Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Logic Elements/Cells | Total RAM Bits | Number of I/O | Number of Gates | Voltage - Supply | Mounting Type | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Altera |
IC FPGA 136 I/O 208QFP
|
pacchetto: 208-BQFP |
Azione3.744 |
|
8320 | 106496 | 136 | 526000 | 1.71 V ~ 1.89 V | Surface Mount | 0°C ~ 85°C (TJ) | 208-BQFP | 208-QFP (28x28) |
||
Altera |
IC FPGA 143 I/O 208QFP
|
pacchetto: 208-BQFP |
Azione5.616 |
|
6400 | 81920 | 143 | 404000 | 1.71 V ~ 1.89 V | Surface Mount | 0°C ~ 85°C (TJ) | 208-BQFP | 208-QFP (28x28) |
||
Lattice Semiconductor Corporation |
IC FPGA 204 I/O 484FBGA
|
pacchetto: 484-BBGA |
Azione3.584 |
|
10368 | 113664 | 204 | 643000 | 1.425 V ~ 3.6 V | Surface Mount | 0°C ~ 70°C (TA) | 484-BBGA | 484-FPBGA (23x23) |
||
Microsemi Corporation |
IC FPGA 130 I/O 208QFP
|
pacchetto: 208-BFQFP |
Azione5.088 |
|
- | - | 130 | 12000 | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | Surface Mount | 0°C ~ 70°C (TA) | 208-BFQFP | 208-PQFP (28x28) |
||
Lattice Semiconductor Corporation |
IC FPGA 74 I/O 100CSBGA
|
pacchetto: 100-LFBGA, CSPBGA |
Azione3.312 |
|
640 | - | 74 | - | 1.71 V ~ 3.465 V | Surface Mount | 0°C ~ 85°C (TJ) | 100-LFBGA, CSPBGA | 100-CSBGA (8x8) |
||
Altera |
IC FPGA 396 I/O 1152FCBGA
|
pacchetto: 1152-BBGA, FCBGA |
Azione3.136 |
|
660000 | 49610752 | 492 | - | 0.87 V ~ 0.98 V | Surface Mount | 0°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA (35x35) |
||
Altera |
IC FPGA 360 I/O 780HBGA
|
pacchetto: 780-BBGA, FCBGA |
Azione7.376 |
|
236000 | 16937984 | 360 | - | 0.87 V ~ 0.93 V | Surface Mount | 0°C ~ 85°C (TJ) | 780-BBGA, FCBGA | 780-HBGA (33x33) |
||
Altera |
IC FPGA 532 I/O 780FBGA
|
pacchetto: 780-BGA |
Azione7.152 |
|
28848 | 608256 | 532 | - | 0.97 V ~ 1.03 V | Surface Mount | -40°C ~ 100°C (TJ) | 780-BGA | 780-FBGA (29x29) |
||
Xilinx Inc. |
IC FPGA VIRTEX 6 314K 1156-BGA
|
pacchetto: 1156-BBGA, FCBGA |
Azione7.984 |
|
314880 | 25952256 | 600 | - | 0.95 V ~ 1.05 V | Surface Mount | -55°C ~ 125°C (TJ) | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) |
||
Microsemi Corporation |
IC FPGA 69 I/O 84CQFP
|
pacchetto: 84-CQFP Exposed Pad and Tie Bar |
Azione6.304 |
|
- | - | 69 | 48000 | 2.25 V ~ 5.25 V | Surface Mount | -55°C ~ 125°C (TC) | 84-CQFP Exposed Pad and Tie Bar | 84-CQFP (42x42) |
||
Xilinx Inc. |
IC FPGA 400 I/O 784FCBGA
|
pacchetto: 784-BBGA, FCBGA |
Azione4.496 |
|
128000 | 9732096 | 400 | - | 0.95 V ~ 1.05 V | Surface Mount | -40°C ~ 100°C (TJ) | 784-BBGA, FCBGA | 784-FCBGA (29x29) |
||
Xilinx Inc. |
IC FPGA 404 I/O 676FBGA
|
pacchetto: 676-BGA |
Azione6.720 |
|
20880 | 1622016 | 404 | - | 1.425 V ~ 1.575 V | Surface Mount | -40°C ~ 100°C (TJ) | 676-BGA | 676-FBGA (27x27) |
||
Microsemi Corporation |
