Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Logic Elements/Cells | Total RAM Bits | Number of I/O | Number of Gates | Voltage - Supply | Mounting Type | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microsemi Corporation |
IC FPGA 195 I/O 400VFBGA
|
pacchetto: 400-LFBGA |
Azione2.100 |
|
12084 | 933888 | 195 | - | 1.14 V ~ 2.625 V | Surface Mount | -40°C ~ 100°C (TJ) | 400-LFBGA | 400-VFBGA (17x17) |
||
Microsemi Corporation |
IC FPGA 111 I/O 144FBGA
|
pacchetto: 144-LBGA |
Azione6.576 |
|
- | - | 111 | 24000 | 2.25 V ~ 5.25 V | Surface Mount | 0°C ~ 70°C (TA) | 144-LBGA | 144-FPBGA (13x13) |
||
Microsemi Corporation |
IC FPGA 56 I/O 100TQFP
|
pacchetto: 100-LQFP |
Azione6.624 |
|
128 | - | 56 | 3000 | 2.3 V ~ 2.7 V | Surface Mount | -40°C ~ 85°C (TA) | 100-LQFP | 100-TQFP (14x14) |
||
Microsemi Corporation |
IC FPGA 57 I/O 68PLCC
|
pacchetto: 68-LCC (J-Lead) |
Azione5.168 |
|
- | - | 57 | 2000 | 2.7 V ~ 3.6 V | Surface Mount | 0°C ~ 70°C (TA) | 68-LCC (J-Lead) | 68-PLCC (24.23x24.23) |
||
Microsemi Corporation |
IC FPGA 69 I/O 84PLCC
|
pacchetto: 84-LCC (J-Lead) |
Azione6.592 |
|
- | - | 69 | 12000 | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | Surface Mount | -40°C ~ 85°C (TA) | 84-LCC (J-Lead) | 84-PLCC (29.31x29.31) |
||
Xilinx Inc. |
IC FPGA 129 I/O 160QFP
|
pacchetto: 160-BQFP |
Azione5.200 |
|
950 | 12800 | 129 | 10000 | 4.75 V ~ 5.25 V | Surface Mount | 0°C ~ 85°C (TJ) | 160-BQFP | 160-PQFP (28x28) |
||
Altera |
IC FPGA 624 I/O 1932FCBGA
|
pacchetto: 1932-BBGA, FCBGA |
Azione7.280 |
|
900000 | 59234304 | 624 | - | 0.87 V ~ 0.98 V | Surface Mount | 0°C ~ 100°C (TJ) | 1932-BBGA, FCBGA | 1932-FCBGA (45x45) |
||
Altera |
IC FPGA 696 I/O 1517FBGA
|
pacchetto: 1517-BBGA, FCBGA |
Azione2.000 |
|
340000 | 23704576 | 696 | - | 0.82 V ~ 0.88 V | Surface Mount | 0°C ~ 85°C (TJ) | 1517-BBGA, FCBGA | 1517-FBGA (40x40) |
||
Microsemi Corporation |
IC FPGA SX-A 108K 256-CQFP
|
pacchetto: 256-BFCQFP with Tie Bar |
Azione3.968 |
|
- | - | 203 | 108000 | 2.25 V ~ 5.25 V | - | -55°C ~ 125°C (TJ) | 256-BFCQFP with Tie Bar | 256-CQFP (75x75) |
||
Xilinx Inc. |
IC FPGA 320 I/O 1156FCBGA
|
pacchetto: 1156-BBGA, FCBGA |
Azione7.456 |
|
382464 | 28311552 | 320 | - | 0.95 V ~ 1.05 V | Surface Mount | -40°C ~ 100°C (TJ) | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) |
||
Microsemi Corporation |
IC FPGA 712 I/O 1152FBGA
|
pacchetto: 1152-BGA |
Azione4.304 |
|
- | 202752 | 712 | 1000000 | 2.3 V ~ 2.7 V | Surface Mount | 0°C ~ 70°C (TA) | 1152-BGA | 1152-FPBGA (35x35) |
||
Xilinx Inc. |
IC FPGA 312 I/O 1156FCBGA
|
pacchetto: 1156-BBGA, FCBGA |
Azione2.896 |
|
318150 | 13004800 | 312 | - | 0.922 V ~ 0.979 V | Surface Mount | 0°C ~ 100°C (TJ) | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) |
||
Xilinx Inc. |
IC FPGA 240 I/O 484FCBGA
|
pacchetto: 484-BBGA, FCBGA |
Azione7.840 |
|
74496 | 5750784 | 240 | - | 0.95 V ~ 1.05 V | Surface Mount | -40°C ~ 100°C (TJ) | 484-BBGA, FCBGA | 484-FCBGA (23x23) |
