Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Logic Elements/Cells | Total RAM Bits | Number of I/O | Number of Gates | Voltage - Supply | Mounting Type | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Altera |
IC FPGA
|
pacchetto: 208-BQFP |
Azione5.728 |
|
11520 | 147456 | - | 728000 | 1.71 V ~ 1.89 V | Surface Mount | 0°C ~ 85°C (TJ) | 208-BQFP | 208-QFP (28x28) |
||
Altera |
IC FPGA
|
pacchetto: 672-BBGA |
Azione4.336 |
|
38400 | 327680 | 508 | 1772000 | 1.71 V ~ 1.89 V | Surface Mount | 0°C ~ 85°C (TJ) | 672-BBGA | 672-FBGA (27x27) |
||
Lattice Semiconductor Corporation |
IC FPGA 604 I/O 1152FCBGA
|
pacchetto: 1152-BCBGA, FCBGA |
Azione3.072 |
|
40000 | 4075520 | 604 | - | 0.95 V ~ 1.26 V | Surface Mount | -40°C ~ 105°C (TJ) | 1152-BCBGA, FCBGA | 1152-CFCBGA (35x35) |
||
Lattice Semiconductor Corporation |
IC FPGA 295 I/O 484FBGA
|
pacchetto: 484-BBGA |
Azione6.416 |
|
92000 | 4526080 | 295 | - | 1.14 V ~ 1.26 V | Surface Mount | -40°C ~ 100°C (TJ) | 484-BBGA | 484-FPBGA (23x23) |
||
Microsemi Corporation |
IC FPGA 175 I/O 208QFP
|
pacchetto: 208-BFQFP |
Azione7.968 |
|
- | - | 175 | 24000 | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | Surface Mount | -40°C ~ 85°C (TA) | 208-BFQFP | 208-PQFP (28x28) |
||
Microsemi Corporation |
IC FPGA 147 I/O 208QFP
|
pacchetto: 208-BFQFP |
Azione2.672 |
|
- | 110592 | 147 | 600000 | 1.425 V ~ 1.575 V | Surface Mount | 0°C ~ 85°C (TJ) | 208-BFQFP | 208-PQFP (28x28) |
||
Altera |
IC FPGA 342 I/O 1517FCBGA
|
pacchetto: 1517-BBGA, FCBGA |
Azione6.176 |
|
1150000 | 68857856 | 342 | - | 0.87 V ~ 0.93 V | Surface Mount | -40°C ~ 100°C (TJ) | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) |
||
Altera |
IC FPGA 552 I/O 1152FBGA
|
pacchetto: 1152-BBGA, FCBGA |
Azione4.704 |
|
490000 | 53105664 | 552 | - | 0.82 V ~ 0.88 V | Surface Mount | -40°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA (35x35) |
||
Xilinx Inc. |
IC FPGA 768 I/O 1517FCBGA
|
pacchetto: 1517-BBGA, FCBGA |
Azione5.872 |
|
142128 | 10174464 | 768 | - | 1.14 V ~ 1.26 V | Surface Mount | 0°C ~ 85°C (TJ) | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) |
||
Xilinx Inc. |
IC FPGA 350 I/O 1158FCBGA
|
pacchetto: 1156-BBGA, FCBGA |
Azione7.616 |
|
693120 | 54190080 | 350 | - | 0.97 V ~ 1.03 V | Surface Mount | 0°C ~ 85°C (TJ) | 1156-BBGA, FCBGA | 1158-FCBGA (35x35) |
||
Xilinx Inc. |
IC FPGA 692 I/O 1152FCBGA
|
pacchetto: 1152-BBGA, FCBGA |
Azione4.992 |
|
53136 | 4276224 | 692 | - | 1.425 V ~ 1.575 V | Surface Mount | 0°C ~ 85°C (TJ) | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) |
||
Xilinx Inc. |
XCKU9P-1FFVE900I
|
pacchetto: - |
Azione6.448 |
|
599550 | 32870400 | 304 | - | 0.87 V ~ 0.93 V | - | -40°C ~ 100°C (TJ) | - | - |
||
Microsemi Corporation |
IC FPGA 620 I/O 896FBGA
|
pacchetto: 896-BGA |
Azione6.144 |
|
- | 516096 | 620 | 3000000 | 1.425 V ~ 1.575 V | Surface Mount | 0°C ~ 85°C (TJ) | 896-BGA | 896-FBGA (31x31) |
||
Microsemi Corporation |
