Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Logic Elements/Cells | Total RAM Bits | Number of I/O | Number of Gates | Voltage - Supply | Mounting Type | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Altera |
IC FPGA 382 I/O 484FBGA
|
pacchetto: 484-BBGA |
Azione5.616 |
|
8320 | 106496 | 382 | 526000 | 2.375 V ~ 2.625 V | Surface Mount | 0°C ~ 85°C (TJ) | 484-BBGA | 484-FBGA (23x23) |
||
Microsemi Corporation |
IC FPGA 65 I/O 180QFN
|
pacchetto: 180-WFQFN Dual Rows, Exposed Pad |
Azione5.552 |
|
- | 36864 | 65 | 250000 | 1.425 V ~ 1.575 V | Surface Mount | -40°C ~ 100°C (TJ) | 180-WFQFN Dual Rows, Exposed Pad | 180-QFN (10x10) |
||
Lattice Semiconductor Corporation |
IC FPGA 147 I/O 208QFP
|
pacchetto: 208-BFQFP |
Azione6.976 |
|
6100 | 94208 | 147 | - | 1.14 V ~ 1.26 V | Surface Mount | 0°C ~ 85°C (TJ) | 208-BFQFP | 208-PQFP (28x28) |
||
Microsemi Corporation |
IC FPGA 68 I/O 100VQFP
|
pacchetto: 100-TQFP |
Azione6.688 |
|
6144 | 36864 | 68 | 250000 | 1.14 V ~ 1.575 V | Surface Mount | 0°C ~ 70°C (TA) | 100-TQFP | 100-VQFP (14x14) |
||
Microchip Technology |
IC FPGA 3.3V 576 CELL 208QFP
|
pacchetto: 208-BFQFP |
Azione4.848 |
|
576 | 4608 | 161 | 20000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 70°C | 208-BFQFP | 208-PQFP (28x28) |
||
Altera |
IC FPGA 552 I/O 1152FBGA
|
pacchetto: 1152-BBGA, FCBGA |
Azione6.784 |
|
622000 | 59939840 | 552 | - | 0.82 V ~ 0.88 V | Surface Mount | -40°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA (35x35) |
||
Altera |
IC FPGA 696 I/O 1517FBGA
|
pacchetto: 1517-BBGA, FCBGA |
Azione4.688 |
|
490000 | 53105664 | 696 | - | 0.82 V ~ 0.88 V | Surface Mount | 0°C ~ 85°C (TJ) | 1517-BBGA, FCBGA | 1517-FBGA (40x40) |
||
Altera |
IC FPGA 768 I/O 1932FCBGA
|
pacchetto: 1932-BBGA, FCBGA |
Azione2.688 |
|
1150000 | 68857856 | 768 | - | 0.87 V ~ 0.93 V | Surface Mount | -40°C ~ 100°C (TJ) | 1932-BBGA, FCBGA | 1932-FCBGA (45x45) |
||
Altera |
IC FPGA 176 I/O 324UBGA
|
pacchetto: 324-LFBGA |
Azione4.672 |
|
25000 | 2002944 | 176 | - | 1.07 V ~ 1.13 V | Surface Mount | 0°C ~ 85°C (TJ) | 324-LFBGA | 324-UBGA (15x15) |
||
Lattice Semiconductor Corporation |
IC FPGA 604 I/O 1152FCBGA
|
pacchetto: 1152-BBGA, FCBGA |
Azione6.000 |
|
40000 | 4075520 | 604 | - | 0.95 V ~ 1.26 V | Surface Mount | -40°C ~ 105°C (TJ) | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) |
||
Xilinx Inc. |
IC FPGA 448 I/O 668FCBGA
|
pacchetto: 668-BBGA, FCBGA |
Azione5.776 |
|
24192 | 1327104 | 448 | - | 1.14 V ~ 1.26 V | Surface Mount | 0°C ~ 85°C (TJ) | 668-BBGA, FCBGA | 668-FCBGA (27x27) |
||
Microsemi Corporation |
IC FPGA 284 I/O
|
pacchetto: - |
Azione2.960 |
|
109000 | 7782400 | 284 | - | 0.97 V ~ 1.08 V | - | -40°C ~ 100°C (TJ) | - | - |
||
Lattice Semiconductor Corporation |
IC FPGA 363 I/O 484FBGA
|
pacchetto: 484-BBGA |
Azione3.056 |
|
40000 | 906240 | 363 | - | 1.14 V ~ 1.26 V | Surface Mount | -40°C ~ 100°C (TJ) | 484-BBGA | 484-FPBGA (23x23) |
||
Microsemi Corporation |
IC FPGA 151 I/O 208QFP
|
pacchetto: 208-BFQFP |
Azione4.048 |
