Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Logic Elements/Cells | Total RAM Bits | Number of I/O | Number of Gates | Voltage - Supply | Mounting Type | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Altera |
IC FPGA APEX 652BGA
|
pacchetto: - |
Azione4.432 |
|
24320 | 311296 | - | 600000 | 1.71 V ~ 1.89 V | - | 0°C ~ 85°C (TJ) | - | - |
||
Altera |
IC FPGA
|
pacchetto: 324-BGA |
Azione7.456 |
|
4160 | 53248 | 252 | 263000 | 2.375 V ~ 2.625 V | Surface Mount | -40°C ~ 100°C (TJ) | 324-BGA | 324-FBGA (19x19) |
||
Altera |
IC FPGA 147 I/O 208QFP
|
pacchetto: 208-BFQFP |
Azione22.200 |
|
1728 | 24576 | 147 | 119000 | 2.375 V ~ 2.625 V | Surface Mount | 0°C ~ 70°C (TA) | 208-BFQFP | 208-PQFP (28x28) |
||
Microsemi Corporation |
IC FPGA 235 I/O 484FBGA
|
pacchetto: 484-BGA |
Azione2.576 |
|
13824 | 110592 | 235 | 600000 | 1.14 V ~ 1.575 V | Surface Mount | 0°C ~ 70°C (TA) | 484-BGA | 484-FPBGA (23x23) |
||
Xilinx Inc. |
IC FPGA 112 I/O 156CPGA
|
pacchetto: 156-BCPGA |
Azione4.256 |
|
466 | 6272 | 112 | 5000 | 4.5 V ~ 5.5 V | Through Hole | -40°C ~ 100°C (TJ) | 156-BCPGA | 156-CPGA (42.17x42.17) |
||
Altera |
IC FPGA 600 I/O 1517FBGA
|
pacchetto: 1517-BBGA, FCBGA |
Azione5.328 |
|
490000 | 53105664 | 600 | - | 0.82 V ~ 0.88 V | Surface Mount | -40°C ~ 100°C (TJ) | 1517-BBGA, FCBGA | 1517-FBGA (40x40) |
||
Altera |
IC FPGA 432 I/O 1152FBGA
|
pacchetto: 1152-BBGA, FCBGA |
Azione4.848 |
|
490000 | 53105664 | 432 | - | 0.82 V ~ 0.88 V | Surface Mount | 0°C ~ 85°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA (35x35) |
||
Microsemi Corporation |
IC FPGA 317 I/O 484FBGA
|
pacchetto: 484-BGA |
Azione2.944 |
|
- | 73728 | 317 | 500000 | 1.425 V ~ 1.575 V | Surface Mount | -55°C ~ 125°C (TA) | 484-BGA | 484-FPBGA (23x23) |
||
Microsemi Corporation |
IC FPGA 104 I/O 176TQFP
|
pacchetto: 176-LQFP |
Azione6.752 |
|
- | - | 104 | 14000 | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | Surface Mount | -55°C ~ 125°C (TC) | 176-LQFP | 176-TQFP (24x24) |
||
Microsemi Corporation |
IC FPGA 81 I/O 100TQFP
|
pacchetto: 100-LQFP |
Azione4.848 |
|
- | - | 81 | 24000 | 2.25 V ~ 5.25 V | Surface Mount | -55°C ~ 125°C (TC) | 100-LQFP | 100-TQFP (14x14) |
||
Xilinx Inc. |
IC FPGA 320 I/O 672FCBGA
|
pacchetto: 672-BBGA, FCBGA |
Azione5.984 |
|
19224 | 1253376 | 320 | - | 1.14 V ~ 1.26 V | Surface Mount | 0°C ~ 85°C (TJ) | 672-BBGA, FCBGA | 672-FCBGA (27x27) |
||
Microsemi Corporation |
IC FPGA 267 I/O 484FBGA
|
pacchetto: 484-BGA |
Azione7.120 |
|
56520 | 1869824 | 267 | - | 1.14 V ~ 2.625 V | Surface Mount | -40°C ~ 100°C (TJ) | 484-BGA | 484-FBGA (23x23) |
||
Xilinx Inc. |
IC FPGA 218 I/O 324CSGBGA
|
pacchetto: 324-LFBGA, CSPBGA |
Azione3.200 |
|
43661 | 2138112 | 218 | - | 1.14 V ~ 1.26 V | Surface Mount | -40°C ~ 100°C (TJ) | 324-LFBGA, CSPBGA | 324-CSPBGA (15x15) |
||
Xilinx Inc. |
