Pagina 1136 - Embedded - FPGA (Field Programmable Gate Array) | Circuiti integrati (CI) | Heisener Electronics
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Embedded - FPGA (Field Programmable Gate Array)

Record 33.582
Pagina  1.136/1.200
Immagine
Numero di parte
Produttore
Descrizione
pacchetto
Azione
Quantità
Number of Logic Elements/Cells
Total RAM Bits
Number of I/O
Number of Gates
Voltage - Supply
Mounting Type
Operating Temperature
Package / Case
Supplier Device Package
AX125-2FGG324
Microsemi Corporation

IC FPGA 168 I/O 324FBGA

  • Number of LABs/CLBs: 2016
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 18432
  • Number of I/O: 168
  • Number of Gates: 125000
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Package / Case: 324-BGA
  • Supplier Device Package: 324-FBGA (19x19)
pacchetto: 324-BGA
Azione7.504
-
18432
168
125000
1.425 V ~ 1.575 V
Surface Mount
0°C ~ 70°C (TA)
324-BGA
324-FBGA (19x19)
A1240A-1PG132B
Microsemi Corporation

IC FPGA 104 I/O 132CPGA

  • Number of LABs/CLBs: 684
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: -
  • Number of I/O: 104
  • Number of Gates: 4000
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Mounting Type: Through Hole
  • Operating Temperature: -55°C ~ 125°C (TJ)
  • Package / Case: 132-BCPGA
  • Supplier Device Package: 132-CPGA (34.54x34.54)
pacchetto: 132-BCPGA
Azione2.448
-
-
104
4000
4.5 V ~ 5.5 V
Through Hole
-55°C ~ 125°C (TJ)
132-BCPGA
132-CPGA (34.54x34.54)
hot XCS30XL-4BG256C
Xilinx Inc.

IC FPGA 192 I/O 256BGA

  • Number of LABs/CLBs: 576
  • Number of Logic Elements/Cells: 1368
  • Total RAM Bits: 18432
  • Number of I/O: 192
  • Number of Gates: 30000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-BBGA
  • Supplier Device Package: 256-PBGA (27x27)
pacchetto: 256-BBGA
Azione16.608
1368
18432
192
30000
3 V ~ 3.6 V
Surface Mount
0°C ~ 85°C (TJ)
256-BBGA
256-PBGA (27x27)
XC4044XL-1HQ304C
Xilinx Inc.

IC FPGA 256 I/O 304HQFP

  • Number of LABs/CLBs: 1600
  • Number of Logic Elements/Cells: 3800
  • Total RAM Bits: 51200
  • Number of I/O: 256
  • Number of Gates: 44000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 304-BFQFP Exposed Pad
  • Supplier Device Package: 304-PQFP (40x40)
pacchetto: 304-BFQFP Exposed Pad
Azione7.296
3800
51200
256
44000
3 V ~ 3.6 V
Surface Mount
0°C ~ 85°C (TJ)
304-BFQFP Exposed Pad
304-PQFP (40x40)
AT6005-4JC
Microchip Technology

IC FPGA 64 I/O 84PLCC

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: 3136
  • Total RAM Bits: -
  • Number of I/O: 64
  • Number of Gates: 15000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 70°C (TC)
  • Package / Case: 84-LCC (J-Lead)
  • Supplier Device Package: 84-PLCC (29.31x29.31)
pacchetto: 84-LCC (J-Lead)
Azione3.552
3136
-
64
15000
4.75 V ~ 5.25 V
Surface Mount
0°C ~ 70°C (TC)
84-LCC (J-Lead)
84-PLCC (29.31x29.31)
10M02SCU169A7G
Altera

IC FPGA 130 I/O 169UBGA

  • Number of LABs/CLBs: 125
  • Number of Logic Elements/Cells: 2000
  • Total RAM Bits: 110592
  • Number of I/O: 130
  • Number of Gates: -
  • Voltage - Supply: 2.85 V ~ 3.465 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Package / Case: 169-LFBGA
  • Supplier Device Package: 169-UBGA (11x11)
pacchetto: 169-LFBGA
Azione4.960
2000
110592
130
-
2.85 V ~ 3.465 V
Surface Mount
-40°C ~ 125°C (TJ)
169-LFBGA
169-UBGA (11x11)
hot XC6VLX75T-1FFG784C
Xilinx Inc.

