Pagina 43 - Embedded - Microcontroller, microprocessori, moduli FPGA | Circuiti integrati (CI)

Numero di parte	Produttore	Descrizione	pacchetto	Azione	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
3354-HX-XX7-RC	Critical Link LLC	MOD MITYSOM-3354 Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, AM3354 Co-Processor: NEON SIMD Speed: 800MHz Flash Size: - RAM Size: 256MB Connector Type: SO-DIMM-204 Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm) Operating Temperature: 0°C ~ 70°C	pacchetto: -	Azione2.592	ARM? Cortex?-A8, AM3354	NEON SIMD	800MHz	-	256MB	SO-DIMM-204	2.66" x 1.5" (67.6mm x 38.1mm)	0°C ~ 70°C
CC-W9M-NA37-XE	Digi International	MOD WI-9M 64MB SDRAM 128MB FLASH Module/Board Type: MPU Core Core Processor: ARM920T, SC2443 Co-Processor: - Speed: 533MHz Flash Size: 128MB RAM Size: 64MB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 3.62" x 1.73" (92mm x 44 mm) Operating Temperature: -40°C ~ 65°C	pacchetto: -	Azione4.528	ARM920T, SC2443	-	533MHz	128MB	64MB	Board-to-Board (BTB) Socket - 240	3.62" x 1.73" (92mm x 44 mm)	-40°C ~ 65°C
SOMOMAP3530-21-1670AGCR	Logic	SYSTEM ON MODULE LV OMAP3530 Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, OMAP3530 Co-Processor: - Speed: 600MHz Flash Size: 256MB RAM Size: 128MB Connector Type: Board-to-Board (BTB) Socket - 200 Size / Dimension: 0.59" x 1.06" (15mm x 27mm) Operating Temperature: 0°C ~ 70°C	pacchetto: -	Azione6.608	ARM? Cortex?-A8, OMAP3530	-	600MHz	256MB	128MB	Board-to-Board (BTB) Socket - 200	0.59" x 1.06" (15mm x 27mm)	0°C ~ 70°C
FS-3008	Digi International	MODULE 32MB SDRAM 32MB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	pacchetto: -	Azione5.168	-	-	-	-	-	-	-	-
DDF59100I	Dave Embedded Systems	SYSTEM ON MODULE AM3359 1GB NAND Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, AM3359 Co-Processor: PowerVR SGX530 Speed: 720MHz Flash Size: 1GB (NAND), 32MB (NOR) RAM Size: 512MB Connector Type: SO-DIMM-204 Size / Dimension: - Operating Temperature: -40°C ~ 85°C	pacchetto: -	Azione4.576	ARM? Cortex?-A8, AM3359	PowerVR SGX530	720MHz	1GB (NAND), 32MB (NOR)	512MB	SO-DIMM-204	-	-40°C ~ 85°C
CC-9C-V212-ZA	Digi International	MODULE 9C 16MB SDRAM 4MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9360 Co-Processor: - Speed: 155MHz Flash Size: 4MB RAM Size: 16MB Connector Type: SO-DIMM-144 Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Azione5.312	ARM926EJ-S, NS9360	-	155MHz	4MB	16MB	SO-DIMM-144	3.59" x 2.06" (91.2mm x 52.2mm)	-40°C ~ 85°C
SOMAM1808-10-1502QHCR	Logic	SYSTEM ON MODULE AM1808 Module/Board Type: MPU Core Core Processor: ARM926EJ-S, AM1808 Co-Processor: - Speed: 450MHz Flash Size: 8MB RAM Size: 64MB Connector Type: - Size / Dimension: 1.18" x 1.57" (30mm x 40mm) Operating Temperature: 0°C ~ 70°C	pacchetto: -	Azione6.128	ARM926EJ-S, AM1808	-	450MHz	8MB	64MB	-	1.18" x 1.57" (30mm x 40mm)	0°C ~ 70°C
BS2P40	Parallax Inc.	BASIC STAMP 2P40 MODULE Module/Board Type: MCU Core Core Processor: SX48AC Co-Processor: - Speed: 20MHz Flash Size: 16KB EEPROM RAM Size: 38B Connector Type: - Size / Dimension: 2.1" x 0.6" (53.3mm x 15.2mm) Operating Temperature: 0°C ~ 70°C	pacchetto: -	Azione7.584	SX48AC	-	20MHz	16KB EEPROM	38B	-	2.1" x 0.6" (53.3mm x 15.2mm)	0°C ~ 70°C
20-101-1328	Digi International	RCM3710 W/MOUNTING HOLES Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 22.1MHz Flash Size: 256KB (Internal), 1MB (External) RAM Size: 128KB Connector Type: IDC Header 2x20 Size / Dimension: 1.2" x 2.95" (30mm x 75mm) Operating Temperature: -40°C ~ 70°C	pacchetto: -	Azione20.382	Rabbit 3000	-	22.1MHz	256KB (Internal), 1MB (External)	128KB	IDC Header 2x20	1.2" x 2.95" (30mm x 75mm)	-40°C ~ 70°C
CC-9C-V223-RJ	Digi International	MODULE CONNECTCORE 9C Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	pacchetto: -	Azione7.792	-	-	-	-	-	-	-	-
DC-ME4-01T-CC	Digi International	MODULE CONNECTCORE Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 4MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Azione4.208	ARM7TDMI, NS7520	-	55MHz	4MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 85°C
DC-ME-Y402-TSB	Digi International	MODULE DIGI CONNECT ME Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	pacchetto: -	Azione4.064	-	-	-	-	-	-	-	-
TE0820-02-03CG-1EA	Trenz Electronic GmbH	SOM USCALE+ XCZU3CG-1S 1GB DDR4 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	pacchetto: -	Azione6.592	-	-	-	-	-	-	-	-
