Pagina 36 - Embedded - Microcontroller, microprocessori, moduli FPGA | Circuiti integrati (CI) | Heisener Electronics
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Embedded - Microcontroller, microprocessori, moduli FPGA

Record 1.650
Pagina  36/59
Immagine
Numero di parte
Produttore
Descrizione
pacchetto
Azione
Quantità
Core Processor
Co-Processor
Speed
Flash Size
RAM Size
Connector Type
Size / Dimension
Operating Temperature
CC-MX-PG47-ZM
Digi International

MODULE CONNECTCORE

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
pacchetto: -
Azione6.144
-
-
-
-
-
-
-
-
TE0600-02IN
Trenz Electronic GmbH

SOM GIGABEE XC6SLX45 2X128MB 2I

  • Module/Board Type: FPGA
  • Core Processor: Spartan-6 LX-45
  • Co-Processor: -
  • Speed: 125MHz
  • Flash Size: 16MB
  • RAM Size: 256MB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
  • Operating Temperature: -40°C ~ 85°C
pacchetto: -
Azione7.456
Spartan-6 LX-45
-
125MHz
16MB
256MB
Samtec LSHM
1.97" x 1.57" (50mm x 40mm)
-40°C ~ 85°C
CC-9P-V502-MF-VS
Digi International

MODULE 9P 8MB SDRAM 4MB FLASH

  • Module/Board Type: MPU Core
  • Core Processor: ARM926EJ-S, NS9215
  • Co-Processor: -
  • Speed: 150MHz
  • Flash Size: 4MB
  • RAM Size: 8MB
  • Connector Type: Board-to-Board (BTB) Socket - 160
  • Size / Dimension: 1.97" x 1.97" (50mm x 50mm)
  • Operating Temperature: -40°C ~ 85°C
pacchetto: -
Azione5.376
ARM926EJ-S, NS9215
-
150MHz
4MB
8MB
Board-to-Board (BTB) Socket - 160
1.97" x 1.97" (50mm x 50mm)
-40°C ~ 85°C
CC-9C-V226-Z6-B
Digi International

MODULE 9C 32MB SDRAM 64MB FLASH

  • Module/Board Type: MPU Core
  • Core Processor: ARM926EJ-S, NS9360
  • Co-Processor: -
  • Speed: 155MHz
  • Flash Size: 64MB
  • RAM Size: 32MB
  • Connector Type: SO-DIMM-144
  • Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm)
  • Operating Temperature: -40°C ~ 85°C
pacchetto: -
Azione7.648
ARM926EJ-S, NS9360
-
155MHz
64MB
32MB
SO-DIMM-144
3.59" x 2.06" (91.2mm x 52.2mm)
-40°C ~ 85°C
M5475AFE
NXP

MODULE FIRE ENGINE

  • Module/Board Type: MPU Core
  • Core Processor: ColdFire V4e, MCF5475
  • Co-Processor: -
  • Speed: 266MHz
  • Flash Size: 2MB (Boot)
  • RAM Size: 64MB
  • Connector Type: -
  • Size / Dimension: 3.7" x 4.5" (93.4mm x 114.3mm)
  • Operating Temperature: 0°C ~ 70°C
pacchetto: -
Azione6.688
ColdFire V4e, MCF5475
-
266MHz
2MB (Boot)
64MB
-
3.7" x 4.5" (93.4mm x 114.3mm)
0°C ~ 70°C
101-1006
Digi International

MODULE POWERCORE FLEX 3800

  • Module/Board Type: MPU Core
  • Core Processor: Rabbit 3000
  • Co-Processor: -
  • Speed: 51.6MHz
  • Flash Size: 512KB (Internal), 1MB (External)
  • RAM Size: 1MB
  • Connector Type: IDC Header 2x25, 2x5, 1x3mm
  • Size / Dimension: 2.35" x 4" (60mm x 102mm)
  • Operating Temperature: -40°C ~ 70°C
pacchetto: -
Azione5.616
Rabbit 3000
-
51.6MHz
512KB (Internal), 1MB (External)
1MB
IDC Header 2x25, 2x5, 1x3mm
2.35" x 4" (60mm x 102mm)
-40°C ~ 70°C
101-0508
Digi International

MODULE RABBITCORE RCM3010

  • Module/Board Type: MPU Core
  • Core Processor: Rabbit 3000
  • Co-Processor: -
  • Speed: 30MHz
  • Flash Size: 256KB
  • RAM Size: 128KB
  • Connector Type: 2 IDC Headers 2x17
  • Size / Dimension: 1.85" x 2.73" (47mm x 69mm)
  • Operating Temperature: -40°C ~ 70°C
pacchetto: -
Azione2.080
Rabbit 3000
-
30MHz
256KB
128KB
2 IDC Headers 2x17
1.85" x 2.73" (47mm x 69mm)
-40°C ~ 70°C
5CSX-H6-53B-RC
Critical Link LLC