IC FPGA 173 I/O 256FTBGA
|
pacchetto: 256-LBGA |
Azione7.152 |
|
8064 | 294912 | 173 | 400000 | 1.14 V ~ 1.26 V | Surface Mount | -40°C ~ 100°C (TJ) | 256-LBGA | 256-FTBGA (17x17) |
||
Xilinx Inc. |
IC FPGA 108 I/O 144TQFP
|
pacchetto: 144-LQFP |
Azione4.304 |
|
2160 | 73728 | 108 | 100000 | 1.14 V ~ 1.26 V | Surface Mount | -40°C ~ 100°C (TJ) | 144-LQFP | 144-TQFP (20x20) |
||
Microsemi Corporation |
IC FPGA 161 I/O 256VFBGA
|
pacchetto: 256-LFBGA |
Azione3.776 |
|
6060 | 719872 | 161 | - | 1.14 V ~ 2.625 V | Surface Mount | 0°C ~ 85°C (TJ) | 256-LFBGA | 256-BGA (17x17) |
||
Xilinx Inc. |
IC FPGA 132 I/O 225CSBGA
|
pacchetto: 225-LFBGA, CSPBGA |
Azione81.408 |
|
3840 | 221184 | 132 | - | 1.14 V ~ 1.26 V | Surface Mount | 0°C ~ 85°C (TJ) | 225-LFBGA, CSPBGA | 225-CSPBGA (13x13) |
||
Microchip Technology |
IC FPGA 193 I/O 240QFP
|
pacchetto: 240-BFQFP |
Azione7.116 |
|
1024 | 8192 | 193 | 30000 | 4.75 V ~ 5.25 V | Surface Mount | 0°C ~ 70°C (TC) | 240-BFQFP | 240-PQFP (32x32) |
||
Xilinx Inc. |
XC7S75-1FGGA676C
|
pacchetto: 676-BGA |
Azione3.248 |
|
76800 | 4331520 | 400 | - | 0.95 V ~ 1.05 V | Surface Mount | 0°C ~ 85°C (TJ) | 676-BGA | 676-FPBGA (27x27) |
||
Intel |
IC FPGA 171 I/O 208QFP
|
pacchetto: 208-BFQFP |
Azione4.272 |
|
1320 | - | 171 | 16000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 208-BFQFP | 208-PQFP (28x28) |
||
Intel |
IC FPGA 840 I/O 1932FBGA
|
pacchetto: 1932-BBGA, FCBGA |
Azione2.816 |
|
840000 | 64210944 | 840 | - | 0.87 V ~ 0.93 V | Surface Mount | 0°C ~ 85°C (TJ) | 1932-BBGA, FCBGA | 1932-FBGA, FC (45x45) |
||
Intel |
IC FPGA 704 I/O 1517FBGA
|
pacchetto: 1517-BBGA |
Azione7.712 |
|
504000 | 27695104 | 704 | - | 1.07 V ~ 1.13 V | Surface Mount | -40°C ~ 100°C (TJ) | 1517-BBGA | 1517-FBGA (40x40) |
||
Intel |
IC FPGA 488 I/O 1152FBGA
|
pacchetto: 1152-BBGA, FCBGA |
Azione7.680 |
|
105600 | 9793536 | 488 | - | 0.87 V ~ 0.93 V | Surface Mount | -40°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA (35x35) |
||
Intel |
IC FPGA 331 I/O 484FBGA
|
pacchetto: 484-BGA |
Azione7.072 |
|
39600 | 1161216 | 331 | - | 1.15 V ~ 1.25 V | Surface Mount | -40°C ~ 100°C (TJ) | 484-BGA | 484-FBGA (23x23) |
||
Intel |
IC FPGA 500 I/O 672FBGA
|
pacchetto: 672-BGA |
Azione5.440 |
|
50000 | 1677312 | 500 | - | 1.15 V ~ 1.25 V | Surface Mount | 0°C ~ 85°C (TJ) | 672-BGA | 672-FBGA (27x27) |
||
Intel |
IC FPGA 249 I/O 324FBGA
|
pacchetto: 324-BGA |
Azione7.296 |
|
12060 | 239616 | 249 | - | 1.425 V ~ 1.575 V | Surface Mount | 0°C ~ 85°C (TJ) | 324-BGA | 324-FBGA (19x19) |
||
Microsemi Corporation |
MX CERAMIC QUAD FLAT PACK
|
pacchetto: - |
Azione4.848 |
|
- | - | 131 | 24000 | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | - | 0°C ~ 70°C (TA) | - | - |
||
Intel |
IC FPGA 564 I/O 1152FBGA
|
pacchetto: - |
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