Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Logic Elements/Cells | Total RAM Bits | Number of I/O | Number of Gates | Voltage - Supply | Mounting Type | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microsemi Corporation |
IC FPGA 49 I/O 68QFN
|
pacchetto: 68-VFQFN Exposed Pad |
Azione3.600 |
|
- | - | 49 | 15000 | 1.425 V ~ 1.575 V | Surface Mount | -40°C ~ 100°C (TJ) | 68-VFQFN Exposed Pad | 68-QFN (8x8) |
||
Microsemi Corporation |
IC FPGA 69 I/O 80VQFP
|
pacchetto: 80-TQFP |
Azione3.648 |
|
- | - | 69 | 2000 | 4.5 V ~ 5.5 V | Surface Mount | -40°C ~ 85°C (TA) | 80-TQFP | 80-VQFP (14x14) |
||
Lattice Semiconductor Corporation |
IC FPGA 160 I/O 256FBGA
|
pacchetto: 256-BGA |
Azione4.352 |
|
2704 | 113664 | 160 | 210000 | 2.3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 256-BGA | 256-FPBGA (17x17) |
||
Xilinx Inc. |
IC FPGA 158 I/O 240QFP
|
pacchetto: 240-BFQFP |
Azione6.416 |
|
1728 | 65536 | 158 | 71693 | 1.71 V ~ 1.89 V | Surface Mount | 0°C ~ 85°C (TJ) | 240-BFQFP | 240-PQFP (32x32) |
||
Microchip Technology |
IC FPGA 4NS 132QFP
|
pacchetto: 132-BQFP Bumpered |
Azione2.080 |
|
6400 | - | 108 | 30000 | 3.135 V ~ 3.465 V | Surface Mount | 0°C ~ 70°C | 132-BQFP Bumpered | 132-BQFP |
||
Altera |
IC FPGA 289 I/O 780HBGA
|
pacchetto: 780-BBGA, FCBGA |
Azione2.640 |
|
353600 | 23105536 | 289 | - | 0.87 V ~ 0.93 V | Surface Mount | 0°C ~ 85°C (TJ) | 780-BBGA, FCBGA | 780-HBGA (33x33) |
||
Altera |
IC FPGA 432 I/O 1152FBGA
|
pacchetto: 1152-BBGA, FCBGA |
Azione7.936 |
|
340000 | 23704576 | 432 | - | 0.82 V ~ 0.88 V | Surface Mount | -40°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA (35x35) |
||
Altera |
IC FPGA 704 I/O 1517FBGA
|
pacchetto: 1517-BBGA, FCBGA |
Azione7.728 |
|
420000 | 23625728 | 704 | - | 1.07 V ~ 1.13 V | Surface Mount | 0°C ~ 85°C (TJ) | 1517-BBGA, FCBGA | 1517-FBGA (40x40) |
||
Altera |
IC FPGA 240 I/O 484FBGA
|
pacchetto: 484-BGA |
Azione5.824 |
|
149500 | 7880704 | 240 | - | 1.07 V ~ 1.13 V | Surface Mount | 0°C ~ 85°C (TJ) | 484-BGA | 484-FBGA (23x23) |
||
Lattice Semiconductor Corporation |
IC FPGA 436 I/O 1152FBGA
|
pacchetto: 1152-BBGA, FCBGA |
Azione5.072 |
|
67000 | 4642816 | 436 | - | 1.14 V ~ 1.26 V | Surface Mount | -40°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) |
||
Xilinx Inc. |
IC FPGA 576 I/O 900FBGA
|
pacchetto: 900-BBGA |
Azione6.384 |
|
147443 | 4939776 | 576 | - | 1.14 V ~ 1.26 V | Surface Mount | -40°C ~ 100°C (TJ) | 900-BBGA | 900-FBGA (31x31) |
||
Microsemi Corporation |
IC FPGA 140 I/O 208QFP
|
pacchetto: 208-BFQFP |
Azione2.560 |
|
- | - | 140 | 24000 | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | Surface Mount | -40°C ~ 85°C (TA) | 208-BFQFP | 208-PQFP (28x28) |
||
Microsemi Corporation |
IC FPGA 200 I/O 325FCBGA
|
pacchetto: 325-TFBGA |
Azione2.448 |
|
56520 | 1869824 | 200 | - | 1.14 V ~ 2.625 V | Surface Mount | -40°C ~ 100°C (TJ) | 325-TFBGA | 325-BGA (11x11) |
||
Microsemi Corporation |
