Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Logic Elements/Cells | Total RAM Bits | Number of I/O | Number of Gates | Voltage - Supply | Mounting Type | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Xilinx Inc. |
IC SPARTAN-3E FPGA 700K DIE
|
pacchetto: Die |
Azione2.688 |
|
- | - | - | - | - | Surface Mount | - | Die | Die |
||
Lattice Semiconductor Corporation |
IC FPGA 92 I/O 121CSBGA
|
pacchetto: 121-VFBGA, CSBGA |
Azione5.744 |
|
1280 | 65536 | 92 | - | 1.14 V ~ 1.26 V | Surface Mount | 0°C ~ 70°C (TA) | 121-VFBGA, CSBGA | 121-CSBGA (6x6) |
||
Microsemi Corporation |
IC FPGA 154 I/O 208QFP
|
pacchetto: 208-BFQFP |
Azione2.496 |
|
- | 110592 | 154 | 600000 | 1.14V ~ 1.575 V | Surface Mount | -40°C ~ 100°C (TJ) | 208-BFQFP | 208-PQFP (28x28) |
||
Lattice Semiconductor Corporation |
IC FPGA 297 I/O 484FBGA
|
pacchetto: 484-BBGA |
Azione3.824 |
|
12000 | 226304 | 297 | - | 1.14 V ~ 1.26 V | Surface Mount | 0°C ~ 85°C (TJ) | 484-BBGA | 484-FPBGA (23x23) |
||
Xilinx Inc. |
IC FPGA 180 I/O 256BGA
|
pacchetto: 256-BBGA |
Azione5.024 |
|
5292 | 57344 | 180 | 236666 | 2.375 V ~ 2.625 V | Surface Mount | -40°C ~ 100°C (TJ) | 256-BBGA | 256-PBGA (27x27) |
||
Xilinx Inc. |
IC FPGA 256 I/O 299CPGA
|
pacchetto: 299-BCPGA |
Azione4.176 |
|
2432 | 32768 | 256 | 25000 | 4.75 V ~ 5.25 V | Through Hole | 0°C ~ 85°C (TJ) | 299-BCPGA | 299-CPGA (52.3x52.3) |
||
Microchip Technology |
IC FPGA 10K GATES 208QFP
|
pacchetto: 208-BFQFP |
Azione4.688 |
|
576 | 4608 | 161 | 20000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 70°C | 208-BFQFP | 208-PQFP (28x28) |
||
Altera |
IC FPGA 840 I/O 1932FBGA
|
pacchetto: 1932-BBGA, FCBGA |
Azione5.696 |
|
952000 | 65561600 | 840 | - | 0.82 V ~ 0.88 V | Surface Mount | 0°C ~ 85°C (TJ) | 1932-BBGA, FCBGA | 1932-FBGA (45x45) |
||
Altera |
IC FPGA 976 I/O 1517HBGA
|
pacchetto: 1517-BBGA, FCBGA |
Azione4.800 |
|
531200 | 28033024 | 976 | - | 0.87 V ~ 0.93 V | Surface Mount | 0°C ~ 85°C (TJ) | 1517-BBGA, FCBGA | 1517-HBGA (42.5x42.5) |
||
Xilinx Inc. |
IC FPGA 832 I/O 2104FCBGA
|
pacchetto: 2104-BBGA, FCBGA |
Azione5.152 |
|
1451100 | 77721600 | 832 | - | 0.970 V ~ 1.030 V | Surface Mount | 0°C ~ 100°C (TJ) | 2104-BBGA, FCBGA | 2104-FCBGA (47.5x47.5) |
||
Microsemi Corporation |
IC FPGA 317 I/O 484FBGA
|
pacchetto: 484-BGA |
Azione6.784 |
|
- | 165888 | 317 | 1000000 | 1.425 V ~ 1.575 V | Surface Mount | -40°C ~ 85°C (TA) | 484-BGA | 484-FPBGA (23x23) |
||
Microsemi Corporation |
IC FPGA 336 I/O 676FBGA
|
pacchetto: 676-BGA |
Azione2.128 |
|
- | 73728 | 336 | 500000 | 1.425 V ~ 1.575 V | Surface Mount | -40°C ~ 85°C (TA) | 676-BGA | 676-FBGA (27x27) |
||
Microsemi Corporation |
IC FPGA 175 I/O 208QFP
|
pacchetto: 208-BFQFP |
Azione6.640 |
|
- | - | 175 | 24000 | 2.25 V ~ 5.25 V | Surface Mount | -55°C ~ 125°C (TC) | 208-BFQFP | 208-PQFP (28x28) |
||
Xilinx Inc. |
IC FPGA 285 I/O 484FCBGA
|
pacchetto: 484-BBGA |
Azione3.264 |
|