MITYSOM-5CSX W/ ALTERA CYCLONE V

  • Module/Board Type: MPU, FPGA Core
  • Core Processor: ARM? Cortex?-A9, Cyclone V SX/SE
  • Co-Processor: NEON SIMD
  • Speed: 800MHz
  • Flash Size: 48MB
  • RAM Size: 512MB
  • Connector Type: Edge Connector
  • Size / Dimension: 3.2" x 1.5" (82mm x 39mm)
  • Operating Temperature: 0°C ~ 70°C
pacchetto: -
Azione3.376
ARM? Cortex?-A9, Cyclone V SX/SE
NEON SIMD
800MHz
48MB
512MB
Edge Connector
3.2" x 1.5" (82mm x 39mm)
0°C ~ 70°C
3359-GX-226-RL
Critical Link LLC

MITYSOM-3359 W/ AM3359

  • Module/Board Type: MPU Core
  • Core Processor: ARM? Cortex?-A8, AM3359
  • Co-Processor: NEON SIMD
  • Speed: 720MHz
  • Flash Size: 256MB (NAND), 8MB (NOR)
  • RAM Size: 64KB (Internal), 256MB (External)
  • Connector Type: SO-DIMM-204
  • Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm)
  • Operating Temperature: -40°C ~ 70°C
pacchetto: -
Azione5.536
ARM? Cortex?-A8, AM3359
NEON SIMD
720MHz
256MB (NAND), 8MB (NOR)
64KB (Internal), 256MB (External)
SO-DIMM-204
2.66" x 1.5" (67.6mm x 38.1mm)
-40°C ~ 70°C
5CSE-L2-3Y8-RC
Critical Link LLC

MITYSOM-5CSE W/ ALTERA CYCLONE V

  • Module/Board Type: MPU, FPGA Core
  • Core Processor: ARM? Cortex?-A9, Cyclone V SX/SE
  • Co-Processor: NEON SIMD
  • Speed: 600MHz
  • Flash Size: 16MB
  • RAM Size: 512MB
  • Connector Type: Edge Connector
  • Size / Dimension: 3.2" x 1.5" (82mm x 39mm)
  • Operating Temperature: 0°C ~ 70°C
pacchetto: -
Azione4.608
ARM? Cortex?-A9, Cyclone V SX/SE
NEON SIMD
600MHz
16MB
512MB
Edge Connector
3.2" x 1.5" (82mm x 39mm)
0°C ~ 70°C
1808-FX-225-RC
Critical Link LLC

MITYSOM-1808 SOM AM1808

  • Module/Board Type: MPU Core
  • Core Processor: ARM926EJ-S, AM1808
  • Co-Processor: -
  • Speed: 456MHz
  • Flash Size: 256MB (NAND), 8MB (NOR)
  • RAM Size: 8KB (Internal), 128MB (External)
  • Connector Type: SO-DIMM-200
  • Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm)
  • Operating Temperature: 0°C ~ 70°C
pacchetto: -
Azione7.296
ARM926EJ-S, AM1808
-
456MHz
256MB (NAND), 8MB (NOR)
8KB (Internal), 128MB (External)
SO-DIMM-200
2.66" x 1.5" (67.6mm x 38.1mm)
0°C ~ 70°C
TE0741-03-160-2CF
Trenz Electronic GmbH

SOM KINTEX-7 160T 32MB FLASH AES

  • Module/Board Type: FPGA
  • Core Processor: Kintex-7 160T
  • Co-Processor: -
  • Speed: 200MHz
  • Flash Size: 32MB
  • RAM Size: -
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
  • Operating Temperature: 0°C ~ 70°C
pacchetto: -
Azione4.640
Kintex-7 160T
-
200MHz
32MB
-
Samtec LSHM
1.97" x 1.57" (50mm x 40mm)
0°C ~ 70°C
TE0720-03-14S-1C
Trenz Electronic GmbH

SOM ZYNQ Z-7012S 1GB DDR3L

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7014S)
  • Speed: 766MHz
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
  • Operating Temperature: 0°C ~ 70°C
pacchetto: -
Azione5.648
ARM Cortex-A9
Zynq-7000 (Z-7014S)
766MHz
32MB
1GB
Samtec LSHM
1.97" x 1.57" (50mm x 40mm)
0°C ~ 70°C
DC-ME-01T-TYS-1
Digi International

MODULE DIGI CONNECT ME

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
pacchetto: -
Azione4.848
-
-
-
-
-
-
-
-
MODM7AE70-200IR
NetBurner Inc.

