Pagina 9 - Embedded - Microcontroller, microprocessori, moduli FPGA | Circuiti integrati (CI)

Numero di parte	Produttore	Descrizione	pacchetto	Azione	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
CC-MX-PG47-ZM-1	Digi International	MODULE CONNECTCORE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	pacchetto: -	Azione4.624	-	-	-	-	-	-	-	-
DC-ME-01T-CLI-1	Digi International	MODULE ME 8MB SDRAM 2MB FLASH Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 2MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Azione2.848	ARM7TDMI, NS7520	-	55MHz	2MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 85°C
20-101-1186	Digi International	MPU MODULE RABBIT 4000 TWO PACK Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	pacchetto: -	Azione6.448	-	-	-	-	-	-	-	-
3359-EX-227-RC-X	Critical Link LLC	MITYSOM-3359 Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, AM3359 Co-Processor: NEON SIMD Speed: 720MHz Flash Size: 256MB (NAND), 8MB (NOR) RAM Size: 64KB (Internal), 256MB (External) Connector Type: SO-DIMM-204 Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm) Operating Temperature: 0°C ~ 70°C	pacchetto: -	Azione7.280	ARM? Cortex?-A8, AM3359	NEON SIMD	720MHz	256MB (NAND), 8MB (NOR)	64KB (Internal), 256MB (External)	SO-DIMM-204	2.66" x 1.5" (67.6mm x 38.1mm)	0°C ~ 70°C
CENGLH79520-10-403HCR	Logic	CARD ENGINE 32MB SDRAM Module/Board Type: MPU Core Core Processor: ARM720T, LH79520 Co-Processor: - Speed: 77.4MHz Flash Size: 16MB RAM Size: 32MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	pacchetto: -	Azione3.136	ARM720T, LH79520	-	77.4MHz	16MB	32MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
CENGLH7A404-11-403EI	Logic	CARD ENGINE 32MB SDRAM Module/Board Type: MPU Core Core Processor: ARM922T, LH7A404 Co-Processor: - Speed: 200MHz Flash Size: 16MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Azione5.984	ARM922T, LH7A404	-	200MHz	16MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	-40°C ~ 85°C
CC-9C-V212-NC	Digi International	MODULE 9C 16MB SDRAM 4MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9360 Co-Processor: - Speed: 155MHz Flash Size: 4MB RAM Size: 16MB Connector Type: SO-DIMM-144 Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Azione4.464	ARM926EJ-S, NS9360	-	155MHz	4MB	16MB	SO-DIMM-144	3.59" x 2.06" (91.2mm x 52.2mm)	-40°C ~ 85°C
DC-EM-02T-NC	Digi International	EM 8MB SDRAM 4MB FLASH SINGLE Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 4MB RAM Size: 8MB Connector Type: Pin Header Size / Dimension: 1.94" x 1.58" (49.2mm x 40.0mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Azione3.232	ARM7TDMI, NS7520	-	55MHz	4MB	8MB	Pin Header	1.94" x 1.58" (49.2mm x 40.0mm)	-40°C ~ 85°C
DC-ME-01T-PS-50	Digi International	MOD ME 8MB SDRAM 2MB FLSH 50PCK Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 2MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Azione3.296	ARM7TDMI, NS7520	-	55MHz	2MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 85°C
DC-ME-Y401-C-B	Digi International	ME 9210 8MB SDRAM 2MB FLASH 50PK Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9210 Co-Processor: - Speed: 75MHz Flash Size: 2MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 80°C	pacchetto: -	Azione6.544	ARM926EJ-S, NS9210	-	75MHz	2MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 80°C
TE0630-01I	Trenz Electronic GmbH	SOM SPARTAN-6 1GB DDR3 Module/Board Type: FPGA, USB Core Core Processor: Spartan-6 LX-45 Co-Processor: Cypress EZ-USB FX2LP Speed: 100MHz Flash Size: 8MB RAM Size: 128MB Connector Type: B2B Size / Dimension: 1.6" x 1.9" (40.5mm x 47.5mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Azione7.008	Spartan-6 LX-45	Cypress EZ-USB FX2LP	100MHz	8MB	128MB	B2B	1.6" x 1.9" (40.5mm x 47.5mm)	-40°C ~ 85°C
TE0723-03	Trenz Electronic GmbH	SOM ARDUZYNQ 7Z10 USBOTG MICROSD Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7010) Speed: 12MHz Flash Size: 16MB RAM Size: 512MB Connector Type: B2B Size / Dimension: - Operating Temperature: 0°C ~ 70°C	pacchetto: -	Azione6.512	ARM Cortex-A9	Zynq-7000 (Z-7010)	12MHz	16MB	512MB	B2B	-	0°C ~ 70°C
TE0741-03-325-2IF	Trenz Electronic GmbH	SOM KINTEX-7 325T 32MB FLASH AES Module/Board Type: FPGA Core Processor: Kintex-7 325T Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: - Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Azione7.456	Kintex-7 325T	-	200MHz	32MB	-	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	-40°C ~ 85°C
SOMAM3703-32-1780AKIR	Logic	SOM TORPEDO WIRELESS 800MHZ IND Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, AM3703 Co-Processor: - Speed: 800MHz Flash Size: 512MB RAM Size: 256MB Connector Type: Board-to-Board (BTB) Socket - 200 Size / Dimension: 0.59" x 1.34" (15mm x 34mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Azione5.184	ARM? Cortex?-A8, AM3703	-	800MHz	512MB	256MB	Board-to-Board (BTB) Socket - 200	0.59" x 1.34" (15mm x 34mm)	-40°C ~ 85°C