|
- | 36864 | 151 | 250000 | 1.425 V ~ 1.575 V | Surface Mount | -40°C ~ 100°C (TJ) | 208-BFQFP | 208-PQFP (28x28) |
||
Xilinx Inc. |
IC FPGA 176 I/O 256FBGA
|
pacchetto: 256-BGA |
Azione15.696 |
|
1728 | 32768 | 176 | 50000 | 2.375 V ~ 2.625 V | Surface Mount | -40°C ~ 100°C (TJ) | 256-BGA | 256-FBGA (17x17) |
||
Microsemi Corporation |
IC FPGA 100 I/O 144TQFP
|
pacchetto: 144-LQFP |
Azione6.352 |
|
- | 36864 | 100 | 125000 | 1.425 V ~ 1.575 V | Surface Mount | -40°C ~ 100°C (TJ) | 144-LQFP | 144-TQFP (20x20) |
||
Lattice Semiconductor Corporation |
IC FPGA 206 I/O 256FTBGA
|
pacchetto: 256-LBGA |
Azione7.184 |
|
2112 | 75776 | 206 | - | 1.14 V ~ 1.26 V | Surface Mount | 0°C ~ 85°C (TJ) | 256-LBGA | 256-FTBGA (17x17) |
||
Lattice Semiconductor Corporation |
IC FPGA 271 I/O 324FTBGA
|
pacchetto: 324-LBGA |
Azione7.188 |
|
2280 | 28262 | 271 | - | 1.71 V ~ 3.465 V | Surface Mount | 0°C ~ 85°C (TJ) | 324-LBGA | 324-FTBGA (19x19) |
||
Intel |
IC FPGA
|
pacchetto: 652-BBGA |
Azione4.368 |
|
38400 | 327680 | 488 | 1772000 | 1.71 V ~ 1.89 V | Surface Mount | 0°C ~ 85°C (TJ) | 652-BBGA | 652-BGA (45x45) |
||
Intel |
IC FPGA 600 I/O 1760FBGA
|
pacchetto: 1760-BBGA, FCBGA |
Azione3.808 |
|
597000 | 61688832 | 600 | - | 0.82 V ~ 0.88 V | Surface Mount | -40°C ~ 100°C (TJ) | 1760-BBGA, FCBGA | 1760-FBGA, FC (42.5x42.5) |
||
Intel |
IC FPGA 564 I/O 1152HBGA
|
pacchetto: 1152-BBGA, FCBGA |
Azione6.656 |
|
531200 | 28033024 | 564 | - | 0.87 V ~ 0.93 V | Surface Mount | -40°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-HBGA, FC (42.5x42.5) |
||
Intel |
IC FPGA 432 I/O 1152FBGA
|
pacchetto: 1152-BBGA, FCBGA |
Azione2.768 |
|
490000 | 53105664 | 432 | - | 0.87 V ~ 0.93 V | Surface Mount | -40°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA (35x35) |
||
Intel |
IC FPGA 91 I/O 144EQFP
|
pacchetto: 144-LQFP Exposed Pad |
Azione2.992 |
|
6272 | 276480 | 91 | - | 1.15 V ~ 1.25 V | Surface Mount | -40°C ~ 100°C (TJ) | 144-LQFP Exposed Pad | 144-EQFP (20x20) |
||
Intel |
IC FPGA 384 I/O 896FBGA
|
pacchetto: 896-BBGA, FCBGA |
Azione3.088 |
|
190000 | 13284352 | 384 | - | 1.07 V ~ 1.13 V | Surface Mount | 0°C ~ 85°C (TJ) | 896-BBGA, FCBGA | 896-FBGA (31x31) |
||
Intel |
IC FPGA 432 I/O 1152FBGA
|
pacchetto: - |
Request a Quote |
|
340000 | 19456000 | 432 | - | 0.82V ~ 0.88V | Surface Mount | 0°C ~ 85°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA (35x35) |
||
Intel |
IC FPGA 600 I/O 1152FBGA
|
pacchetto: - |
Request a Quote |
|
340000 | 19456000 | 600 | - | 0.87V ~ 0.93V | Surface Mount | -40°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA (35x35) |
||
Microchip Technology |
RT4G150-1CQG352R
|
pacchetto: - |
Request a Quote |
|
151824 | 5325 | - | - | 1.14V ~ 1.26V | Surface Mount | -55°C ~ 125°C (TJ) | 352-BFCQFP Exposed Pad and Tie Bar | 352-QFP (48x48) |
||
Microchip Technology |
RT4G150L-CGG1657PROTO
|
pacchetto: - |
Request a Quote |
|
151824 | 5325 | - | - | 1.14V ~ 1.26V | Surface Mount | -55°C ~ 125°C (TJ) | 1657-BFCCGA | 1657-CCGA (42.5x42.5) |