MPC8543HXANG
NXP

IC MPU MPC85XX 800MHZ 783FCBGA

  • Core Processor: PowerPC e500
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 800MHz
  • Co-Processors/DSP: Signal Processing; SPE
  • RAM Controllers: DDR, DDR2, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (4)
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 783-BBGA, FCBGA
  • Supplier Device Package: 783-FCPBGA (29x29)
pacchetto: 783-BBGA, FCBGA
Azione2.224
1 Core, 32-Bit
800MHz
Signal Processing; SPE
DDR, DDR2, SDRAM
No
-
10/100/1000 Mbps (4)
-
-
1.8V, 2.5V, 3.3V
0°C ~ 105°C (TA)
-
783-BBGA, FCBGA
783-FCPBGA (29x29)
MPC8349ZUAGDB
NXP

IC MPU MPC83XX 400MHZ 672TBGA

  • Core Processor: PowerPC e300
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 400MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: -
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 672-LBGA
  • Supplier Device Package: 672-TBGA (35x35)
pacchetto: 672-LBGA
Azione4.032
1 Core, 32-Bit
400MHz
-
DDR, DDR2
No
-
10/100/1000 Mbps (2)
-
USB 2.0 + PHY (2)
1.8V, 2.5V, 3.3V
0°C ~ 105°C (TA)
-
672-LBGA
672-TBGA (35x35)
MPC8555PXAQF
NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

  • Core Processor: PowerPC e500
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.0GHz
  • Co-Processors/DSP: Communications; CPM
  • RAM Controllers: DDR, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: -
  • USB: USB 2.0 (1)
  • Voltage - I/O: 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 783-BBGA, FCBGA
  • Supplier Device Package: 783-FCPBGA (29x29)
pacchetto: 783-BBGA, FCBGA
Azione4.960
1 Core, 32-Bit
1.0GHz
Communications; CPM
DDR, SDRAM
No
-
10/100/1000 Mbps (2)
-
USB 2.0 (1)
2.5V, 3.3V
0°C ~ 105°C (TA)
-
783-BBGA, FCBGA
783-FCPBGA (29x29)
hot MC68LC060BRC66
NXP

IC MPU M680X0 66MHZ 206PGA

  • Core Processor: 68060
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 66MHz
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 5.0V
  • Operating Temperature: -40°C ~ 70°C (TA)
  • Security Features: -
  • Package / Case: 206-BEPGA
  • Supplier Device Package: 206-PGA (47.25x47.25)
pacchetto: 206-BEPGA
Azione4.656
1 Core, 32-Bit
66MHz
-
-
No
-
-
-
-
5.0V
-40°C ~ 70°C (TA)
-
206-BEPGA
206-PGA (47.25x47.25)
hot MPC603RRX200LC
NXP

IC MPU MPC6XX 200MHZ 255FCCBGA

  • Core Processor: PowerPC 603e
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 200MHz
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 255-BCBGA Exposed Pad
  • Supplier Device Package: 255-FCCBGA (21x21)
pacchetto: 255-BCBGA Exposed Pad
Azione5.088
1 Core, 32-Bit
200MHz
-
-
No
-
-
-
-
3.3V
0°C ~ 105°C (TA)
-
255-BCBGA Exposed Pad
255-FCCBGA (21x21)
MPC8572VJAVNE
NXP

IC MPU MPC85XX 1.5GHZ 1023FCBGA

  • Core Processor: PowerPC e500
  • Number of Cores/Bus Width: 2 Core, 32-Bit
  • Speed: 1.5GHz
  • Co-Processors/DSP: Signal Processing; SPE
  • RAM Controllers: DDR2, DDR3
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (4)
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 1023-BBGA, FCBGA
  • Supplier Device Package: 1023-FCPBGA (33x33)
pacchetto: 1023-BBGA, FCBGA
Azione2.992
2 Core, 32-Bit
1.5GHz
Signal Processing; SPE
DDR2, DDR3
No
-
10/100/1000 Mbps (4)
-
-
1.5V, 1.8V, 2.5V, 3.3V
0°C ~ 105°C (TA)
-
1023-BBGA, FCBGA
1023-FCPBGA (33x33)
P2040NSE7MMC
NXP