TE0803-01-03CG-1EA	Trenz Electronic GmbH	SOM USCALE+ XCZU3CG-1S 2GB DDR4 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	pacchetto: -	Azione6.960	-	-	-	-	-	-	-	-
XP100200S-05R	Lantronix, Inc.	XPORT ROHS SAMPLE EXTENDED TEMP. Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	pacchetto: -	Azione3.360	-	-	-	-	-	-	-	-
XP1002000-05R	Lantronix, Inc.	XPORT ROHS EXTENDED TEMP. -40 TO Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	pacchetto: -	Azione12.354	-	-	-	-	-	-	-	-
TE0820-03-03EG-1EL	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 1.57" x 1.97" (40mm x 50mm) Operating Temperature: 0°C ~ 85°C	pacchetto: -	Azione4.832	Zynq UltraScale+ XCZU3EG-1SFVC784E	-	-	128MB	2GB	B2B	1.57" x 1.97" (40mm x 50mm)	0°C ~ 85°C
A10S-P8-X5E-RI-SA	Critical Link LLC	IC MODULE CORTEX-A9 1.2GHZ 6GB Module/Board Type: MPU, FPGA Core Core Processor: ARM® Cortex®-A9, Arria 10 SX Co-Processor: NEON™ SIMD Speed: 1.2GHz Flash Size: - RAM Size: 6GB Connector Type: Board-to-Board (BTB) Size / Dimension: 4" x 4" (101.5mm x 101.5mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Azione2.944	ARM® Cortex®-A9, Arria 10 SX	NEON™ SIMD	1.2GHz	-	6GB	Board-to-Board (BTB)	4" x 4" (101.5mm x 101.5mm)	-40°C ~ 85°C
A10S-P8-X5E-RC-SA	Critical Link LLC	IC MODULE CORTEX-A9 1.2GHZ 6GB Module/Board Type: MPU, FPGA Core Core Processor: ARM® Cortex®-A9, Arria 10 SX Co-Processor: NEON™ SIMD Speed: 1.2GHz Flash Size: - RAM Size: 6GB Connector Type: Board-to-Board (BTB) Size / Dimension: 4" x 4" (101.5mm x 101.5mm) Operating Temperature: 0°C ~ 70°C	pacchetto: -	Azione2.624	ARM® Cortex®-A9, Arria 10 SX	NEON™ SIMD	1.2GHz	-	6GB	Board-to-Board (BTB)	4" x 4" (101.5mm x 101.5mm)	0°C ~ 70°C
TE0803-03-3AE11-A	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: 0°C ~ 85°C	pacchetto: -	Azione2.992	Zynq UltraScale+ XCZU2CG-1SFVC784E	-	-	128MB	2GB	B2B	2.05" x 2.99" (52mm x 76mm)	0°C ~ 85°C
TE0630-02B-DWS	Trenz Electronic GmbH	FPGA MODULE SPARTAN-6 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	pacchetto: -	Request a Quote	-	-	-	-	-	-	-	-
TE0807-02-4BE21-A	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	pacchetto: -	Request a Quote	-	-	-	-	-	-	-	-
M28-7BA1CI	ARIES Embedded	SoM i.MX287 Module/Board Type: - Core Processor: i.MX287 Co-Processor: - Speed: 454MHz Flash Size: 256MB (NAND) RAM Size: 128MB Connector Type: - Size / Dimension: - Operating Temperature: -40°C ~ 85°C	pacchetto: -	Request a Quote	i.MX287	-	454MHz	256MB (NAND)	128MB	-	-	-40°C ~ 85°C
SM-K24-XCL2GI	AMD	SOM K24 KRIA ZYNQ MPSOC Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	pacchetto: -	Azione900	-	-	-	-	-	-	-	-
TE0726-03RJ	Trenz Electronic GmbH	IC MODULE ZYNQBERRY Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7010) Speed: - Flash Size: 16MB RAM Size: 128MB Connector Type: CSI, DSI Size / Dimension: 1.180" L x 1.570" W (30.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C	pacchetto: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7010)	-	16MB	128MB	CSI, DSI	1.180" L x 1.570" W (30.00mm x 40.00mm)	0°C ~ 70°C
TE0715-05-71I33-L	Trenz Electronic GmbH	IC SOC MODULE Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7030) Speed: 125MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7030)	125MHz	32MB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
IW-G35M-19EG-4E004G-E008G-BIE	iWave Systems	ZU19EG (-2 SPEED) MPSOC SOM Module/Board Type: MPU, FPGA Core Processor: ARM® Cortex®-A53(x4), ARM® Cortex™-M7(x1) Co-Processor: ARM® Mali 400 MP2 Speed: 1.5GHz, 600MHz Flash Size: 8GB eMMC RAM Size: 4GB from PS, 4GB from PL Connector Type: 2 x 240 Pin, 2 x 240 Pin Size / Dimension: 4.330" L x 2.950" W (110.00mm x 75.00mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Request a Quote	ARM® Cortex®-A53(x4), ARM® Cortex™-M7(x1)	ARM® Mali 400 MP2	1.5GHz, 600MHz	8GB eMMC	4GB from PS, 4GB from PL	2 x 240 Pin, 2 x 240 Pin	4.330" L x 2.950" W (110.00mm x 75.00mm)	-40°C ~ 85°C
TE0600-04-72C21-A	Trenz Electronic GmbH	IC MODULE GIGABEE Module/Board Type: FPGA Core Processor: Xilinx Spartan™ 6 XC6SLX100-2FGG484C Co-Processor: - Speed: 125MHz Flash Size: 16MB RAM Size: 512MB Connector Type: B2B Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C	pacchetto: -	Request a Quote	Xilinx Spartan™ 6 XC6SLX100-2FGG484C	-	125MHz	16MB	512MB	B2B	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 70°C