IC FPGA 172 I/O 484FBGA
|
pacchetto: 484-BGA |
Azione3.744 |
|
- | 110592 | 172 | 600000 | 1.425 V ~ 1.575 V | Surface Mount | -40°C ~ 85°C (TA) | 484-BGA | 484-FPBGA (23x23) |
||
Xilinx Inc. |
IC FPGA VIRTEX-4 24K DIE
|
pacchetto: Die |
Azione6.240 |
|
24192 | 1327104 | - | - | 1.14 V ~ 1.26 V | Surface Mount | - | Die | Die |
||
Microsemi Corporation |
IC FPGA 235 I/O 484FBGA
|
pacchetto: 484-BGA |
Azione6.448 |
|
- | 110592 | 235 | 600000 | 1.14V ~ 1.575 V | Surface Mount | -40°C ~ 100°C (TJ) | 484-BGA | 484-FPBGA (23x23) |
||
Microsemi Corporation |
IC FPGA 267 I/O 484FBGA
|
pacchetto: 484-BGA |
Azione6.496 |
|
27696 | 1130496 | 267 | - | 1.14 V ~ 2.625 V | Surface Mount | -40°C ~ 100°C (TJ) | 484-BGA | 484-FPBGA (23x23) |
||
Microsemi Corporation |
IC FPGA 233 I/O 484FBGA
|
pacchetto: 484-BGA |
Azione2.992 |
|
12084 | 933888 | 233 | - | 1.14 V ~ 2.625 V | Surface Mount | -40°C ~ 100°C (TJ) | 484-BGA | 484-FPBGA (23x23) |
||
Intel |
IC FPGA 148 I/O 208QFP
|
pacchetto: 208-BFQFP |
Azione3.872 |
|
2560 | 32768 | 148 | 162000 | 1.71 V ~ 1.89 V | Surface Mount | 0°C ~ 85°C (TJ) | 208-BFQFP | 208-PQFP (28x28) |
||
Intel |
IC FPGA 432 I/O 1517FBGA
|
pacchetto: 1517-BBGA, FCBGA |
Azione7.488 |
|
597000 | 61688832 | 432 | - | 0.82 V ~ 0.88 V | Surface Mount | 0°C ~ 85°C (TJ) | 1517-BBGA, FCBGA | 1517-FBGA (40x40) |
||
Intel |
IC FPGA 176 I/O 256 UBGA
|
pacchetto: 256-LFBGA |
Azione6.132 |
|
10320 | 423936 | 176 | - | 1.2V | Surface Mount | 0°C ~ 85°C (TJ) | 256-LFBGA | 256-UBGA (14x14) |
||
Lattice Semiconductor Corporation |
IC FPGA
|
pacchetto: 256-LFBGA |
Azione6.304 |
|
44000 | 1990656 | 197 | - | 1.045 V ~ 1.155 V | Surface Mount | 0°C ~ 85°C (TJ) | 256-LFBGA | 256-CABGA (14x14) |
||
Intel |
324-PIN UBGA
|
pacchetto: - |
Azione4.576 |
|
- | - | - | - | - | - | - | - | - |
||
Xilinx Inc. |
XCKU13P-L2FFVE900E
|
pacchetto: 900-BBGA, FCBGA |
Azione2.352 |
|
746550 | 70656000 | 304 | - | 0.698 V ~ 0.876 V | Surface Mount | 0°C ~ 110°C (TJ) | 900-BBGA, FCBGA | 900-FCBGA (31x31) |
||
Intel |
IC FPGA 554 I/O 1152FBGA
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Intel |
IC FPGA 432 I/O 1517FBGA
|
pacchetto: - |
Request a Quote |
|
597000 | 53248000 | 432 | - | 0.82V ~ 0.88V | Surface Mount | -40°C ~ 100°C (TJ) | 1517-FBGA (40x40) | 1517-FBGA (40x40) |
||
Intel |
IC FPGA 360 I/O 780HBGA
|
pacchetto: - |
Request a Quote |
|
360000 | 19456000 | 360 | - | 0.82V ~ 0.88V | Surface Mount | 0°C ~ 85°C (TJ) | 780-BBGA, FCBGA | 780-HBGA (33x33) |
||
Intel |
IC FPGA 744 I/O 1517FBGA
|
pacchetto: - |
Request a Quote |
|
228000 | 17544192 | 744 | - | 0.87V ~ 0.93V | Surface Mount | 0°C ~ 85°C (TJ) | 1517-BBGA, FCBGA | 1517-FBGA (40x40) |
||
Intel |
IC FPGA 744 I/O 1517FBGA
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |