Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC CLK BUFFER 1:2 1GHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione2.864 |
|
1 | 1:2 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 1GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 2:18 250MHZ 32VFQFPN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione3.856 |
|
1 | 2:18 | Yes/No | CML, LVCMOS, LVPECL, LVTTL, SSTL | LVCMOS, LVTTL | 250MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-VFQFPN (5x5) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 100MHZ 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione3.024 |
|
1 | 1:10 | No/No | LVCMOS | LVCMOS, TTL | 100MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:10 2.7GHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione24.000 |
|
1 | 2:10 | Yes/Yes | ECL, HSTL, PECL | ECL, PECL | 2.7GHz | 2.375 V ~ 3.465 V | -40°C ~ 110°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 2.7GHZ 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione3.536 |
|
1 | 2:4 | Yes/Yes | ECL, HSTL, LVPECL | ECL, LVPECL | 2.7GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Microchip Technology |
IC CLK BUFFER 2:9 500MHZ 32TQFP
|
pacchetto: 32-TQFP |
Azione3.120 |
|
1 | 2:9 | Yes/Yes | HSTL, LVPECL | HSTL | 500MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 1:18 200MHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione2.272 |
|
1 | 1:18 | Yes/No | LVCMOS, LVPECL, LVTTL | LVCMOS, LVTTL | 200MHz | 2.375 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
NXP |
IC CLK BUFFER 1:18 250MHZ 32LQFP
|
pacchetto: 32-LQFP |
Azione5.168 |
|
1 | 1:18 | Yes/Yes | LVCMOS, LVPECL | LVCMOS | 250MHz | 2.375 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
Diodes Incorporated |
IC CLK BUFFER 1:5 100MHZ 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione6.608 |
|
2 | 1:5 | No/No | CMOS, TTL | CMOS | 100MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
ON Semiconductor |
IC CLK BUFFER 2:5 2.5GHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione6.560 |
|
1 | 2:5 | Yes/Yes | ECL, HSTL, LVDS, PECL | ECL, PECL | 2.5GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:5 500MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione5.184 |
|
1 | 2:5 | Yes/Yes | HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, LVTTL | HCSL | 500MHz | 2.97 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 350MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.640 |
|
1 | 1:2 | Yes/No | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVCMOS, LVTTL | 350MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Diodes Incorporated |
CLOCK SAW OSCILLATOR SEAM7050
|
pacchetto: - |
Azione3.696 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Diodes Incorporated |
IC CLOCK BUFFER MUX 2:4 8TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione14.196 |
|
1 | 2:4 | Yes/Yes | CML, HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVDS | 800MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Diodes Incorporated |
CLOCK BUFFER TSSOP-8
|
pacchetto: - |
Azione5.504 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Diodes Incorporated |
IC CLK BUFF 1:10 250MHZ 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione6.832 |
|
1 | 1:10 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 250MHz | 1.65 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Texas Instruments |
IC CLK BUFFER 1:9 650MHZ 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione5.632 |
|
1 | 1:9 | Yes/Yes | LVPECL | LVPECL | 650MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Diodes Incorporated |
IC CLOCK BUFFER 1:4 2.5GHZ 16QFN
|
pacchetto: 16-WFQFN Exposed Pad |
Azione4.880 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL, SSTL | LVDS | 2.5GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-WFQFN Exposed Pad | 16-TQFN (3x3) |
||
Microsemi Corporation |
IC CLK BUFFER 1:4 750MHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione13.692 |
|
1 | 1:4 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTPX 2:1 700MHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione8.088 |
|
1 | 2:1 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL | HCSL | 700MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:4 2.5GHZ 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione6.312 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL | CML | 2.5GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTPX 4:1 250MHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione21.792 |
|
1 | 4:1 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 250MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
ON Semiconductor |
IC CLK BUFFER 1:2/1:6 24TSSOP
|
pacchetto: 24-TSSOP (0.173", 4.40mm Width) |
Azione3.984 |
|
2 | 1:2, 1:6 | No/No | GTLP, TTL | GTLP, TTL | - | 4.75 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
IDT, Integrated Device Technology Inc |
NETWORK TIMING
|
pacchetto: 48-VFQFN Exposed Pad |
Azione4.816 |
|
2 | 2:16 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVDS | 2GHz | 1.71 V ~ 1.89 V | -40°C ~ 85°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | 48-VFQFPN (7x7) |
||
Diodes Incorporated |
IC CLOCK BUFFER V-QFN7070-48
|
pacchetto: 48-VFQFN Exposed Pad |
Azione28.260 |
|
1 | 2:16 | Yes/Yes | Differential or Single-Ended | LVDS | 1.5GHz | 2.375V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | 48-TQFN (7x7) |
||
Fairchild Semiconductor |
IC CLOCK MULTIPLIER 32LQFP
|
pacchetto: - |
Request a Quote |
|
- | 1:9 | Yes/No | CMOS, PECL | Clock | - | 3.1V ~ 3.5V | 0°C ~ 70°C (TA) | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
Skyworks Solutions Inc. |
IC CLK BUFFER 2:6 725MHZ 32QFN
|
pacchetto: - |
Request a Quote |
|
1 | 2:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | CML, HCSL, LVCMOS, LVDS, LVPECL | 725 MHz | 1.71V ~ 1.89V, 2.38V ~ 2.63V, 2.97V ~ 3.63V | -40°C ~ 85°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Cypress Semiconductor Corp |
IC ZD BUFFER 16SOIC
|
pacchetto: - |
Request a Quote |
|
- | 1:8 | No/No | - | - | - | 2.97V ~ 3.63V | 0°C ~ 70°C (TA) | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |