Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Logic Elements/Cells | Total RAM Bits | Number of I/O | Number of Gates | Voltage - Supply | Mounting Type | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Xilinx Inc. |
IC FPGA 400 I/O 676FCBGA
|
pacchetto: 676-BBGA, FCBGA |
Azione7.776 |
|
406720 | 29306880 | 400 | - | 0.97 V ~ 1.03 V | Surface Mount | 0°C ~ 85°C (TJ) | 676-BBGA, FCBGA | 676-FCBGA (27x27) |
||
Lattice Semiconductor Corporation |
IC FPGA 159 I/O 256FBGA
|
pacchetto: 256-BGA |
Azione6.432 |
|
640 | - | 159 | - | 1.14 V ~ 1.26 V | Surface Mount | 0°C ~ 85°C (TJ) | 256-BGA | 256-FPBGA (17x17) |
||
Microsemi Corporation |
IC FPGA 194 I/O 484FBGA
|
pacchetto: 484-BGA |
Azione3.424 |
|
- | 55296 | 194 | 400000 | 1.425 V ~ 1.575 V | Surface Mount | 0°C ~ 85°C (TJ) | 484-BGA | 484-FPBGA (23x23) |
||
Xilinx Inc. |
IC FPGA 404 I/O 560MBGA
|
pacchetto: 560-LBGA, Metal |
Azione8.676 |
|
34992 | 589824 | 404 | 2188742 | 1.71 V ~ 1.89 V | Surface Mount | 0°C ~ 85°C (TJ) | 560-LBGA, Metal | 560-MBGA (42.5x42.5) |
||
Xilinx Inc. |
IC FPGA 129 I/O 160HQFP
|
pacchetto: 160-BQFP Exposed Pad |
Azione3.120 |
|
3078 | 41472 | 129 | 36000 | 3 V ~ 3.6 V | Surface Mount | -40°C ~ 100°C (TJ) | 160-BQFP Exposed Pad | 160-PQFP (28x28) |
||
Xilinx Inc. |
IC FPGA 256 I/O 299CPGA
|
pacchetto: 299-BCPGA |
Azione3.568 |
|
2432 | 32768 | 256 | 25000 | 4.75 V ~ 5.25 V | Through Hole | 0°C ~ 85°C (TJ) | 299-BCPGA | 299-CPGA (52.3x52.3) |
||
Altera |
IC FPGA 564 I/O 1152HBGA
|
pacchetto: 1152-BBGA, FCBGA |
Azione6.224 |
|
531200 | 28033024 | 564 | - | 0.87 V ~ 0.93 V | Surface Mount | -40°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-HBGA, FC (42.5x42.5) |
||
Altera |
IC FPGA 744 I/O 1517FBGA
|
pacchetto: 1517-BBGA, FCBGA |
Azione2.688 |
|
291200 | 17661952 | 744 | - | 0.87 V ~ 0.93 V | Surface Mount | 0°C ~ 85°C (TJ) | 1517-BBGA, FCBGA | 1517-FBGA (40x40) |
||
Altera |
IC FPGA 372 I/O 780FBGA
|
pacchetto: 780-BBGA, FCBGA |
Azione4.400 |
|
228000 | 17544192 | 372 | - | 0.87 V ~ 0.93 V | Surface Mount | 0°C ~ 85°C (TJ) | 780-BBGA, FCBGA | 780-FBGA (29x29) |
||
Altera |
IC FPGA 360 I/O 780HBGA
|
pacchetto: 780-BBGA, FCBGA |
Azione2.464 |
|
340000 | 23704576 | 360 | - | 0.82 V ~ 0.88 V | Surface Mount | 0°C ~ 85°C (TJ) | 780-BBGA, FCBGA | 780-HBGA (33x33) |
||
Altera |
IC FPGA 600 I/O 1517FBGA
|
pacchetto: 1517-BBGA, FCBGA |
Azione5.904 |
|
622000 | 59939840 | 600 | - | 0.82 V ~ 0.88 V | Surface Mount | 0°C ~ 85°C (TJ) | 1517-BBGA, FCBGA | 1517-FBGA (40x40) |
||
Xilinx Inc. |
IC FPGA 840 I/O 1738FCBGA
|
pacchetto: 1738-BBGA, FCBGA |
Azione4.192 |
|
131072 | 10985472 | 840 | - | 0.95 V ~ 1.05 V | Surface Mount | 0°C ~ 85°C (TJ) | 1738-BBGA, FCBGA | 1738-FCBGA (42.5x42.5) |
||
Microsemi Corporation |
IC FPGA 388 I/O
|
pacchetto: - |
Azione2.176 |
|
300000 | 21094400 | 388 | - | 0.97 V ~ 1.08 V | - | -40°C ~ 100°C (TJ) | - | - |
||
Microsemi Corporation |
IC FPGA 387 I/O 676FBGA
|
pacchetto: 676-BGA |