IC MPU Q OR IQ 1.2GHZ 780FCBGA

  • Core Processor: PowerPC e500mc
  • Number of Cores/Bus Width: 4 Core, 32-Bit
  • Speed: 1.2GHz
  • Co-Processors/DSP: Security; SEC 4.2
  • RAM Controllers: DDR3, DDR3L
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (5)
  • SATA: SATA 3Gbps (2)
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
  • Package / Case: -
  • Supplier Device Package: 780-FCPBGA (23x23)
pacchetto: -
Azione2.464
4 Core, 32-Bit
1.2GHz
Security; SEC 4.2
DDR3, DDR3L
No
-
10/100/1000 Mbps (5)
SATA 3Gbps (2)
USB 2.0 + PHY (2)
1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
0°C ~ 105°C (TA)
Boot Security, Cryptography, Random Number Generator, Secure Fusebox
-
780-FCPBGA (23x23)
hot MPC860TCZQ66D4
NXP

IC MPU MPC8XX 66MHZ 357BGA

  • Core Processor: MPC8xx
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 66MHz
  • Co-Processors/DSP: Communications; CPM
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10 Mbps (4), 10/100 Mbps (1)
  • SATA: -
  • USB: -
  • Voltage - I/O: 3.3V
  • Operating Temperature: -40°C ~ 95°C (TA)
  • Security Features: -
  • Package / Case: 357-BBGA
  • Supplier Device Package: 357-PBGA (25x25)
pacchetto: 357-BBGA
Azione4.896
1 Core, 32-Bit
66MHz
Communications; CPM
DRAM
No
-
10 Mbps (4), 10/100 Mbps (1)
-
-
3.3V
-40°C ~ 95°C (TA)
-
357-BBGA
357-PBGA (25x25)
MPC8245TVV300D
NXP

IC MPU MPC82XX 300MHZ 352TBGA

  • Core Processor: PowerPC 603e
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 300MHz
  • Co-Processors/DSP: -
  • RAM Controllers: SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 352-LBGA
  • Supplier Device Package: 352-TBGA (35x35)
pacchetto: 352-LBGA
Azione3.952
1 Core, 32-Bit
300MHz
-
SDRAM
No
-
-
-
-
3.3V
-40°C ~ 105°C (TA)
-
352-LBGA
352-TBGA (35x35)
MC9328MX1CVM15
NXP

IC MPU I.MX1 150MHZ 256MAPBGA

  • Core Processor: ARM920T
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 150MHz
  • Co-Processors/DSP: -
  • RAM Controllers: SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: LCD, Touch Panel
  • Ethernet: -
  • SATA: -
  • USB: USB 1.x (1)
  • Voltage - I/O: 1.8V, 3.0V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Security Features: -
  • Package / Case: 256-MAPBGA
  • Supplier Device Package: -
pacchetto: 256-MAPBGA
Azione2.016
1 Core, 32-Bit
150MHz
-
SDRAM
No
LCD, Touch Panel
-
-
USB 1.x (1)
1.8V, 3.0V
-40°C ~ 85°C (TA)
-
256-MAPBGA
-
MCIMX356AVM5B
NXP

IC MPU I.MX35 532MHZ 400MAPBGA

  • Core Processor: ARM1136JF-S
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 532MHz
  • Co-Processors/DSP: Multimedia; GPU, IPU, VFP
  • RAM Controllers: LPDDR, DDR2
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: Keypad, KPP, LCD
  • Ethernet: 10/100 Mbps (1)
  • SATA: -
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Security Features: Secure Fusebox, Secure JTAG
  • Package / Case: 400-LFBGA
  • Supplier Device Package: 400-MAPBGA (17x17)
pacchetto: 400-LFBGA
Azione3.040
1 Core, 32-Bit
532MHz
Multimedia; GPU, IPU, VFP
LPDDR, DDR2
Yes
Keypad, KPP, LCD
10/100 Mbps (1)
-
USB 2.0 + PHY (2)
1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
-40°C ~ 85°C (TA)
Secure Fusebox, Secure JTAG
400-LFBGA
400-MAPBGA (17x17)
MCIMX6G2CVK05AB
NXP

IC MPU I.MC6UL 528MHZ 272BGA

  • Core Processor: ARM? Cortex?-A7
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 528MHz
  • Co-Processors/DSP: Multimedia; NEON? SIMD
  • RAM Controllers: LPDDR2, DDR3, DDR3L
  • Graphics Acceleration: No
  • Display & Interface Controllers: LCD, LVDS
  • Ethernet: 10/100 Mbps (2)
  • SATA: -
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TJ)
  • Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
  • Package / Case: -
  • Supplier Device Package: -
pacchetto: -
Azione3.952
1 Core, 32-Bit
528MHz
Multimedia; NEON? SIMD
LPDDR2, DDR3, DDR3L
No
LCD, LVDS
10/100 Mbps (2)
-
USB 2.0 + PHY (2)
1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
-40°C ~ 105°C (TJ)
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
-
-
AM1806EZCEA3
Texas Instruments

IC MPU SITARA 375MHZ 361NFBGA

  • Core Processor: ARM926EJ-S
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 375MHz
  • Co-Processors/DSP: System Control; CP15
  • RAM Controllers: LPDDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: LCD
  • Ethernet: -
  • SATA: -
  • USB: USB 2.0 + PHY (1)
  • Voltage - I/O: 1.8V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TJ)
  • Security Features: -
  • Package / Case: 361-LFBGA
  • Supplier Device Package: 361-NFBGA (13x13)
pacchetto: 361-LFBGA
Azione12.006
1 Core, 32-Bit
375MHz
System Control; CP15
LPDDR, DDR2
No
LCD
-
-
USB 2.0 + PHY (1)
1.8V, 3.3V
-40°C ~ 105°C (TJ)
-
361-LFBGA
361-NFBGA (13x13)
T1024NXN7KQA
NXP

QORIQ 2XCPU 64-BIT PWR ARCH 1.

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
pacchetto: -
Azione4.448
-
-
-
-
-
-
-
-
-
-
-
-
-
-
STM32MP153FAB1
STMicroelectronics

IC MPU STM32MP1 800MHZ 354LFBGA

  • Core Processor: ARM® Cortex®-A7
  • Number of Cores/Bus Width: 2 Core, 32-Bit
  • Speed: 209MHz, 800MHz
  • Co-Processors/DSP: ARM® Cortex®-M4
  • RAM Controllers: DDR3, DDR3L, LPDDR2, LPDDR3
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: HDMI-CEC, LCD
  • Ethernet: 10/100Mbps (1)
  • SATA: -
  • USB: USB 2.0 (2), USB 2.0 OTG+ PHY (3)
  • Voltage - I/O: 2.5V, 3.3V
  • Operating Temperature: -20°C ~ 105°C (TJ)
  • Security Features: ARM TZ
  • Package / Case: 354-LFBGA
  • Supplier Device Package: 354-LFBGA (16x16)
pacchetto: -
Request a Quote
2 Core, 32-Bit
209MHz, 800MHz
ARM® Cortex®-M4
DDR3, DDR3L, LPDDR2, LPDDR3
Yes
HDMI-CEC, LCD
10/100Mbps (1)
-
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
2.5V, 3.3V
-20°C ~ 105°C (TJ)
ARM TZ
354-LFBGA
354-LFBGA (16x16)
SAM9X75D2GT-I-4TB
Microchip Technology

ARM926 MPU,2GBIT DDR3L,MIPI,LVDS

  • Core Processor: ARM926EJ-S
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 800MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR2, DDR3, DDR3L, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: LCD, LVDS, MIPI/DSI
  • Ethernet: 10/100/1000Mbps (1)
  • SATA: -
  • USB: USB (3)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG
  • Package / Case: 243-LFBGA
  • Supplier Device Package: 243-TFBGA (16x16)
pacchetto: -
Request a Quote
1 Core, 32-Bit
800MHz
-
DDR2, DDR3, DDR3L, SDRAM
No
LCD, LVDS, MIPI/DSI
10/100/1000Mbps (1)
-
USB (3)
1.8V, 2.5V, 3.3V
-40°C ~ 85°C (TA)
AES, Boot Security, Cryptography, DES, SHA, TRNG
243-LFBGA
243-TFBGA (16x16)
MIMX8MN3CVTIZAA
NXP