IC FPGA 360 I/O 784FCBGA

  • Number of LABs/CLBs: 5820
  • Number of Logic Elements/Cells: 74496
  • Total RAM Bits: 5750784
  • Number of I/O: 360
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (29x29)
pacchetto: 784-BBGA, FCBGA
Azione53.640
74496
5750784
360
-
0.95 V ~ 1.05 V
Surface Mount
0°C ~ 85°C (TJ)
784-BBGA, FCBGA
784-FCBGA (29x29)
hot XC5VLX20T-2FFG323C
Xilinx Inc.

IC FPGA 172 I/O 323FCBGA

  • Number of LABs/CLBs: 1560
  • Number of Logic Elements/Cells: 19968
  • Total RAM Bits: 958464
  • Number of I/O: 172
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 323-BBGA, FCBGA
  • Supplier Device Package: 323-FCBGA (19x19)
pacchetto: 323-BBGA, FCBGA
Azione9.732
19968
958464
172
-
0.95 V ~ 1.05 V
Surface Mount
0°C ~ 85°C (TJ)
323-BBGA, FCBGA
323-FCBGA (19x19)
A40MX04-1PQG100M
Microsemi Corporation

IC FPGA 69 I/O 100QFP

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: -
  • Number of I/O: 69
  • Number of Gates: 6000
  • Voltage - Supply: 3 V ~ 3.6 V, 4.5 V ~ 5.5 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -55°C ~ 125°C (TC)
  • Package / Case: 100-BQFP
  • Supplier Device Package: 100-PQFP (14x20)
pacchetto: 100-BQFP
Azione6.512
-
-
69
6000
3 V ~ 3.6 V, 4.5 V ~ 5.5 V
Surface Mount
-55°C ~ 125°C (TC)
100-BQFP
100-PQFP (14x20)
LFXP2-40E-6FN484C
Lattice Semiconductor Corporation

IC FPGA 363 I/O 484FBGA

  • Number of LABs/CLBs: 5000
  • Number of Logic Elements/Cells: 40000
  • Total RAM Bits: 906240
  • Number of I/O: 363
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FPBGA (23x23)
pacchetto: 484-BBGA
Azione5.760
40000
906240
363
-
1.14 V ~ 1.26 V
Surface Mount
0°C ~ 85°C (TJ)
484-BBGA
484-FPBGA (23x23)
M2GL025-1FG484
Microsemi Corporation

IC FPGA 267 I/O 484FBGA

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: 27696
  • Total RAM Bits: 1130496
  • Number of I/O: 267
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FPBGA (23x23)
pacchetto: 484-BGA
Azione5.152
27696
1130496
267
-
1.14 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
484-BGA
484-FPBGA (23x23)
M1A3P600-1FG484
Microsemi Corporation

IC FPGA 235 I/O 484FBGA

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 110592
  • Number of I/O: 235
  • Number of Gates: 600000
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FPBGA (23x23)
pacchetto: 484-BGA
Azione2.160
-
110592
235
600000
1.425 V ~ 1.575 V
Surface Mount
0°C ~ 85°C (TJ)
484-BGA
484-FPBGA (23x23)
hot XC2S100-5TQ144I
Xilinx Inc.