3354-HX-XX7-RC

Critical Link LLC

MOD MITYSOM-3354

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8, AM3354
Co-Processor: NEON SIMD
Speed: 800MHz
Flash Size: -
RAM Size: 256MB
Connector Type: SO-DIMM-204
Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm)
Operating Temperature: 0°C ~ 70°C

pacchetto: -

Azione2.592

ARM? Cortex?-A8, AM3354

NEON SIMD

800MHz

-

256MB

SO-DIMM-204

2.66" x 1.5" (67.6mm x 38.1mm)

0°C ~ 70°C

CC-W9M-NA37-XE

Digi International

MOD WI-9M 64MB SDRAM 128MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM920T, SC2443
Co-Processor: -
Speed: 533MHz
Flash Size: 128MB
RAM Size: 64MB
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 3.62" x 1.73" (92mm x 44 mm)
Operating Temperature: -40°C ~ 65°C

pacchetto: -

Azione4.528

ARM920T, SC2443

-

533MHz

128MB

64MB

Board-to-Board (BTB) Socket - 240

3.62" x 1.73" (92mm x 44 mm)

-40°C ~ 65°C

SOMOMAP3530-21-1670AGCR

Logic

SYSTEM ON MODULE LV OMAP3530

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8, OMAP3530
Co-Processor: -
Speed: 600MHz
Flash Size: 256MB
RAM Size: 128MB
Connector Type: Board-to-Board (BTB) Socket - 200
Size / Dimension: 0.59" x 1.06" (15mm x 27mm)
Operating Temperature: 0°C ~ 70°C

pacchetto: -

Azione6.608

ARM? Cortex?-A8, OMAP3530

-

600MHz

256MB

128MB

Board-to-Board (BTB) Socket - 200

0.59" x 1.06" (15mm x 27mm)

