Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Logic Elements/Cells | Total RAM Bits | Number of I/O | Number of Gates | Voltage - Supply | Mounting Type | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microsemi Corporation |
IC FPGA 147 I/O 208QFP
|
pacchetto: 208-BFQFP |
Azione4.320 |
|
- | 110592 | 147 | 600000 | 1.425 V ~ 1.575 V | Surface Mount | -40°C ~ 100°C (TJ) | 208-BFQFP | 208-PQFP (28x28) |
||
Lattice Semiconductor Corporation |
IC FPGA 372 I/O 680FBGA
|
pacchetto: 680-BBGA |
Azione7.744 |
|
10368 | 113664 | 372 | 643000 | 1.425 V ~ 3.6 V | Surface Mount | 0°C ~ 70°C (TA) | 680-BBGA | 680-FPBGA (35x35) |
||
Lattice Semiconductor Corporation |
IC FPGA 436 I/O 1152FBGA
|
pacchetto: 1152-BBGA |
Azione4.784 |
|
67000 | 4642816 | 436 | - | 1.14 V ~ 1.26 V | Surface Mount | -40°C ~ 100°C (TJ) | 1152-BBGA | 1152-FPBGA (35x35) |
||
Microsemi Corporation |
IC FPGA 175 I/O 208QFP
|
pacchetto: 208-BFQFP |
Azione7.608 |
|
- | - | 175 | 24000 | 2.25 V ~ 5.25 V | Surface Mount | 0°C ~ 70°C (TA) | 208-BFQFP | 208-PQFP (28x28) |
||
Xilinx Inc. |
IC FPGA 173 I/O 256FTBGA
|
pacchetto: 256-LBGA |
Azione3.808 |
|
17280 | 442368 | 173 | 1000000 | 1.14 V ~ 1.26 V | Surface Mount | 0°C ~ 85°C (TJ) | 256-LBGA | 256-FTBGA (17x17) |
||
Xilinx Inc. |
IC FPGA 512 I/O 680FBGA
|
pacchetto: 680-LBGA Exposed Pad |
Azione5.824 |
|
27648 | 131072 | 512 | 1124022 | 2.375 V ~ 2.625 V | Surface Mount | 0°C ~ 85°C (TJ) | 680-LBGA Exposed Pad | 680-FTEBGA (40x40) |
||
Xilinx Inc. |
IC FPGA 256 I/O 304HQFP
|
pacchetto: 304-BFQFP Exposed Pad |
Azione2.100 |
|
5472 | 73728 | 256 | 62000 | 3 V ~ 3.6 V | Surface Mount | -40°C ~ 100°C (TJ) | 304-BFQFP Exposed Pad | 304-PQFP (40x40) |
||
Altera |
IC FPGA 336 I/O 672FBGA
|
pacchetto: 672-BGA |
Azione4.176 |
|
301000 | 14251008 | 336 | - | 1.07 V ~ 1.13 V | Surface Mount | 0°C ~ 85°C (TJ) | 672-BGA | 672-FBGA (27x27) |
||
Xilinx Inc. |
XCVU9P-2FLGA2104E
|
pacchetto: - |
Azione3.104 |
|
2586150 | 354201600 | 832 | - | 0.825 V ~ 0.876 V | - | 0°C ~ 100°C (TJ) | - | - |
||
Xilinx Inc. |
IC FPGA 720 I/O 1923FCBGA
|
pacchetto: 1924-BBGA, FCBGA |
Azione6.336 |
|
566784 | 33619968 | 720 | - | 0.95 V ~ 1.05 V | Surface Mount | 0°C ~ 85°C (TJ) | 1924-BBGA, FCBGA | 1924-FCBGA (45x45) |
||
Microsemi Corporation |
IC FPGA 388 I/O
|
pacchetto: - |
Azione7.920 |
|
481000 | 33792000 | 388 | - | 0.97 V ~ 1.08 V | - | -40°C ~ 100°C (TJ) | - | - |
||
Xilinx Inc. |
IC FPGA 268 I/O 484FBGA
|
pacchetto: 484-BBGA |
Azione5.904 |
|
74637 | 3170304 | 268 | - | 1.14 V ~ 1.26 V | Surface Mount | -40°C ~ 100°C (TJ) | 484-BBGA | 484-FBGA (23x23) |
||
Microsemi Corporation |
IC FPGA 101 I/O 160QFP
|
pacchetto: 160-BQFP |
Azione5.520 |
|
- | - | 101 | 14000 | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | Surface Mount | -40°C ~ 125°C (TA) | 160-BQFP | 160-PQFP (28x28) |
||
Microsemi Corporation |
IC FPGA 81 I/O 100TQFP
|
pacchetto: 100-LQFP |
Azione5.600 |
|