20-101-1138	Digi International	RCM4300 RABBITCORE Module/Board Type: MPU Core Core Processor: Rabbit 4000 Co-Processor: - Speed: 58.98MHz Flash Size: 2MB (Internal), microSD Slot (External) RAM Size: 1.5MB Connector Type: IDC Header 2x25, 2x5, 1xmicroSD Card Size / Dimension: 1.84" x 2.85" (47mm x 72mm) Operating Temperature: -20°C ~ 85°C	pacchetto: -	Azione7.188	Rabbit 4000	-	58.98MHz	2MB (Internal), microSD Slot (External)	1.5MB	IDC Header 2x25, 2x5, 1xmicroSD Card	1.84" x 2.85" (47mm x 72mm)	-20°C ~ 85°C
TE0745-02-45-2IA	Trenz Electronic GmbH	SOM ZYNQ 1GB DDR3 Module/Board Type: MCU, FPGA Core Processor: ARM® Cortex®-A9 Co-Processor: Zynq-7000 (Z-7045) Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec UFPS Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Azione6.816	ARM® Cortex®-A9	Zynq-7000 (Z-7045)	-	32MB	1GB	Samtec UFPS	2.05" x 2.99" (52mm x 76mm)	-40°C ~ 85°C
XPP1004000-02R	Lantronix, Inc.	XPORT PRO ROHS EXTENDED RAM, EXT Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	pacchetto: -	Azione4.784	-	-	-	-	-	-	-	-
XP1001000-05R	Lantronix, Inc.	XPORT ROHS EXTENDED TEMP. -40 TO Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	pacchetto: -	Azione34.728	-	-	-	-	-	-	-	-
TE0715-04-52I33-A	Trenz Electronic GmbH	IC SOC MODULE 1GB DDR3L Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7015) Speed: 125MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7015)	125MHz	32MB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
DC-VA-H264-8B-30-1080-MXC-ZL	System-On-Chip (SOC) Technologies Inc.	IC MOD ARTIX-7 A200T 256KB 32MB Module/Board Type: FPGA Core Core Processor: Artix-7 A200T Co-Processor: - Speed: - Flash Size: 32MB RAM Size: 256KB Connector Type: SO-DIMM-204 Size / Dimension: 2.700" L x 2.000" W (68.00mm x 51.00mm) Operating Temperature: 0°C ~ 85°C	pacchetto: -	Request a Quote	Artix-7 A200T	-	-	32MB	256KB	SO-DIMM-204	2.700" L x 2.000" W (68.00mm x 51.00mm)	0°C ~ 85°C
1810-DG-225-RI	Critical Link LLC	MOD MITYSOM-1810F W/AM1810 Module/Board Type: MPU, FPGA Core Core Processor: Spartan-6, XC6SLX16 Co-Processor: Spartan-6, XC6SLX16 Speed: 375MHz Flash Size: 256MB (NAND), 8MB (NOR) RAM Size: 8kB (Internal), 128MB (External) Connector Type: SO-DIMM-200 Size / Dimension: 2.660" L x 2.000" W (67.60mm x 50.80mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Request a Quote	Spartan-6, XC6SLX16	Spartan-6, XC6SLX16	375MHz	256MB (NAND), 8MB (NOR)	8kB (Internal), 128MB (External)	SO-DIMM-200	2.660" L x 2.000" W (67.60mm x 50.80mm)	-40°C ~ 85°C
TE0720-03-2IFA	Trenz Electronic GmbH	IC SOC MODULE XILINX ZYNQ Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: B2B Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7020)	-	32MB	1GB	B2B	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0745-02-93E31-AK	Trenz Electronic GmbH	SOM WITH XILINX ZYNQ 7045-3E AND Module/Board Type: MPU Core Core Processor: Zynq™ 7045 SoC XC7Z045-3FFG676E Co-Processor: ARM Cortex-A9 Speed: - Flash Size: 64MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Request a Quote	Zynq™ 7045 SoC XC7Z045-3FFG676E	ARM Cortex-A9	-	64MB	1GB	Board-to-Board (BTB) Socket	2.990" L x 2.050" W (76.00mm x 52.00mm)	-40°C ~ 85°C
TE0820-04-3BE21FL	Trenz Electronic GmbH	MOD MPSOC ZU3EG-1E 2GB DDR4 IND Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	pacchetto: -	Request a Quote	Zynq UltraScale+ XCZU3EG-1SFVC784E	-	-	128MB	2GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
TE0808-04-06EG-1EK	Trenz Electronic GmbH	IC MOD SOM MPSOC Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU6EG-1FFVC900E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: 0°C ~ 85°C	pacchetto: -	Request a Quote	Zynq UltraScale+ XCZU6EG-1FFVC900E	-	-	128MB	4GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	0°C ~ 85°C
TE0741-04-B2C-1-A	Trenz Electronic GmbH	IC MOD KINTEX-7 160T 200MHZ 32MB Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	pacchetto: -	Request a Quote	-	-	-	-	-	-	-	-
TE0820-04-3AE21FA	Trenz Electronic GmbH	MOD MPSOC ZU3CG-1E 2GB DDR4 IND Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU3CG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	pacchetto: -	Request a Quote	Zynq UltraScale+ XCZU3CG-1SFVC784E	-	-	128MB	2GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
ME-XU1-15EG-2I-D12E-R4-2	Enclustra FPGA Solutions	SOM ZYNQ XU1 US+ ZU15EG Module/Board Type: MPU, FPGA Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: - Speed: 600MHz, 1.5GHz Flash Size: 16GB RAM Size: 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	-	600MHz, 1.5GHz	16GB	4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	-40°C ~ 85°C