||
Microsemi Corporation |
IC FPGA 119 I/O 256FBGA
|
pacchetto: 256-LBGA |
Azione2.672 |
|
- | 110592 | 119 | 600000 | 1.425 V ~ 1.575 V | Surface Mount | -55°C ~ 100°C (TJ) | 256-LBGA | 256-FPBGA (17x17) |
||
Xilinx Inc. |
IC FPGA 150 I/O 325BGA
|
pacchetto: 324-LFBGA, CSPBGA |
Azione3.872 |
|
33280 | 1843200 | 150 | - | 0.95 V ~ 1.05 V | Surface Mount | -40°C ~ 125°C (TJ) | 324-LFBGA, CSPBGA | 325-CSBGA (15x15) |
||
Microsemi Corporation |
IC FPGA 113 I/O 144TQFP
|
pacchetto: 144-LQFP |
Azione2.080 |
|
- | - | 113 | 24000 | 2.25 V ~ 5.25 V | Surface Mount | 0°C ~ 70°C (TA) | 144-LQFP | 144-TQFP (20x20) |
||
Lattice Semiconductor Corporation |
IC FPGA 222 I/O 484FBGA
|
pacchetto: 484-BBGA |
Azione2.752 |
|
17000 | 716800 | 222 | - | 1.14 V ~ 1.26 V | Surface Mount | 0°C ~ 85°C (TJ) | 484-BBGA | 484-FPBGA (23x23) |
||
Altera |
IC FPGA 101 I/O 144EQFP
|
pacchetto: 144-LQFP Exposed Pad |
Azione2.240 |
|
2000 | 110592 | 101 | - | 2.85 V ~ 3.465 V | Surface Mount | 0°C ~ 85°C (TJ) | 144-LQFP Exposed Pad | 144-EQFP (20x20) |
||
Lattice Semiconductor Corporation |
IC FPGA 222 I/O 484FBGA
|
pacchetto: 484-BBGA |
Azione4.400 |
|
17000 | 716800 | 222 | - | 1.14 V ~ 1.26 V | Surface Mount | 0°C ~ 85°C (TJ) | 484-BBGA | 484-FPBGA (23x23) |
||
Intel |
IC FPGA 597 I/O 780FBGA
|
pacchetto: 780-BBGA, FCBGA |
Azione5.232 |
|
32470 | 3317184 | 597 | - | 1.425 V ~ 1.575 V | Surface Mount | 0°C ~ 85°C (TJ) | 780-BBGA, FCBGA | 780-FBGA (29x29) |
||
Intel |
IC FPGA 976 I/O 1517FBGA
|
pacchetto: 1517-BBGA, FCBGA |
Azione6.752 |
|
255000 | 16672768 | 976 | - | 0.86 V ~ 1.15 V | Surface Mount | -40°C ~ 100°C (TJ) | 1517-BBGA, FCBGA | 1517-FBGA (40x40) |
||
Intel |
IC FPGA 360 I/O 780HBGA
|
pacchetto: 780-BBGA, FCBGA |
Azione3.584 |
|
360000 | 23946240 | 360 | - | 0.82 V ~ 0.88 V | Surface Mount | -40°C ~ 100°C (TJ) | 780-BBGA, FCBGA | 780-HBGA (33x33) |
||
Intel |
1152-PIN FBGA
|
pacchetto: 1152-BBGA, FCBGA |
Azione2.752 |
|
420000 | 23625728 | 544 | - | 1.12 V ~ 1.18 V | Surface Mount | -40°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA (35x35) |
||
Intel |
IC FPGA 233 I/O 324FBGA
|
pacchetto: 324-BGA |
Azione6.640 |
|
20060 | 294912 | 233 | - | 1.425 V ~ 1.575 V | Surface Mount | -40°C ~ 100°C (TJ) | 324-BGA | 324-FBGA (19x19) |
||
Xilinx Inc. |
XCVU11P-2FSGD2104E
|
pacchetto: 2104-BBGA, FCBGA |
Azione3.424 |
|
2835000 | 396150400 | 572 | - | 0.825 V ~ 0.876 V | Surface Mount | 0°C ~ 100°C (TJ) | 2104-BBGA, FCBGA | 2104-FCBGA (47.5x47.5) |
||
Intel |
IC FPGA 94 I/O 144EQFP
|
pacchetto: 144-LQFP Exposed Pad |
Azione15.462 |
|
5136 | 423936 | 94 | - | 1.15 V ~ 1.25 V | Surface Mount | 0°C ~ 85°C (TJ) | 144-LQFP Exposed Pad | 144-EQFP (20x20) |
||
Intel |
IC FPGA 564 I/O 1152FBGA
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Lattice Semiconductor Corporation |
IC FPGA AVANT 306KLC 1156BGA
|
pacchetto: - |
Request a Quote |
|
306000 | 2723840 | 468 | - | 0.82V | Surface Mount | -40°C ~ 100°C | 1156-BBGA | 1156-FPBGA (35x35) |