0°C ~ 70°C

FS-3008

Digi International

MODULE 32MB SDRAM 32MB FLASH

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

pacchetto: -

Azione5.168

-

DDF59100I

Dave Embedded Systems

SYSTEM ON MODULE AM3359 1GB NAND

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8, AM3359
Co-Processor: PowerVR SGX530
Speed: 720MHz
Flash Size: 1GB (NAND), 32MB (NOR)
RAM Size: 512MB
Connector Type: SO-DIMM-204
Size / Dimension: -
Operating Temperature: -40°C ~ 85°C

pacchetto: -

Azione4.576

ARM? Cortex?-A8, AM3359

PowerVR SGX530

720MHz

1GB (NAND), 32MB (NOR)

512MB

SO-DIMM-204

-

-40°C ~ 85°C

CC-9C-V212-ZA

Digi International

MODULE 9C 16MB SDRAM 4MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9360
Co-Processor: -
Speed: 155MHz
Flash Size: 4MB
RAM Size: 16MB
Connector Type: SO-DIMM-144
Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

Azione5.312

ARM926EJ-S, NS9360

-

155MHz

4MB

16MB

SO-DIMM-144

3.59" x 2.06" (91.2mm x 52.2mm)

-40°C ~ 85°C

SOMAM1808-10-1502QHCR

Logic

SYSTEM ON MODULE AM1808

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, AM1808
Co-Processor: -
Speed: 450MHz
Flash Size: 8MB
RAM Size: 64MB
Connector Type: -
Size / Dimension: 1.18" x 1.57" (30mm x 40mm)
Operating Temperature: 0°C ~ 70°C

pacchetto: -

Azione6.128

ARM926EJ-S, AM1808

-

450MHz

8MB

64MB

-

1.18" x 1.57" (30mm x 40mm)

0°C ~ 70°C

BS2P40

Parallax Inc.

BASIC STAMP 2P40 MODULE

Module/Board Type: MCU Core
Core Processor: SX48AC
Co-Processor: -
Speed: 20MHz
Flash Size: 16KB EEPROM
RAM Size: 38B
Connector Type: -
Size / Dimension: 2.1" x 0.6" (53.3mm x 15.2mm)
Operating Temperature: 0°C ~ 70°C

pacchetto: -

Azione7.584

SX48AC

-

20MHz

16KB EEPROM

38B

-

2.1" x 0.6" (53.3mm x 15.2mm)

0°C ~ 70°C

20-101-1328

Digi International

RCM3710 W/MOUNTING HOLES

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 22.1MHz
Flash Size: 256KB (Internal), 1MB (External)
RAM Size: 128KB
Connector Type: IDC Header 2x20
Size / Dimension: 1.2" x 2.95" (30mm x 75mm)
Operating Temperature: -40°C ~ 70°C

pacchetto: -

Azione20.382

Rabbit 3000

-

22.1MHz

256KB (Internal), 1MB (External)

128KB

IDC Header 2x20

1.2" x 2.95" (30mm x 75mm)

-40°C ~ 70°C

CC-9C-V223-RJ

Digi International

MODULE CONNECTCORE 9C

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

pacchetto: -

Azione7.792

-

DC-ME4-01T-CC

Digi International

MODULE CONNECTCORE

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 4MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

Azione4.208

ARM7TDMI, NS7520

-

55MHz

4MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 85°C

DC-ME-Y402-TSB

Digi International

MODULE DIGI CONNECT ME

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

pacchetto: -

Azione4.064

-

TE0820-02-03CG-1EA

Trenz Electronic GmbH

SOM USCALE+ XCZU3CG-1S 1GB DDR4

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

pacchetto: -

Azione6.592

-

TE0803-01-03CG-1EA

Trenz Electronic GmbH

SOM USCALE+ XCZU3CG-1S 2GB DDR4

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

pacchetto: -

Azione6.960

-

XP100200S-05R

Lantronix, Inc.

XPORT ROHS SAMPLE EXTENDED TEMP.

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

pacchetto: -

Azione3.360

-

XP1002000-05R

Lantronix, Inc.

XPORT ROHS EXTENDED TEMP. -40 TO

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

pacchetto: -

Azione12.354

-

TE0820-03-03EG-1EL

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 1.57" x 1.97" (40mm x 50mm)
Operating Temperature: 0°C ~ 85°C

pacchetto: -

Azione4.832

Zynq UltraScale+ XCZU3EG-1SFVC784E

-

128MB

2GB

B2B

1.57" x 1.97" (40mm x 50mm)

0°C ~ 85°C

A10S-P8-X5E-RI-SA

Critical Link LLC

IC MODULE CORTEX-A9 1.2GHZ 6GB

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Cortex®-A9, Arria 10 SX
Co-Processor: NEON™ SIMD
Speed: 1.2GHz
Flash Size: -
RAM Size: 6GB
Connector Type: Board-to-Board (BTB)
Size / Dimension: 4" x 4" (101.5mm x 101.5mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

