Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Logic Elements/Cells | Total RAM Bits | Number of I/O | Number of Gates | Voltage - Supply | Mounting Type | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Altera |
IC FPGA 360 I/O 484FBGA
|
pacchetto: 484-BGA |
Azione5.936 |
|
50000 | 1677312 | 360 | - | 1.15 V ~ 1.25 V | Surface Mount | -40°C ~ 100°C (TJ) | 484-BGA | 484-FBGA (23x23) |
||
Altera |
IC FPGA
|
pacchetto: 400-BGA |
Azione6.368 |
|
6400 | 81920 | - | 404000 | 1.71 V ~ 1.89 V | Surface Mount | 0°C ~ 85°C (TJ) | 400-BGA | 400-BGA |
||
Altera |
IC FPGA
|
pacchetto: 144-LQFP |
Azione2.624 |
|
4160 | 53248 | 93 | 263000 | 2.375 V ~ 2.625 V | Surface Mount | 0°C ~ 85°C (TJ) | 144-LQFP | 144-TQFP (20x20) |
||
Altera |
IC FPGA 274 I/O 356BGA
|
pacchetto: 356-LBGA |
Azione5.088 |
|
4992 | 24576 | 274 | 158000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 70°C (TA) | 356-LBGA | 356-BGA (35x35) |
||
Altera |
IC FPGA 147 I/O 208QFP
|
pacchetto: 208-BQFP |
Azione30.720 |
|
1728 | 24576 | 147 | 119000 | 2.375 V ~ 2.625 V | Surface Mount | 0°C ~ 70°C (TA) | 208-BQFP | 208-QFP (28x28) |
||
Microsemi Corporation |
IC FPGA 300 I/O 484FBGA
|
pacchetto: 484-BGA |
Azione3.056 |
|
24576 | 147456 | 300 | 1000000 | 1.425 V ~ 1.575 V | Surface Mount | 0°C ~ 70°C (TA) | 484-BGA | 484-FPBGA (23x23) |
||
Microsemi Corporation |
IC FPGA 69 I/O 84PLCC
|
pacchetto: 84-LCC (J-Lead) |
Azione3.456 |
|
- | - | 69 | 2000 | 2.7 V ~ 3.6 V | Surface Mount | 0°C ~ 70°C (TA) | 84-LCC (J-Lead) | 84-PLCC (29.31x29.31) |
||
Lattice Semiconductor Corporation |
IC FPGA 101 I/O 132CSBGA
|
pacchetto: 132-LFBGA, CSPBGA |
Azione2.016 |
|
640 | - | 101 | - | 1.14 V ~ 1.26 V | Surface Mount | 0°C ~ 85°C (TJ) | 132-LFBGA, CSPBGA | 132-CSPBGA (8x8) |
||
Altera |
IC FPGA 920 I/O 1932FBGA
|
pacchetto: 1932-BBGA, FCBGA |
Azione15.528 |
|
353600 | 23105536 | 920 | - | 0.87 V ~ 0.93 V | Surface Mount | -40°C ~ 100°C (TJ) | 1932-BBGA, FCBGA | 1932-FBGA (45x45) |
||
Altera |
IC FPGA 432 I/O 1152FBGA
|
pacchetto: 1152-BBGA, FCBGA |
Azione3.040 |
|
236000 | 16937984 | 432 | - | 0.82 V ~ 0.88 V | Surface Mount | 0°C ~ 85°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA (35x35) |
||
Lattice Semiconductor Corporation |
IC FPGA 583 I/O 900FBGA
|
pacchetto: 900-BBGA |
Azione3.440 |
|
68000 | 1056768 | 583 | - | 1.14 V ~ 1.26 V | Surface Mount | -40°C ~ 100°C (TJ) | 900-BBGA | 900-FPBGA (31x31) |
||
Microsemi Corporation |
IC FPGA 203 I/O 256FBGA
|
pacchetto: 256-LBGA |
Azione4.592 |
|
- | - | 203 | 48000 | 2.25 V ~ 5.25 V | Surface Mount | -40°C ~ 125°C (TA) | 256-LBGA | 256-FPBGA (17x17) |
||
Microsemi Corporation |
IC FPGA 81 I/O 100TQFP
|
pacchetto: 100-LQFP |
Azione7.200 |
|
- | - | 81 | 12000 | 2.25 V ~ 5.25 V | Surface Mount | -40°C ~ 85°C (TA) | 100-LQFP | 100-TQFP (14x14) |
||
Lattice Semiconductor Corporation |
IC FPGA 101 I/O 132CSBGA
|