IC MOD CORTEX-M7 300MHZ 8MB

  • Module/Board Type: MCU, Ethernet Core
  • Core Processor: ARM® Cortex®-M7
  • Co-Processor: -
  • Speed: 300MHz
  • Flash Size: 2MB
  • RAM Size: 8MB
  • Connector Type: 10-Pin Header
  • Size / Dimension: 2.6" x 2" (66.04mm x 50.8mm)
  • Operating Temperature: -40°C ~ 85°C
pacchetto: -
Azione7.328
ARM® Cortex®-M7
-
300MHz
2MB
8MB
10-Pin Header
2.6" x 2" (66.04mm x 50.8mm)
-40°C ~ 85°C
TE0712-03-42I36-A
Trenz Electronic GmbH

FPGA MODULE ARTIX7

  • Module/Board Type: FPGA Core
  • Core Processor: Artix-7 XC7A35T-2FGG484I
  • Co-Processor: -
  • Speed: -
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Board-to-Board (BTB) Socket
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: -40°C ~ 85°C
pacchetto: -
Azione3
Artix-7 XC7A35T-2FGG484I
-
-
32MB
1GB
Board-to-Board (BTB) Socket
1.970" L x 1.570" W (50.00mm x 40.00mm)
-40°C ~ 85°C
L138-FI-325-RC
Critical Link LLC

MITYDSP-L138F SOM W/ OMAP-L138

  • Module/Board Type: MPU, DSP, FPGA Core
  • Core Processor: ARM926EJ-S, OMAP-L138
  • Co-Processor: TMS320C674x (DSP), Spartan-6, XC6SLX45 (FPGA)
  • Speed: 456MHz
  • Flash Size: 256MB (NAND), 16MB (NOR)
  • RAM Size: 128MB
  • Connector Type: SO-DIMM-200
  • Size / Dimension: 2.660" L x 2.000" W (67.60mm x 50.80mm)
  • Operating Temperature: 0°C ~ 70°C
pacchetto: -
Request a Quote
ARM926EJ-S, OMAP-L138
TMS320C674x (DSP), Spartan-6, XC6SLX45 (FPGA)
456MHz
256MB (NAND), 16MB (NOR)
128MB
SO-DIMM-200
2.660" L x 2.000" W (67.60mm x 50.80mm)
0°C ~ 70°C
ME-XU1-9EG-2I-D12E-G1-R5-0
Enclustra FPGA Solutions

SOM ZYNQ XU1 US+ ZU9EG

  • Module/Board Type: MPU Core
  • Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
  • Co-Processor: Xilinx Zynq UltraScale+ XCZU9EG-2FFVC900I
  • Speed: 600MHz, 1.5GHz
  • Flash Size: 16GB
  • RAM Size: 4GB
  • Connector Type: 168 Pin
  • Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
  • Operating Temperature: -40°C ~ 85°C
pacchetto: -
Request a Quote
ARM® Cortex®-A53, ARM® Cortex®-R5
Xilinx Zynq UltraScale+ XCZU9EG-2FFVC900I
600MHz, 1.5GHz
16GB
4GB
168 Pin
2.910" L x 2.130" W (74.00mm x 54.00mm)
-40°C ~ 85°C
TE0807-03-4BE21-A
Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

  • Module/Board Type: MPU Core
  • Core Processor: Zynq™ UltraScale+™ XCZU4EG-1FBVB900E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 4GB
  • Connector Type: Board-to-Board (BTB) Socket - 160
  • Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature: 0°C ~ 85°C
pacchetto: -
Request a Quote
Zynq™ UltraScale+™ XCZU4EG-1FBVB900E
-
-
128MB
4GB
Board-to-Board (BTB) Socket - 160
2.990" L x 2.050" W (76.00mm x 52.00mm)
0°C ~ 85°C
TE0720-03-61Q33ML
Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7020)
  • Speed: -
  • Flash Size: 8GB
  • RAM Size: 1GB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: -40°C ~ 85°C
pacchetto: -
Request a Quote
ARM Cortex-A9
Zynq-7000 (Z-7020)
-
8GB
1GB
Samtec LSHM
1.970" L x 1.570" W (50.00mm x 40.00mm)
-40°C ~ 85°C
TEC0850-03-BBEX1-A
Trenz Electronic GmbH

IC MODULE

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
pacchetto: -
Request a Quote
-
-
-
-
-
-
-
-
20-109-0199
Digi

20-109-0199

  • Module/Board Type: MPU Core
  • Core Processor: Rabbit 4000
  • Co-Processor: -
  • Speed: 58.98MHz
  • Flash Size: 1MB
  • RAM Size: 512KB
  • Connector Type: RJ-45
  • Size / Dimension: 5.750" L x 3.780" W (146.00mm x 96.00mm)
  • Operating Temperature: -20°C ~ 85°C
pacchetto: -
Request a Quote
Rabbit 4000
-
58.98MHz
1MB
512KB
RJ-45
5.750" L x 3.780" W (146.00mm x 96.00mm)
-20°C ~ 85°C
6231-HX-XXA-RC
Critical Link LLC