IC FPGA 92 I/O 144TQFP

  • Number of LABs/CLBs: 600
  • Number of Logic Elements/Cells: 2700
  • Total RAM Bits: 40960
  • Number of I/O: 92
  • Number of Gates: 100000
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
pacchetto: 144-LQFP
Azione10.944
2700
40960
92
100000
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
144-LQFP
144-TQFP (20x20)
EPF10K50VFC484-3
Intel

IC FPGA 291 I/O 484FBGA

  • Number of LABs/CLBs: 360
  • Number of Logic Elements/Cells: 2880
  • Total RAM Bits: 20480
  • Number of I/O: 291
  • Number of Gates: 116000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
pacchetto: 484-BBGA
Azione7.312
2880
20480
291
116000
3 V ~ 3.6 V
Surface Mount
0°C ~ 70°C (TA)
484-BBGA
484-FBGA (23x23)
EPF10K50SQC240-2
Intel

IC FPGA 189 I/O 240QFP

  • Number of LABs/CLBs: 360
  • Number of Logic Elements/Cells: 2880
  • Total RAM Bits: 40960
  • Number of I/O: 189
  • Number of Gates: 199000
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-PQFP (32x32)
pacchetto: 240-BFQFP
Azione5.088
2880
40960
189
199000
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 70°C (TA)
240-BFQFP
240-PQFP (32x32)
hot EP1C6F256C8N
Intel

IC FPGA 185 I/O 256FBGA

  • Number of LABs/CLBs: 598
  • Number of Logic Elements/Cells: 5980
  • Total RAM Bits: 92160
  • Number of I/O: 185
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
pacchetto: 256-BGA
Azione10.320
5980
92160
185
-
1.425 V ~ 1.575 V
Surface Mount
0°C ~ 85°C (TJ)
256-BGA
256-FBGA (17x17)
5SGSMD8K1F40I2N
Intel

IC FPGA 696 I/O 1517FBGA

  • Number of LABs/CLBs: 262400
  • Number of Logic Elements/Cells: 695000
  • Total RAM Bits: 60968960
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
pacchetto: 1517-BBGA, FCBGA
Azione2.880
695000
60968960
696
-
0.87 V ~ 0.93 V
Surface Mount
-40°C ~ 100°C (TJ)
1517-BBGA, FCBGA
1517-FBGA (40x40)
5SGXMA7N2F45C2N
Intel

IC FPGA 840 I/O 1932FBGA

  • Number of LABs/CLBs: 234720
  • Number of Logic Elements/Cells: 622000
  • Total RAM Bits: 59939840
  • Number of I/O: 840
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
pacchetto: 1932-BBGA, FCBGA
Azione2.768
622000
59939840
840
-
0.87 V ~ 0.93 V
Surface Mount
0°C ~ 85°C (TJ)
1932-BBGA, FCBGA
1932-FBGA, FC (45x45)
5SGXEA3K2F40C2N
Intel

IC FPGA 696 I/O 1517FBGA

  • Number of LABs/CLBs: 128300
  • Number of Logic Elements/Cells: 340000
  • Total RAM Bits: 23704576
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
pacchetto: 1517-BBGA, FCBGA
Azione2.624
340000
23704576
696
-
0.87 V ~ 0.93 V
Surface Mount
0°C ~ 85°C (TJ)
1517-BBGA, FCBGA
1517-FBGA (40x40)
hot EP3SE50F780I3N
Intel

IC FPGA 488 I/O 780FBGA

  • Number of LABs/CLBs: 1900
  • Number of Logic Elements/Cells: 47500
  • Total RAM Bits: 5760000
  • Number of I/O: 488
  • Number of Gates: -
  • Voltage - Supply: 0.86 V ~ 1.15 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-FBGA (29x29)
pacchetto: 780-BBGA, FCBGA
Azione11.688
47500
5760000
488
-
0.86 V ~ 1.15 V
Surface Mount
-40°C ~ 100°C (TJ)
780-BBGA, FCBGA
780-FBGA (29x29)
hot EP3C40F324C6N
Intel

IC FPGA 195 I/O 324FBGA

  • Number of LABs/CLBs: 2475
  • Number of Logic Elements/Cells: 39600
  • Total RAM Bits: 1161216
  • Number of I/O: 195
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 324-BGA
  • Supplier Device Package: 324-FBGA (19x19)
pacchetto: 324-BGA
Azione12.648
39600
1161216
195
-
1.15 V ~ 1.25 V
Surface Mount
0°C ~ 85°C (TJ)
324-BGA
324-FBGA (19x19)
5CGXBC3B6U19C7N
Intel