CC-MX-PG47-ZM-1

Digi International

MODULE CONNECTCORE

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

pacchetto: -

Azione4.624

-

DC-ME-01T-CLI-1

Digi International

MODULE ME 8MB SDRAM 2MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 2MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

Azione2.848

ARM7TDMI, NS7520

-

55MHz

2MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 85°C

20-101-1186

Digi International

MPU MODULE RABBIT 4000 TWO PACK

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

pacchetto: -

Azione6.448

-

3359-EX-227-RC-X

Critical Link LLC

MITYSOM-3359

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8, AM3359
Co-Processor: NEON SIMD
Speed: 720MHz
Flash Size: 256MB (NAND), 8MB (NOR)
RAM Size: 64KB (Internal), 256MB (External)
Connector Type: SO-DIMM-204
Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm)
Operating Temperature: 0°C ~ 70°C

pacchetto: -

Azione7.280

ARM? Cortex?-A8, AM3359

NEON SIMD

720MHz

256MB (NAND), 8MB (NOR)

64KB (Internal), 256MB (External)

SO-DIMM-204

2.66" x 1.5" (67.6mm x 38.1mm)

0°C ~ 70°C

CENGLH79520-10-403HCR

Logic

CARD ENGINE 32MB SDRAM

Module/Board Type: MPU Core
Core Processor: ARM720T, LH79520
Co-Processor: -
Speed: 77.4MHz
Flash Size: 16MB
RAM Size: 32MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: 0°C ~ 70°C

pacchetto: -

Azione3.136

ARM720T, LH79520

-

77.4MHz

16MB

32MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

0°C ~ 70°C

CENGLH7A404-11-403EI

Logic

CARD ENGINE 32MB SDRAM

Module/Board Type: MPU Core
Core Processor: ARM922T, LH7A404
Co-Processor: -
Speed: 200MHz
Flash Size: 16MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

Azione5.984

ARM922T, LH7A404

-

200MHz

16MB

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

-40°C ~ 85°C

CC-9C-V212-NC

Digi International

MODULE 9C 16MB SDRAM 4MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9360
Co-Processor: -
Speed: 155MHz
Flash Size: 4MB
RAM Size: 16MB
Connector Type: SO-DIMM-144
Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