101440 | 4976640 | 285 | - | 0.95 V ~ 1.05 V | Surface Mount | -40°C ~ 100°C (TJ) | 484-BBGA | 484-FBGA (23x23) |
||
Microsemi Corporation |
IC FPGA 34 I/O 44PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione4.992 |
|
- | - | 34 | 6000 | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | Surface Mount | -40°C ~ 85°C (TA) | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Microsemi Corporation |
IC FPGA 200 I/O 325FCBGA
|
pacchetto: 325-TFBGA |
Azione3.856 |
|
56340 | 1869824 | 200 | - | 1.14 V ~ 2.625 V | Surface Mount | -40°C ~ 100°C (TJ) | 325-TFBGA | 325-BGA (11x11) |
||
Microsemi Corporation |
IC FPGA 113 I/O 144TQFP
|
pacchetto: 144-LQFP |
Azione2.000 |
|
- | - | 113 | 24000 | 2.25 V ~ 5.25 V | Surface Mount | -40°C ~ 125°C (TA) | 144-LQFP | 144-TQFP (20x20) |
||
Xilinx Inc. |
IC FPGA 161 I/O 256FTBGA
|
pacchetto: 256-LBGA |
Azione5.696 |
|
13248 | 368640 | 161 | 700000 | 1.14 V ~ 1.26 V | Surface Mount | -40°C ~ 100°C (TJ) | 256-LBGA | 256-FTBGA (17x17) |
||
Xilinx Inc. |
IC FPGA 132 I/O 225CSBGA
|
pacchetto: 225-LFBGA, CSPBGA |
Azione7.280 |
|
3840 | 221184 | 132 | - | 1.14 V ~ 1.26 V | Surface Mount | 0°C ~ 85°C (TJ) | 225-LFBGA, CSPBGA | 225-CSPBGA (13x13) |
||
Lattice Semiconductor Corporation |
IC FPGA 279 I/O 324CABGA
|
pacchetto: 324-LFBGA |
Azione7.712 |
|
6864 | 245760 | 279 | - | 2.375 V ~ 3.465 V | Surface Mount | -40°C ~ 100°C (TJ) | 324-LFBGA | 324-CABGA (15x15) |
||
Intel |
IC FPGA 191 I/O 256FBGA
|
pacchetto: 256-BGA |
Azione4.512 |
|
1728 | 12288 | 191 | 69000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 70°C (TA) | 256-BGA | 256-FBGA (17x17) |
||
Intel |
IC FPGA 508 I/O 672FBGA
|
pacchetto: 672-BBGA, FCBGA |
Azione5.936 |
|
24320 | 311296 | 508 | 1537000 | 1.71 V ~ 1.89 V | Surface Mount | 0°C ~ 85°C (TJ) | 672-BBGA, FCBGA | 672-FBGA (27x27) |
||
Intel |
IC FPGA 283 I/O 484FBGA
|
pacchetto: 484-BGA |
Azione5.296 |
|
119088 | 3981312 | 283 | - | 1.15 V ~ 1.25 V | Surface Mount | 0°C ~ 85°C (TJ) | 484-BGA | 484-FBGA (23x23) |
||
Intel |
IC FPGA 328 I/O 484FBGA
|
pacchetto: 484-BGA |
Azione2.624 |
|
39600 | 1161216 | 328 | - | 1.15 V ~ 1.25 V | Surface Mount | 0°C ~ 85°C (TJ) | 484-BGA | 484-FBGA (23x23) |
||
Lattice Semiconductor Corporation |
FPGA, 144 CLBS, 36000 GATES
|
pacchetto: - |
Request a Quote |
|
1152 | 18432 | 114 | 36000 | 3V ~ 3.6V | Surface Mount | 0°C ~ 70°C (TA) | 144-LQFP | 144-TQFP (20x20) |
||
Intel |
IC FPGA 552 I/O 1152FBGA
|
pacchetto: - |
Request a Quote |
|
622000 | 51200000 | 552 | - | 0.82V ~ 0.88V | Surface Mount | -40°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA (35x35) |
||
Intel |
IC FPGA 704 I/O 2397BGA
|
pacchetto: - |
Request a Quote |
|
2800000 | - | 704 | - | 0.77V ~ 0.97V | Surface Mount | -40°C ~ 100°C (TJ) | 2397-BBGA, FCBGA | 2397-FBGA, FC (50x50) |
||
Intel |
IC FPGA 552 I/O 1152FBGA
|
pacchetto: - |
Request a Quote |
|
490000 | 46080000 | 552 | - | 0.87V ~ 0.93V | Surface Mount | 0°C ~ 85°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA (35x35) |