- | - | 81 | 48000 | 2.25 V ~ 5.25 V | Surface Mount | 0°C ~ 70°C (TA) | 100-LQFP | 100-TQFP (14x14) |
||
Microsemi Corporation |
IC FPGA 66 I/O 100TQFP
|
pacchetto: 100-LQFP |
Azione2.336 |
|
- | 36864 | 66 | 150000 | 2.375 V ~ 2.625 V | Surface Mount | -40°C ~ 125°C (TJ) | 100-LQFP | 100-TQFP (14x14) |
||
Microsemi Corporation |
IC FPGA 81 I/O 100TQFP
|
pacchetto: 100-LQFP |
Azione8.928 |
|
- | - | 81 | 12000 | 2.25 V ~ 5.25 V | Surface Mount | 0°C ~ 70°C (TA) | 100-LQFP | 100-TQFP (14x14) |
||
Microsemi Corporation |
IC FPGA 212 I/O 281CSP
|
pacchetto: 281-TFBGA, CSBGA |
Azione7.920 |
|
3120 | 36864 | 212 | 125000 | 1.425 V ~ 1.575 V | Surface Mount | 0°C ~ 85°C (TJ) | 281-TFBGA, CSBGA | 281-CSP (10x10) |
||
Lattice Semiconductor Corporation |
MACHXO2 HIGH PERFORMANCE 640 LUT
|
pacchetto: 48-VFQFN Exposed Pad |
Azione7.440 |
|
640 | 18432 | 40 | - | 2.375 V ~ 3.465 V | Surface Mount | -40°C ~ 100°C (TJ) | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
Lattice Semiconductor Corporation |
IC FPGA 73 I/O 100TQFP
|
pacchetto: 100-LQFP |
Azione4.528 |
|
2280 | 28262 | 73 | - | 1.71 V ~ 3.465 V | Surface Mount | 0°C ~ 85°C (TJ) | 100-LQFP | 100-TQFP (14x14) |
||
Xilinx Inc. |
XC7A25T-L2CPG238E
|
pacchetto: 238-LFBGA, CSPBGA |
Azione6.992 |
|
23360 | 1658880 | 150 | - | 0.87 V ~ 0.93 V | Surface Mount | 0°C ~ 100°C (TJ) | 238-LFBGA, CSPBGA | 236-CSBGA (10x10) |
||
Intel |
IC FPGA FBGA
|
pacchetto: 256-BGA |
Azione2.528 |
|
5980 | 92160 | 185 | - | 1.425 V ~ 1.575 V | Surface Mount | 0°C ~ 85°C (TJ) | 256-BGA | 256-FBGA (17x17) |
||
Intel |
IC FPGA
|
pacchetto: 144-LQFP |
Azione4.992 |
|
1728 | 24576 | 102 | 119000 | 2.375 V ~ 2.625 V | Surface Mount | -40°C ~ 85°C (TA) | 144-LQFP | 144-TQFP (20x20) |
||
Intel |
IC FPGA 696 I/O 1517HBGA
|
pacchetto: 1517-BBGA, FCBGA |
Azione7.584 |
|
840000 | 64210944 | 696 | - | 0.82 V ~ 0.88 V | Surface Mount | -40°C ~ 100°C (TJ) | 1517-BBGA, FCBGA | 1517-HBGA (45x45) |
||
Intel |
IC FPGA 81 I/O 144EQFP
|
pacchetto: 144-LQFP Exposed Pad |
Azione7.456 |
|
15408 | 516096 | 81 | - | 0.97 V ~ 1.03 V | Surface Mount | 0°C ~ 85°C (TJ) | 144-LQFP Exposed Pad | 144-EQFP (20x20) |
||
Lattice Semiconductor Corporation |
LATTICE AVANT MID-RANGE GENERAL
|
pacchetto: - |
Request a Quote |
|
637000 | 4239360 | 349 | - | 0.82V | Surface Mount | -40°C ~ 100°C (TJ) | 484-BGA, FCCSPBGA | 484-FCCSP (19x19) |
||
Intel |
IC FPGA 600 I/O 1760FBGA
|
pacchetto: - |
Request a Quote |
|
597000 | 53248000 | 600 | - | 0.82V ~ 0.88V | Surface Mount | 0°C ~ 85°C (TJ) | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) |
||
Intel |
IC FPGA 600 I/O 780HBGA
|
pacchetto: - |
Request a Quote |
|
340000 | 19456000 | 600 | - | 0.82V ~ 0.88V | Surface Mount | -40°C ~ 100°C (TJ) | 780-BBGA, FCBGA | 780-HBGA (33x33) |
||
Lattice Semiconductor Corporation |
IC FPGA 180 I/O 289CSFBGA
|
pacchetto: - |
Request a Quote |
|
39000 | 1548288 | 180 | - | 0.95V ~ 1.05V | Surface Mount | 0°C ~ 85°C (TJ) | 289-TFBGA, CSBGA | 289-CSBGA (9.5x9.5) |