IC FPGA 267 I/O 484FBGA
|
pacchetto: - |
Azione7.072 |
|
86316 | 2648064 | 267 | - | 1.14 V ~ 2.625 V | - | -40°C ~ 135°C (TJ) | - | - |
||
Microsemi Corporation |
IC FPGA 444 I/O 676FBGA
|
pacchetto: 676-BGA |
Azione4.528 |
|
- | 276480 | 444 | 1500000 | 1.425 V ~ 1.575 V | Surface Mount | 0°C ~ 85°C (TJ) | 676-BGA | 676-FBGA (27x27) |
||
Xilinx Inc. |
IC FPGA 200 I/O 324CSBGA
|
pacchetto: 324-LFBGA, CSPBGA |
Azione6.176 |
|
9152 | 589824 | 200 | - | 1.14 V ~ 1.26 V | Surface Mount | -40°C ~ 100°C (TJ) | 324-LFBGA, CSPBGA | 324-CSPBGA (15x15) |
||
Microsemi Corporation |
IC FPGA 143 I/O 196CSP
|
pacchetto: 196-TFBGA, CSBGA |
Azione3.616 |
|
6144 | 36864 | 143 | 250000 | 1.425 V ~ 1.575 V | Surface Mount | 0°C ~ 70°C (TA) | 196-TFBGA, CSBGA | 196-CSP (8x8) |
||
Xilinx Inc. |
IC FPGA 60 I/O 100VQFP
|
pacchetto: 100-TQFP |
Azione3.904 |
|
972 | 24576 | 60 | 30000 | 2.375 V ~ 2.625 V | Surface Mount | 0°C ~ 85°C (TJ) | 100-TQFP | 100-VQFP (14x14) |
||
Xilinx Inc. |
IC FPGA 63 I/O 100VQFP
|
pacchetto: 100-TQFP |
Azione53.148 |
|
1728 | 73728 | 63 | 50000 | 1.14 V ~ 1.26 V | Surface Mount | 0°C ~ 85°C (TJ) | 100-TQFP | 100-VQFP (14x14) |
||
Altera |
IC FPGA 171 I/O 208QFP
|
pacchetto: 208-BQFP |
Azione12.132 |
|
1320 | - | 171 | 16000 | 4.75 V ~ 5.25 V | Surface Mount | 0°C ~ 85°C (TJ) | 208-BQFP | 208-QFP (28x28) |
||
Intel |
IC FPGA
|
pacchetto: 240-BFQFP Exposed Pad |
Azione3.200 |
|
16640 | 212992 | - | 1052000 | 1.71 V ~ 1.89 V | Surface Mount | -40°C ~ 100°C (TJ) | 240-BFQFP Exposed Pad | 240-RQFP (32x32) |
||
Intel |
IC FPGA 271 I/O 356BGA
|
pacchetto: 356-LBGA |
Azione5.920 |
|
8320 | 106496 | 271 | 526000 | 1.71 V ~ 1.89 V | Surface Mount | 0°C ~ 85°C (TJ) | 356-LBGA | 356-BGA (35x35) |
||
Intel |
IC FPGA 840 I/O 1932FBGA
|
pacchetto: 1932-BBGA, FCBGA |
Azione7.552 |
|
952000 | 65561600 | 840 | - | 0.82 V ~ 0.88 V | Surface Mount | 0°C ~ 85°C (TJ) | 1932-BBGA, FCBGA | 1932-FBGA, FC (45x45) |
||
Intel |
IC FPGA 696 I/O 1517FBGA
|
pacchetto: 1517-BBGA, FCBGA |
Azione7.904 |
|
622000 | 59939840 | 696 | - | 0.82 V ~ 0.88 V | Surface Mount | -40°C ~ 100°C (TJ) | 1517-BBGA, FCBGA | 1517-FBGA (40x40) |
||
Intel |
IC FPGA 360 I/O 780HBGA
|
pacchetto: 780-BBGA, FCBGA |
Azione7.152 |
|
360000 | 23946240 | 360 | - | 0.87 V ~ 0.93 V | Surface Mount | 0°C ~ 85°C (TJ) | 780-BBGA, FCBGA | 780-HBGA (33x33) |
||
Intel |
IC FPGA 432 I/O 1152FBGA
|
pacchetto: 1152-BBGA, FCBGA |
Azione3.056 |
|
420000 | 43983872 | 432 | - | 0.82 V ~ 0.88 V | Surface Mount | -40°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA (35x35) |
||
Altera |
LOADABLE PLD, CMOS, PQFP208
|
pacchetto: - |
Request a Quote |
|
504 | - | 136 | 6000 | 4.75V ~ 5.25V | Surface Mount | 0°C ~ 70°C (TA) | 208-BFQFP Exposed Pad | 208-RQFP (28x28) |
||
Intel |
IC FPGA 432 I/O 1152FBGA
|
pacchetto: - |
Request a Quote |
|
340000 | 19456000 | 432 | - | 0.82V ~ 0.88V | Surface Mount | -40°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA (35x35) |