IC MPU I.MX8MN 1.4GHZ 486LFBGA

  • Core Processor: ARM® Cortex®-A53
  • Number of Cores/Bus Width: 2 Core, 64-Bit
  • Speed: 1.4GHz
  • Co-Processors/DSP: ARM® Cortex®-M7
  • RAM Controllers: DDR3L, DDR4, LPDDR4
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
  • Ethernet: GbE
  • SATA: -
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: -
  • Operating Temperature: -40°C ~ 105°C (TJ)
  • Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
  • Package / Case: 486-LFBGA, FCBGA
  • Supplier Device Package: 486-LFBGA (14x14)
pacchetto: -
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2 Core, 64-Bit
1.4GHz
ARM® Cortex®-M7
DDR3L, DDR4, LPDDR4
Yes
LCD, MIPI-CSI, MIPI-DSI
GbE
-
USB 2.0 + PHY (2)
-
-40°C ~ 105°C (TJ)
ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
486-LFBGA, FCBGA
486-LFBGA (14x14)
MQ80186-6-BYA
Rochester Electronics, LLC

DUAL MARKED (8501002YA)

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
pacchetto: -
Request a Quote
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R9A06G032VGBG-AC0
Renesas Electronics Corporation

IC MPU RZ 125/500MHZ 400LFBGA

  • Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M3
  • Number of Cores/Bus Width: 3 Core, 32-Bit
  • Speed: 125MHz, 500MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR2, DDR3
  • Graphics Acceleration: No
  • Display & Interface Controllers: LCD
  • Ethernet: 10/100/1000Mbps
  • SATA: -
  • USB: USB 2.0 (2)
  • Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Security Features: AES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256
  • Package / Case: 400-LFBGA
  • Supplier Device Package: 400-LFBGA (17x17)
pacchetto: -
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3 Core, 32-Bit
125MHz, 500MHz
-
DDR2, DDR3
No
LCD
10/100/1000Mbps
-
USB 2.0 (2)
1.5V, 1.8V, 2.5V, 3.3V
-40°C ~ 85°C (TA)
AES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256
400-LFBGA
400-LFBGA (17x17)
MG8038716
Intel

IC MATH COPROCESSOR 68CPGA

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: 68-CPGA
  • Supplier Device Package: 68-CPGA (29.46x29.46)
pacchetto: -
Request a Quote
-
-
-
-
-
-
-
-
-
-
-
-
68-CPGA
68-CPGA (29.46x29.46)
FH8065301729602S-R1W4
Intel

IC MPU N2830 2.16GHZ 1170FCBGA

  • Core Processor: Intel® Celeron® Processor N2830
  • Number of Cores/Bus Width: 2 Core, 64-Bit
  • Speed: 2.16GHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR3L
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: USB 2.0 (1), USB 3.0 (1)
  • Voltage - I/O: 0.4V, 1.14V
  • Operating Temperature: 100°C (TC)
  • Security Features: AES, SecureKey
  • Package / Case: 1170-BGA, FCBGA
  • Supplier Device Package: 1170-FCBGA (25x27)
pacchetto: -
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2 Core, 64-Bit
2.16GHz
-
DDR3L
Yes
-
-
-
USB 2.0 (1), USB 3.0 (1)
0.4V, 1.14V
100°C (TC)
AES, SecureKey
1170-BGA, FCBGA
1170-FCBGA (25x27)
STM32MP131DAG7
STMicroelectronics

Linear IC's

  • Core Processor: ARM® Cortex®-A7
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1GHz
  • Co-Processors/DSP: Multimedia; NEON™ SIMD
  • RAM Controllers: DDR3, DDR3L, LPDDR2, LPDDR3
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: LCD
  • Ethernet: 10/100/1000Mbps (1)
  • SATA: -
  • USB: USB 2.0 (2)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TJ)
  • Security Features: AES, ARM TZ, Boot Security, Cryptography, Secure Debug, SHA-1/2, Tamper Detection, TRNG, Volatile key Storage
  • Package / Case: 289-TFBGA
  • Supplier Device Package: 289-TFBGA (9x9)
pacchetto: -
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1 Core, 32-Bit
1GHz
Multimedia; NEON™ SIMD
DDR3, DDR3L, LPDDR2, LPDDR3
Yes
LCD
10/100/1000Mbps (1)
-
USB 2.0 (2)
1.8V, 2.5V, 3.3V
-40°C ~ 105°C (TJ)
AES, ARM TZ, Boot Security, Cryptography, Secure Debug, SHA-1/2, Tamper Detection, TRNG, Volatile key Storage
289-TFBGA
289-TFBGA (9x9)