Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Cores/Bus Width | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Operating Temperature | Security Features | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Advantech Corp |
IC PROCESSOR CELERON M
|
pacchetto: - |
Azione4.944 |
|
2 Core, 32-Bit | 2.0GHz | - | - | - | - | - | - | - | - | - | - | - | 478-PGA |
||
NXP |
IC MPU Q OR IQ 400MHZ 457TEBGA
|
pacchetto: 457-LFBGA |
Azione6.768 |
|
1 Core, 32-Bit | 400MHz | - | DDR3, DDR3L | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | - | 0°C ~ 105°C (TA) | - | 457-LFBGA | 457-TEPBGA-1 (19x19) |
||
NXP |
IC MPU Q OR IQ 1.0GHZ 425TEBGA
|
pacchetto: 425-FBGA |
Azione6.000 |
|
1 Core, 32-Bit | 1.0GHz | - | DDR3, DDR3L | No | - | 10/100/1000 Mbps (3) | SATA 3Gbps (2) | USB 2.0 + PHY (1) | - | -40°C ~ 105°C (TA) | - | 425-FBGA | 425-TEPBGA I (19x19) |
||
NXP |
IC MPU MPC83XX 667MHZ 689TEBGA
|
pacchetto: 689-BBGA Exposed Pad |
Azione5.760 |
|
1 Core, 32-Bit | 667MHz | - | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | SATA 3Gbps (4) | USB 2.0 + PHY (1) | 1.8V, 2.5V, 3.3V | 0°C ~ 125°C (TA) | - | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC MPU MPC85XX 1.5GHZ 1023FCBGA
|
pacchetto: 1023-BFBGA, FCBGA |
Azione7.744 |
|
2 Core, 32-Bit | 1.5GHz | Signal Processing; SPE | DDR2, DDR3 | No | - | 10/100/1000 Mbps (4) | - | - | 1.5V, 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 1023-BFBGA, FCBGA | 1023-FCPBGA (33x33) |
||
IDT, Integrated Device Technology Inc |
IC MPU INTERPRISE 300MHZ 256BGA
|
pacchetto: 256-LBGA |
Azione2.112 |
|
1 Core, 32-Bit | 300MHz | - | DDR | No | - | 10/100 Mbps (1) | - | - | 3.3V | 0°C ~ 70°C (TA) | - | 256-LBGA | 256-CABGA (17x17) |
||
NXP |
IC MPU MPC83XX 400MHZ 668BGA
|
pacchetto: 668-BBGA Exposed Pad |
Azione6.400 |
|
1 Core, 32-Bit | 400MHz | Communications; QUICC Engine, Security; SEC | DDR, DDR2 | No | - | 10/100/1000 Mbps (1) | - | USB 1.x (1) | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | Cryptography, Random Number Generator | 668-BBGA Exposed Pad | 668-PBGA-PGE (29x29) |
||
NXP |
IC MPU MPC83XX 266MHZ 516BGA
|
pacchetto: 516-BBGA |
Azione7.664 |
|
1 Core, 32-Bit | 266MHz | Communications; QUICC Engine, Security; SEC 2.2 | DDR, DDR2 | No | - | 10/100 Mbps (3) | - | USB 2.0 (1) | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | Cryptography | 516-BBGA | 516-FPBGA (27x27) |
||
NXP |
IC MPU M683XX 25MHZ 357BGA
|
pacchetto: 357-BBGA |
Azione6.736 |
|
1 Core, 32-Bit | 25MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1) | - | - | 5.0V | 0°C ~ 70°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU MPC85XX 800MHZ 783FCBGA
|
pacchetto: 783-BBGA, FCBGA |
Azione2.432 |
|
1 Core, 32-Bit | 800MHz | Signal Processing; SPE, Security; SEC | DDR, DDR2, SDRAM | No | - | 10/100/1000 Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | Cryptography, Random Number Generator | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU MPC8XX 75MHZ 256BGA
|
pacchetto: 256-BBGA |
Azione3.568 |
|
1 Core, 32-Bit | 75MHz | Communications; RISC CPM | DRAM | No | LCD, Video | 10 Mbps (1) | - | USB 1.x (1) | 3.3V | 0°C ~ 95°C (TA) | - | 256-BBGA | 256-PBGA (23x23) |
||
NXP |
IC MPU MPC82XX 166MHZ 408TBGA
|
pacchetto: 480-LBGA |
Azione5.344 |
|
1 Core, 32-Bit | 166MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | 10/100 Mbps (3) | - | - | 3.3V | -40°C ~ 105°C (TA) | - | 480-LBGA | 408-TBGA (37.5x37.5) |