pacchetto: 132-LFBGA, CSPBGA |
Azione3.872 |
|
1200 | 9421 | 101 | - | 1.14 V ~ 1.26 V | Surface Mount | -40°C ~ 100°C (TJ) | 132-LFBGA, CSPBGA | 132-CSPBGA (8x8) |
||
Lattice Semiconductor Corporation |
IC FPGA 206 I/O 256CABGA
|
pacchetto: 256-LFBGA |
Azione3.696 |
|
4320 | 94208 | 206 | - | 2.375 V ~ 3.465 V | Surface Mount | 0°C ~ 85°C (TJ) | 256-LFBGA | 256-CABGA (14x14) |
||
Microsemi Corporation |
IC FPGA 71 I/O 100VQFP
|
pacchetto: 100-TQFP |
Azione6.976 |
|
3072 | 36864 | 71 | 125000 | 1.425 V ~ 1.575 V | Surface Mount | -40°C ~ 85°C (TA) | 100-TQFP | 100-VQFP (14x14) |
||
Intel |
IC FPGA 432 I/O 1152FBGA
|
pacchetto: 1152-BBGA, FCBGA |
Azione2.640 |
|
340000 | 23704576 | 432 | - | 0.82 V ~ 0.88 V | Surface Mount | 0°C ~ 85°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA (35x35) |
||
Intel |
IC FPGA 360 I/O 780FBGA
|
pacchetto: 780-BBGA, FCBGA |
Azione3.312 |
|
320000 | 21040128 | 360 | - | 0.87 V ~ 0.98 V | Surface Mount | -40°C ~ 100°C (TJ) | 780-BBGA, FCBGA | 780-FBGA (29x29) |
||
Intel |
IC FPGA 488 I/O 780FBGA
|
pacchetto: 780-BBGA, FCBGA |
Azione3.264 |
|
67500 | 2699264 | 488 | - | 0.86 V ~ 1.15 V | Surface Mount | 0°C ~ 85°C (TJ) | 780-BBGA, FCBGA | 780-FBGA (29x29) |
||
Intel |
IC FPGA 94 I/O 144EQFP
|
pacchetto: 144-LQFP Exposed Pad |
Azione2.096 |
|
10320 | 423936 | 94 | - | 1.15 V ~ 1.25 V | Surface Mount | -40°C ~ 125°C (TJ) | 144-LQFP Exposed Pad | 144-EQFP (20x20) |
||
Intel |
IC FPGA 564 I/O 1152HBGA
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Intel |
IC FPGA 840 I/O 1932FBGA
|
pacchetto: - |
Request a Quote |
|
490000 | 46080000 | 840 | - | 0.87V ~ 0.93V | Surface Mount | 0°C ~ 85°C (TJ) | 1932-BBGA, FCBGA | 1932-FBGA, FC (45x45) |
||
Efinix, Inc. |
IC FPGA TRION T55 256 IO 484FBGA
|
pacchetto: - |
Azione1.572 |
|
54195 | 2831360 | 256 | - | 1.15V ~ 1.25V | Surface Mount | -40°C ~ 100°C (TJ) | 484-LFBGA | 484-FBGA (18x18) |
||
Intel |
IC FPGA 654 I/O 1517HBGA
|
pacchetto: - |
Request a Quote |
|
531200 | 28033024 | 654 | - | 0.92V ~ 0.98V | Surface Mount | -40°C ~ 100°C (TJ) | 1517-BBGA, FCBGA | 1517-HBGA (42.5x42.5) |
||
Intel |
IC FPGA 696 I/O 1517FBGA
|
pacchetto: - |
Request a Quote |
|
490000 | 46080000 | 696 | - | 0.82V ~ 0.88V | Surface Mount | -40°C ~ 100°C (TJ) | 1517-BBGA, FCBGA | 1517-FBGA (40x40) |
||
Microchip Technology |
A42MX16-WAFERLOT
|
pacchetto: - |
Request a Quote |
|
608 | - | - | 24000 | 3V ~ 3.6V, 4.5V ~ 5.25V, 4.75V ~ 5.5V | Surface Mount | -55°C ~ 125°C (TC) | Die | Wafer |
||
AMD |
FPGA, 324 CLBS, 10000 GATES
|
pacchetto: - |
Request a Quote |
|
1936 | - | 197 | 23000 | 4.5V ~ 5.5V | Surface Mount | -40°C ~ 100°C (TJ) | 240-BFQFP Exposed Pad | 240-PQFP (32x32) |
||
Microchip Technology |
RT4G150-1CGG1657R
|
pacchetto: - |
Request a Quote |
|
151824 | 5325 | - | - | 1.14V ~ 1.26V | Surface Mount | -55°C ~ 125°C (TJ) | 1657-BFCCGA | 1657-CCGA (42.5x42.5) |