IC FPGA 200 I/O 325FCBGA
|
pacchetto: 325-TFBGA |
Azione4.896 |
|
56340 | 1869824 | 200 | - | 1.14 V ~ 2.625 V | Surface Mount | -40°C ~ 100°C (TJ) | 325-TFBGA | 325-BGA (11x11) |
||
Microsemi Corporation |
IC FPGA 41 I/O 64TQFP
|
pacchetto: 64-LQFP |
Azione6.096 |
|
128 | - | 41 | 3000 | 2.3 V ~ 2.7 V | Surface Mount | -40°C ~ 125°C (TA) | 64-LQFP | 64-TQFP (10x10) |
||
Lattice Semiconductor Corporation |
IC FPGA 140 I/O 256FBGA
|
pacchetto: 256-BGA |
Azione3.312 |
|
19000 | 1246208 | 140 | - | 1.14 V ~ 1.26 V | Surface Mount | 0°C ~ 85°C (TJ) | 256-BGA | 256-FPBGA (17x17) |
||
Altera |
IC FPGA 199 I/O 240QFP
|
pacchetto: 240-BQFP |
Azione10.164 |
|
1320 | - | 199 | 16000 | 4.75 V ~ 5.25 V | Surface Mount | 0°C ~ 85°C (TJ) | 240-BQFP | 240-PQFP (32x32) |
||
Intel |
IC FPGA 174 I/O 240RQFP
|
pacchetto: 240-BFQFP Exposed Pad |
Azione7.392 |
|
8320 | 106496 | 174 | 526000 | 2.375 V ~ 2.625 V | Surface Mount | 0°C ~ 85°C (TJ) | 240-BFQFP Exposed Pad | 240-RQFP (32x32) |
||
Intel |
IC FPGA 1022 I/O 1508FBGA
|
pacchetto: 1508-BBGA, FCBGA |
Azione3.296 |
|
57120 | 5215104 | 1022 | - | 1.425 V ~ 1.575 V | Surface Mount | 0°C ~ 85°C (TJ) | 1508-BBGA, FCBGA | 1508-FBGA (30x30) |
||
Intel |
IC FPGA 120 I/O 208QFP
|
pacchetto: 208-BFQFP |
Azione7.408 |
|
576 | 12288 | 120 | 56000 | 2.375 V ~ 2.625 V | Surface Mount | 0°C ~ 70°C (TA) | 208-BFQFP | 208-PQFP (28x28) |
||
Intel |
IC FPGA 564 I/O 1152FBGA
|
pacchetto: 1152-BBGA, FCBGA |
Azione3.264 |
|
353600 | 23105536 | 564 | - | 0.87 V ~ 0.93 V | Surface Mount | 0°C ~ 85°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA (35x35) |
||
Intel |
IC FPGA 696 I/O 1517FBGA
|
pacchetto: 1517-BBGA, FCBGA |
Azione6.368 |
|
420000 | 43983872 | 696 | - | 0.82 V ~ 0.88 V | Surface Mount | -40°C ~ 100°C (TJ) | 1517-BBGA, FCBGA | 1517-FBGA (40x40) |
||
Intel |
IC FPGA 544 I/O 1152FBGA
|
pacchetto: 1152-BBGA, FCBGA Exposed Pad |
Azione7.200 |
|
300000 | 17358848 | 544 | - | 1.07 V ~ 1.13 V | Surface Mount | 0°C ~ 85°C (TJ) | 1152-BBGA, FCBGA Exposed Pad | 1152-FBGA (35x35) |
||
Intel |
IC FPGA 560 I/O 1152FBGA
|
pacchetto: 1152-BGA |
Azione5.712 |
|
301000 | 14251008 | 560 | - | 1.07 V ~ 1.13 V | Surface Mount | -40°C ~ 100°C (TJ) | 1152-BGA | 1152-FBGA (35x35) |
||
Xilinx Inc. |
FF1148 DAISY SAMPLE
|
pacchetto: - |
Azione6.576 |
|
- | - | - | - | - | - | - | - | - |
||
Intel |
IC FPGA 336 I/O 672FBGA
|
pacchetto: 672-BBGA, FCBGA |
Azione5.296 |
|
242000 | 15470592 | 336 | - | 1.07V ~ 1.13V | Surface Mount | 0°C ~ 85°C (TJ) | 672-BBGA, FCBGA | 672-FBGA (27x27) |
||
Intel |
IC FPGA 600 I/O 1152FBGA
|
pacchetto: - |
Request a Quote |
|
340000 | 19456000 | 600 | - | 0.87V ~ 0.93V | Surface Mount | 0°C ~ 85°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA (35x35) |
||
Intel |
IC FPGA 342 I/O 780HBGA
|
pacchetto: - |
Request a Quote |
|
220000 | 15282176 | 342 | - | 0.82V ~ 0.88V | Surface Mount | 0°C ~ 85°C (TJ) | 780-BBGA, FCBGA | 780-HBGA (33x33) |