SOM WITH TI SITARA AM6231, 800MH

  • Module/Board Type: MPU Core
  • Core Processor: ARM® Cortex®-A53
  • Co-Processor: NEON SIMD
  • Speed: 800MHz
  • Flash Size: -
  • RAM Size: 1GB
  • Connector Type: SO-DIMM-260
  • Size / Dimension: 2.740" L x 1.500" W (69.60mm x 38.10mm)
  • Operating Temperature: 0°C ~ 70°C
pacchetto: -
Request a Quote
ARM® Cortex®-A53
NEON SIMD
800MHz
-
1GB
SO-DIMM-260
2.740" L x 1.500" W (69.60mm x 38.10mm)
0°C ~ 70°C
ME-AA1-270-3E4-D11E-R2
Enclustra FPGA Solutions

SOM ARRIA 10 10AS027 2GB

  • Module/Board Type: FPGA Core
  • Core Processor: ARM® Dual-Core Cortex-A9
  • Co-Processor: -
  • Speed: 1.5GHz
  • Flash Size: 16GB
  • RAM Size: 2GB
  • Connector Type: 168 Pin
  • Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
  • Operating Temperature: 0°C ~ 85°C
pacchetto: -
Request a Quote
ARM® Dual-Core Cortex-A9
-
1.5GHz
16GB
2GB
168 Pin
2.910" L x 2.130" W (74.00mm x 54.00mm)
0°C ~ 85°C
TE0803-04-4AE11-AZ
Trenz Electronic GmbH

MPSOC MODULE WITH AMD ZYNQ ULTRA

  • Module/Board Type: MPU Core
  • Core Processor: Xilinx Zynq UltraScale+ XCZU4CG-1SFVC784E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 2GB
  • Connector Type: Board-to-Board (BTB) Socket - 4 x 160
  • Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature: 0°C ~ 85°C
pacchetto: -
Request a Quote
Xilinx Zynq UltraScale+ XCZU4CG-1SFVC784E
-
-
128MB
2GB
Board-to-Board (BTB) Socket - 4 x 160
2.990" L x 2.050" W (76.00mm x 52.00mm)
0°C ~ 85°C
IW-G30M-C4EV-4E002G-E008G-BIA
iWave Systems

ZU4EV (-1 Speed) MPSoC SOM

  • Module/Board Type: MPU, FPGA
  • Core Processor: ARM® Cortex®-A53(x40, ARM® Cortex®-R5(x2)
  • Co-Processor: ARM® Mali 400 MP2
  • Speed: 1.5GHz, 600MHz
  • Flash Size: 8GB eMMC
  • RAM Size: 4GB, 1GB
  • Connector Type: 2 x 240 Pin
  • Size / Dimension: 4.330" L x 2.950" W (110.00mm x 75.00mm)
  • Operating Temperature: -40°C ~ 85°C
pacchetto: -
Request a Quote
ARM® Cortex®-A53(x40, ARM® Cortex®-R5(x2)
ARM® Mali 400 MP2
1.5GHz, 600MHz
8GB eMMC
4GB, 1GB
2 x 240 Pin
4.330" L x 2.950" W (110.00mm x 75.00mm)
-40°C ~ 85°C
TE0745-02-71I31-A
Trenz Electronic GmbH

MOD SOM DDR3L 1GB

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7030)
  • Speed: -
  • Flash Size: 64MB
  • RAM Size: 1GB
  • Connector Type: Board-to-Board (BTB) Socket - 160
  • Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature: -40°C ~ 85°C
pacchetto: -
Request a Quote
ARM Cortex-A9
Zynq-7000 (Z-7030)
-
64MB
1GB
Board-to-Board (BTB) Socket - 160
2.050" L x 2.990" W (52.00mm x 76.00mm)
-40°C ~ 85°C
TE0710-03-72C21-A
Trenz Electronic GmbH

IC MOD ARTIX7 A100T 100MHZ 512MB

  • Module/Board Type: FPGA
  • Core Processor: Artix™ 7 XC7A100T-2CSG324C
  • Co-Processor: -
  • Speed: -
  • Flash Size: 32MB
  • RAM Size: 512MB
  • Connector Type: 2 x 100 Pin
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: 0°C ~ 70°C
pacchetto: -
Request a Quote
Artix™ 7 XC7A100T-2CSG324C
-
-
32MB
512MB
2 x 100 Pin
1.970" L x 1.570" W (50.00mm x 40.00mm)
0°C ~ 70°C