||
NXP |
IC MPU M683XX 16MHZ 144LQFP
|
pacchetto: 144-LQFP |
Azione5.200 |
|
1 Core, 32-Bit | 16MHz | - | DRAM | No | - | - | - | - | 3.3V | 0°C ~ 70°C (TA) | - | 144-LQFP | 144-LQFP (20x20) |
||
Advantech Corp |
CPU CORE 2.3G 6M 35W
|
pacchetto: - |
Azione7.824 |
|
4 Core, 64-Bit | 2.3GHz | - | - | Yes | - | - | - | - | - | - | - | - | - |
||
NXP |
IC MPU MPC83XX 533MHZ 672TBGA
|
pacchetto: 672-LBGA |
Azione2.336 |
|
1 Core, 32-Bit | 533MHz | Security; SEC | DDR | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (2) | 2.5V, 3.3V | -40°C ~ 105°C (TA) | Cryptography, Random Number Generator | 672-LBGA | 672-TBGA (35x35) |
||
NXP |
IC MPU M683XX 20MHZ 100LQFP
|
pacchetto: 100-LQFP |
Azione7.424 |
|
1 Core, 8/16-Bit | 20MHz | Communications; RISC CPM | DRAM | No | - | - | - | - | 3.3V | -40°C ~ 85°C (TA) | - | 100-LQFP | 100-LQFP (14x14) |
||
Texas Instruments |
IC MPU SITARA 1.2GHZ 1031FCBGA
|
pacchetto: 1031-BFBGA, FCBGA |
Azione6.752 |
|
1 Core, 32-Bit | 1.2GHz | Multimedia; NEON? SIMD | DDR2, DDR3 | Yes | HDMI, HDVPSS | 10/100/1000 Mbps (2) | SATA 3Gbps (1) | USB 2.0 + PHY (2) | 1.8V, 3.3V | -40°C ~ 105°C (TJ) | - | 1031-BFBGA, FCBGA | 1031-FCBGA (25x25) |
||
NXP |
QORIQ LAYERSCAPE 4XA72 64BIT ARM
|
pacchetto: - |
Azione7.552 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
QORIQ 4XCPU 64-BIT ARM ARCH 1.
|
pacchetto: - |
Azione5.088 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
IMX25 1.2 COMM
|
pacchetto: 400-LFBGA |
Azione5.792 |
|
1 Core, 32-Bit | 400MHz | - | LPDDR, DDR, DDR2 | No | Keypad, LCD, Touchscreen | 10/100 Mbps (1) | - | USB 2.0 + PHY (2) | 2.0V, 2.5V, 2.7V, 3.0V, 3.3V | -20°C ~ 70°C (TA) | - | 400-LFBGA | 400-MAPBGA (17x17) |
||
Lantiq |
NETWORK PROCESSOR SYSTEM-ON-CHIP
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
I.MX 8QUADXPLUS 17X17
|
pacchetto: - |
Request a Quote |
|
3 Core, 64-Bit | 1.2GHz, 264MHz | Multimedia; NEON, Hi-Fi4 DSP | DDR3L SDRAM, LPDDR4 DRAM | Yes | LCD, LVDS, MIPI-CSI, MIPI-DSI | 10/100/1000Mbps (2) | - | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | 1.8V, 2.5V, 3.3V | - | - | 417-BFBGA | 417-FBGA (17x17) |
||
SMSC |
ROM I/O DEVICE
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
8-BIT MICROPROCESSOR
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Freescale Semiconductor |
IC MPU MPC82XX 333MHZ 480TBGA
|
pacchetto: - |
Request a Quote |
|
1 Core, 32-Bit | 333MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | 10/100Mbps (3) | - | USB 2.0 (1) | 3.3V | -40°C ~ 105°C (TJ) | - | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) |
||
Freescale Semiconductor |
IC MPU MPC82XX 300MHZ 480TBGA
|
pacchetto: - |
Request a Quote |
|
1 Core, 32-Bit | 300MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | 10/100Mbps (3) | - | USB 2.0 (1) | 3.3V | -40°C ~ 105°C (TJ) | - | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) |
||
Microchip Technology |
IC MPU SAM9X60 600MHZ 233TFBGA
|
pacchetto: - |
Azione1.911 |
|
1 Core, 32-Bit | 600MHz | - | LPDDR, LPSDR, DDR2, SDR, SRAM | Yes | Keyboard, LCD, Touchscreen | 10/100Mbps (2) | - | USB 2.0 (3) | 3.3V | -40°C ~ 85°C (TA) | Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins | 233-TFBGA | 233-TFBGA (14x14) |
||
Intel |
IC MPU 266MHZ
|
pacchetto: - |
Request a Quote |
|
1 Core | 266MHz | - | SDRAM | - | 443BX | - | - | - | 3.3V | - | - | Module | - |