IC FPGA 208 I/O 484UBGA

  • Number of LABs/CLBs: 11900
  • Number of Logic Elements/Cells: 31500
  • Total RAM Bits: 1381376
  • Number of I/O: 208
  • Number of Gates: -
  • Voltage - Supply: 1.07 V ~ 1.13 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-FBGA
  • Supplier Device Package: 484-UBGA (19x19)
pacchetto: 484-FBGA
Azione7.376
31500
1381376
208
-
1.07 V ~ 1.13 V
Surface Mount
0°C ~ 85°C (TJ)
484-FBGA
484-UBGA (19x19)
XC7S6-1CPGA196Q
Xilinx Inc.

IC FPGA 100 I/O 196CPBGA

  • Number of LABs/CLBs: 469
  • Number of Logic Elements/Cells: 6000
  • Total RAM Bits: 184320
  • Number of I/O: 100
  • Number of Gates: -
  • Voltage - Supply: 0.95V ~ 1.05V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Package / Case: -
  • Supplier Device Package: 196-CPBGA (8x8)
pacchetto: -
Azione5.008
6000
184320
100
-
0.95V ~ 1.05V
Surface Mount
-40°C ~ 125°C (TJ)
-
196-CPBGA (8x8)
5AGXBA3D4F31C5G
Intel

IC FPGA 384 I/O 896FBGA

  • Number of LABs/CLBs: 7362
  • Number of Logic Elements/Cells: 156000
  • Total RAM Bits: 11746304
  • Number of I/O: 384
  • Number of Gates: -
  • Voltage - Supply: 1.07V ~ 1.13V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 896-BBGA, FCBGA
  • Supplier Device Package: 896-FBGA (31x31)
pacchetto: 896-BBGA, FCBGA
Azione5.088
156000
11746304
384
-
1.07V ~ 1.13V
Surface Mount
0°C ~ 85°C (TJ)
896-BBGA, FCBGA
896-FBGA (31x31)
XA7S100-1FGGA484I
AMD

IC FPGA 338 I/O 484FBGA

  • Number of LABs/CLBs: 8000
  • Number of Logic Elements/Cells: 102400
  • Total RAM Bits: 4423680
  • Number of I/O: 338
  • Number of Gates: -
  • Voltage - Supply: 0.95V ~ 1.05V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FPBGA (23x23)
pacchetto: -
Request a Quote
102400
4423680
338
-
0.95V ~ 1.05V
Surface Mount
-40°C ~ 100°C (TJ)
484-BGA
484-FPBGA (23x23)
LAV-AT-G30-2LFG676C
Lattice Semiconductor Corporation

LATTICE AVANT MID-RANGE GENERAL

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: 262000
  • Total RAM Bits: 1740800
  • Number of I/O: 298
  • Number of Gates: -
  • Voltage - Supply: 0.82V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
pacchetto: -
Request a Quote
262000
1740800
298
-
0.82V
Surface Mount
0°C ~ 85°C (TJ)
676-BBGA, FCBGA
676-FCBGA (27x27)
5SGXMBBR2H43I3G
Intel

IC FPGA 600 I/O 1760HBGA

  • Number of LABs/CLBs: 359200
  • Number of Logic Elements/Cells: 952000
  • Total RAM Bits: 53248000
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-HBGA (45x45)
pacchetto: -
Request a Quote
952000
53248000
600
-
0.82V ~ 0.88V
Surface Mount
-40°C ~ 100°C (TJ)
1760-BBGA, FCBGA
1760-HBGA (45x45)
EP4SGX290FF35C3G
Intel

IC FPGA 564 I/O 1152FBGA

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: -
  • Number of I/O: -
  • Number of Gates: -
  • Voltage - Supply: -
  • Mounting Type: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
pacchetto: -
Request a Quote
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