Azione2.944

ARM® Cortex®-A9, Arria 10 SX

NEON™ SIMD

1.2GHz

-

6GB

Board-to-Board (BTB)

4" x 4" (101.5mm x 101.5mm)

-40°C ~ 85°C

A10S-P8-X5E-RC-SA

Critical Link LLC

IC MODULE CORTEX-A9 1.2GHZ 6GB

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Cortex®-A9, Arria 10 SX
Co-Processor: NEON™ SIMD
Speed: 1.2GHz
Flash Size: -
RAM Size: 6GB
Connector Type: Board-to-Board (BTB)
Size / Dimension: 4" x 4" (101.5mm x 101.5mm)
Operating Temperature: 0°C ~ 70°C

pacchetto: -

Azione2.624

ARM® Cortex®-A9, Arria 10 SX

NEON™ SIMD

1.2GHz

-

6GB

Board-to-Board (BTB)

4" x 4" (101.5mm x 101.5mm)

0°C ~ 70°C

TE0803-03-3AE11-A

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
Operating Temperature: 0°C ~ 85°C

pacchetto: -

Azione2.992

Zynq UltraScale+ XCZU2CG-1SFVC784E

-

128MB

2GB

B2B

2.05" x 2.99" (52mm x 76mm)

0°C ~ 85°C

TE0630-02B-DWS

Trenz Electronic GmbH

FPGA MODULE SPARTAN-6

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

pacchetto: -

Request a Quote

-

TE0807-02-4BE21-A

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

pacchetto: -

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M28-7BA1CI

ARIES Embedded

SoM i.MX287

Module/Board Type: -
Core Processor: i.MX287
Co-Processor: -
Speed: 454MHz
Flash Size: 256MB (NAND)
RAM Size: 128MB
Connector Type: -
Size / Dimension: -
Operating Temperature: -40°C ~ 85°C

pacchetto: -

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i.MX287

-

454MHz

256MB (NAND)

128MB

-

-40°C ~ 85°C

SM-K24-XCL2GI

AMD

SOM K24 KRIA ZYNQ MPSOC

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

pacchetto: -

Azione900

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TE0726-03RJ

Trenz Electronic GmbH

IC MODULE ZYNQBERRY

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7010)
Speed: -
Flash Size: 16MB
RAM Size: 128MB
Connector Type: CSI, DSI
Size / Dimension: 1.180" L x 1.570" W (30.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C

pacchetto: -

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ARM Cortex-A9

Zynq-7000 (Z-7010)

-

16MB

128MB

CSI, DSI

1.180" L x 1.570" W (30.00mm x 40.00mm)

0°C ~ 70°C

TE0715-05-71I33-L

Trenz Electronic GmbH

IC SOC MODULE

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7030)
Speed: 125MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

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ARM Cortex-A9

Zynq-7000 (Z-7030)

125MHz

32MB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

IW-G35M-19EG-4E004G-E008G-BIE

iWave Systems

ZU19EG (-2 SPEED) MPSOC SOM

Module/Board Type: MPU, FPGA
Core Processor: ARM® Cortex®-A53(x4), ARM® Cortex™-M7(x1)
Co-Processor: ARM® Mali 400 MP2
Speed: 1.5GHz, 600MHz
Flash Size: 8GB eMMC
RAM Size: 4GB from PS, 4GB from PL
Connector Type: 2 x 240 Pin, 2 x 240 Pin
Size / Dimension: 4.330" L x 2.950" W (110.00mm x 75.00mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

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ARM® Cortex®-A53(x4), ARM® Cortex™-M7(x1)

ARM® Mali 400 MP2

1.5GHz, 600MHz

8GB eMMC

4GB from PS, 4GB from PL

2 x 240 Pin, 2 x 240 Pin

4.330" L x 2.950" W (110.00mm x 75.00mm)

-40°C ~ 85°C

TE0600-04-72C21-A

Trenz Electronic GmbH

IC MODULE GIGABEE

Module/Board Type: FPGA
Core Processor: Xilinx Spartan™ 6 XC6SLX100-2FGG484C
Co-Processor: -
Speed: 125MHz
Flash Size: 16MB
RAM Size: 512MB
Connector Type: B2B
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C

pacchetto: -

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Xilinx Spartan™ 6 XC6SLX100-2FGG484C

-

125MHz

16MB

512MB

B2B

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 70°C