Azione4.464

ARM926EJ-S, NS9360

-

155MHz

4MB

16MB

SO-DIMM-144

3.59" x 2.06" (91.2mm x 52.2mm)

-40°C ~ 85°C

DC-EM-02T-NC

Digi International

EM 8MB SDRAM 4MB FLASH SINGLE

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 4MB
RAM Size: 8MB
Connector Type: Pin Header
Size / Dimension: 1.94" x 1.58" (49.2mm x 40.0mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

Azione3.232

ARM7TDMI, NS7520

-

55MHz

4MB

8MB

Pin Header

1.94" x 1.58" (49.2mm x 40.0mm)

-40°C ~ 85°C

DC-ME-01T-PS-50

Digi International

MOD ME 8MB SDRAM 2MB FLSH 50PCK

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 2MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

Azione3.296

ARM7TDMI, NS7520

-

55MHz

2MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 85°C

DC-ME-Y401-C-B

Digi International

ME 9210 8MB SDRAM 2MB FLASH 50PK

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9210
Co-Processor: -
Speed: 75MHz
Flash Size: 2MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 80°C

pacchetto: -

Azione6.544

ARM926EJ-S, NS9210

-

75MHz

2MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 80°C

TE0630-01I

Trenz Electronic GmbH

SOM SPARTAN-6 1GB DDR3

Module/Board Type: FPGA, USB Core
Core Processor: Spartan-6 LX-45
Co-Processor: Cypress EZ-USB FX2LP
Speed: 100MHz
Flash Size: 8MB
RAM Size: 128MB
Connector Type: B2B
Size / Dimension: 1.6" x 1.9" (40.5mm x 47.5mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

Azione7.008

Spartan-6 LX-45

Cypress EZ-USB FX2LP

100MHz

8MB

128MB

B2B

1.6" x 1.9" (40.5mm x 47.5mm)

-40°C ~ 85°C

TE0723-03

Trenz Electronic GmbH

SOM ARDUZYNQ 7Z10 USBOTG MICROSD

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7010)
Speed: 12MHz
Flash Size: 16MB
RAM Size: 512MB
Connector Type: B2B
Size / Dimension: -
Operating Temperature: 0°C ~ 70°C

pacchetto: -

Azione6.512

ARM Cortex-A9

Zynq-7000 (Z-7010)

12MHz

16MB

512MB

B2B

-

0°C ~ 70°C

TE0741-03-325-2IF

Trenz Electronic GmbH

SOM KINTEX-7 325T 32MB FLASH AES

Module/Board Type: FPGA
Core Processor: Kintex-7 325T
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: -
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

Azione7.456

Kintex-7 325T

-

200MHz

32MB

-

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

-40°C ~ 85°C

SOMAM3703-32-1780AKIR

Logic

SOM TORPEDO WIRELESS 800MHZ IND

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8, AM3703
Co-Processor: -
Speed: 800MHz
Flash Size: 512MB
RAM Size: 256MB
Connector Type: Board-to-Board (BTB) Socket - 200
Size / Dimension: 0.59" x 1.34" (15mm x 34mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

Azione5.184

ARM? Cortex?-A8, AM3703

-

800MHz

512MB

256MB

Board-to-Board (BTB) Socket - 200

0.59" x 1.34" (15mm x 34mm)

-40°C ~ 85°C

20-101-1138

Digi International

RCM4300 RABBITCORE

Module/Board Type: MPU Core
Core Processor: Rabbit 4000
Co-Processor: -
Speed: 58.98MHz
Flash Size: 2MB (Internal), microSD Slot (External)
RAM Size: 1.5MB
Connector Type: IDC Header 2x25, 2x5, 1xmicroSD Card
Size / Dimension: 1.84" x 2.85" (47mm x 72mm)
Operating Temperature: -20°C ~ 85°C

pacchetto: -

Azione7.188

Rabbit 4000

-

58.98MHz

2MB (Internal), microSD Slot (External)

1.5MB

IDC Header 2x25, 2x5, 1xmicroSD Card

1.84" x 2.85" (47mm x 72mm)

-20°C ~ 85°C

TE0745-02-45-2IA

Trenz Electronic GmbH

SOM ZYNQ 1GB DDR3

Module/Board Type: MCU, FPGA
Core Processor: ARM® Cortex®-A9
Co-Processor: Zynq-7000 (Z-7045)
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec UFPS
Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

Azione6.816

ARM® Cortex®-A9

Zynq-7000 (Z-7045)

-

32MB

1GB

Samtec UFPS

2.05" x 2.99" (52mm x 76mm)

-40°C ~ 85°C

XPP1004000-02R

Lantronix, Inc.