Azione6.928 |
|
56520 | 1869824 | 387 | - | 1.14 V ~ 2.625 V | Surface Mount | -40°C ~ 100°C (TJ) | 676-BGA | 676-FBGA (27x27) |
||
Lattice Semiconductor Corporation |
IC FPGA 55 I/O 132CSBGA
|
pacchetto: 132-LFBGA, CSPBGA |
Azione9.036 |
|
256 | - | 55 | - | 1.14 V ~ 1.26 V | Surface Mount | 0°C ~ 85°C (TJ) | 132-LFBGA, CSPBGA | 132-CSPBGA (8x8) |
||
Intel |
IC FPGA 734 I/O 1508FBGA
|
pacchetto: 1508-BBGA, FCBGA |
Azione5.120 |
|
132540 | 6747840 | 734 | - | 1.15 V ~ 1.25 V | Surface Mount | 0°C ~ 85°C (TJ) | 1508-BBGA, FCBGA | 1508-FBGA (30x30) |
||
Intel |
IC FPGA 189 I/O 240RQFP
|
pacchetto: 240-BFQFP Exposed Pad |
Azione12.420 |
|
1728 | 12288 | 189 | 69000 | 4.75 V ~ 5.25 V | Surface Mount | 0°C ~ 70°C (TA) | 240-BFQFP Exposed Pad | 240-RQFP (32x32) |
||
Intel |
IC FPGA 920 I/O 1932FBGA
|
pacchetto: 1932-BBGA, FCBGA |
Azione3.888 |
|
531200 | 28033024 | 920 | - | 0.87 V ~ 0.93 V | Surface Mount | -40°C ~ 100°C (TJ) | 1932-BBGA, FCBGA | 1932-FBGA, FC (45x45) |
||
Intel |
IC FPGA 744 I/O 1517HBGA
|
pacchetto: 1517-BBGA, FCBGA |
Azione6.272 |
|
531200 | 28033024 | 744 | - | 0.87 V ~ 0.93 V | Surface Mount | -40°C ~ 100°C (TJ) | 1517-BBGA, FCBGA | 1517-HBGA (42.5x42.5) |
||
Intel |
IC FPGA 432 I/O 1152FBGA
|
pacchetto: 1152-BBGA, FCBGA |
Azione7.776 |
|
340000 | 23704576 | 432 | - | 0.87 V ~ 0.93 V | Surface Mount | 0°C ~ 85°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA (35x35) |
||
Intel |
IC FPGA 432 I/O 1517FBGA
|
pacchetto: 1517-BBGA, FCBGA |
Azione3.568 |
|
490000 | 48927744 | 432 | - | 0.82 V ~ 0.88 V | Surface Mount | -40°C ~ 100°C (TJ) | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) |
||
Intel |
IC FPGA 612 I/O 1152FBGA
|
pacchetto: 1152-BBGA, FCBGA |
Azione2.000 |
|
244188 | 12038144 | 612 | - | 0.87 V ~ 0.93 V | Surface Mount | 0°C ~ 85°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA (35x35) |
||
Intel |
IC FPGA 296 I/O 484FBGA
|
pacchetto: 484-BBGA, FCBGA |
Azione2.064 |
|
47500 | 2184192 | 296 | - | 0.86 V ~ 1.15 V | Surface Mount | 0°C ~ 85°C (TJ) | 484-BBGA, FCBGA | 484-FBGA (23x23) |
||
Intel |
IC FPGA 182 I/O 256UBGA
|
pacchetto: 256-LFBGA |
Azione6.880 |
|
5136 | 423936 | 182 | - | 1.15 V ~ 1.25 V | Surface Mount | 0°C ~ 85°C (TJ) | 256-LFBGA | 256-UBGA (14x14) |
||
Xilinx Inc. |
XCKU13P-L1FFVE900I
|
pacchetto: 900-BBGA, FCBGA |
Azione6.848 |
|
746550 | 70656000 | 304 | - | 0.698 V ~ 0.876 V | Surface Mount | -40°C ~ 100°C (TJ) | 900-BBGA, FCBGA | 900-FCBGA (31x31) |
||
Intel |
IC FPGA 552 I/O 1152FBGA
|
pacchetto: - |
Request a Quote |
|
622000 | 51200000 | 552 | - | 0.82V ~ 0.88V | Surface Mount | -40°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA (35x35) |
||
Intel |
IC FPGA 564 I/O 1152FBGA
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Intel |
IC FPGA 1160 I/O 2912BGA
|
pacchetto: - |
Request a Quote |
|
2800000 | - | 1160 | - | 0.77V ~ 0.97V | Surface Mount | -40°C ~ 100°C (TJ) | 2912-BBGA, FCBGA | 2912-FBGA, FC (55x55) |