XPORT PRO ROHS EXTENDED RAM, EXT

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

pacchetto: -

Azione4.784

-

XP1001000-05R

Lantronix, Inc.

XPORT ROHS EXTENDED TEMP. -40 TO

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

pacchetto: -

Azione34.728

-

TE0715-04-52I33-A

Trenz Electronic GmbH

IC SOC MODULE 1GB DDR3L

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7015)
Speed: 125MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

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ARM Cortex-A9

Zynq-7000 (Z-7015)

125MHz

32MB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

DC-VA-H264-8B-30-1080-MXC-ZL

System-On-Chip (SOC) Technologies Inc.

IC MOD ARTIX-7 A200T 256KB 32MB

Module/Board Type: FPGA Core
Core Processor: Artix-7 A200T
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: 256KB
Connector Type: SO-DIMM-204
Size / Dimension: 2.700" L x 2.000" W (68.00mm x 51.00mm)
Operating Temperature: 0°C ~ 85°C

pacchetto: -

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Artix-7 A200T

-

32MB

256KB

SO-DIMM-204

2.700" L x 2.000" W (68.00mm x 51.00mm)

0°C ~ 85°C

1810-DG-225-RI

Critical Link LLC

MOD MITYSOM-1810F W/AM1810

Module/Board Type: MPU, FPGA Core
Core Processor: Spartan-6, XC6SLX16
Co-Processor: Spartan-6, XC6SLX16
Speed: 375MHz
Flash Size: 256MB (NAND), 8MB (NOR)
RAM Size: 8kB (Internal), 128MB (External)
Connector Type: SO-DIMM-200
Size / Dimension: 2.660" L x 2.000" W (67.60mm x 50.80mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

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Spartan-6, XC6SLX16

375MHz

256MB (NAND), 8MB (NOR)

8kB (Internal), 128MB (External)

SO-DIMM-200

2.660" L x 2.000" W (67.60mm x 50.80mm)

-40°C ~ 85°C

TE0720-03-2IFA

Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: B2B
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

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ARM Cortex-A9

Zynq-7000 (Z-7020)

-

32MB

1GB

B2B

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0745-02-93E31-AK

Trenz Electronic GmbH

SOM WITH XILINX ZYNQ 7045-3E AND

Module/Board Type: MPU Core
Core Processor: Zynq™ 7045 SoC XC7Z045-3FFG676E
Co-Processor: ARM Cortex-A9
Speed: -
Flash Size: 64MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

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Zynq™ 7045 SoC XC7Z045-3FFG676E

ARM Cortex-A9

-

64MB

1GB

Board-to-Board (BTB) Socket

2.990" L x 2.050" W (76.00mm x 52.00mm)

-40°C ~ 85°C

TE0820-04-3BE21FL

Trenz Electronic GmbH

MOD MPSOC ZU3EG-1E 2GB DDR4 IND

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 85°C

pacchetto: -

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Zynq UltraScale+ XCZU3EG-1SFVC784E

-

128MB

2GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 85°C

TE0808-04-06EG-1EK

Trenz Electronic GmbH

IC MOD SOM MPSOC

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU6EG-1FFVC900E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: 0°C ~ 85°C

pacchetto: -

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Zynq UltraScale+ XCZU6EG-1FFVC900E

-

128MB

4GB

B2B

2.050" L x 2.990" W (52.00mm x 76.00mm)

0°C ~ 85°C

TE0741-04-B2C-1-A

Trenz Electronic GmbH

IC MOD KINTEX-7 160T 200MHZ 32MB

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

pacchetto: -

Request a Quote

-

TE0820-04-3AE21FA

Trenz Electronic GmbH

MOD MPSOC ZU3CG-1E 2GB DDR4 IND

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU3CG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 85°C

pacchetto: -

Request a Quote

Zynq UltraScale+ XCZU3CG-1SFVC784E

-

128MB

2GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 85°C

ME-XU1-15EG-2I-D12E-R4-2

Enclustra FPGA Solutions

SOM ZYNQ XU1 US+ ZU15EG

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: -
Speed: 600MHz, 1.5GHz
Flash Size: 16GB
RAM Size: 4GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

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ARM® Cortex®-A53, ARM® Cortex®-R5

-

600MHz, 1.5GHz

16GB

4GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

-40°C ~ 85°C