Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 166MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.824 |
|
1 | 1:4 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 250MHz | 2.375 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC CLK BUFFER 1:4 40MHZ 16QFN
|
pacchetto: 16-WFQFN Exposed Pad |
Azione6.848 |
|
1 | 1:4 | No/No | Crystal | LVCMOS | 40MHz | 1.62 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:5 250MHZ 28TSSOP
|
pacchetto: 28-TSSOP (0.173", 4.40mm Width) |
Azione5.232 |
|
1 | 1:5 | Yes/No | eHSTL, HSTL, LVPECL, LVTTL | eHSTL, HSTL, LVTTL | 250MHz | 2.4 V ~ 2.6 V | -40°C ~ 85°C | Surface Mount | 28-TSSOP (0.173", 4.40mm Width) | 28-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTPX 2:2 250MHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione5.616 |
|
1 | 2:2 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 250MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Silicon Labs |
IC CLK BUFFER 1:8 350MHZ 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione6.848 |
|
1 | 1:8 | Yes/No | CML, HCSL, LVDS, LVPECL | SSTL | 350MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione4.368 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:3 2GHZ 16VFQFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione3.808 |
|
1 | 1:3 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 2GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTIPLX 2:1/1:2 16VFQFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione16.680 |
|
2 | 2:1, 1:2 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 3.2GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:5 700MHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione7.120 |
|
2 | 1:5 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | ECL, LVPECL | 700MHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:18 250MHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione3.680 |
|
1 | 2:18 | Yes/No | CML, LVCMOS, LVPECL, LVTTL, SSTL | LVCMOS, LVTTL | 250MHz | 2.375 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
Silicon Labs |
IC CLK BUFFER 1:8 200MHZ 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione5.520 |
|
1 | 1:8 | No/No | CMOS, HSTL, LVTTL, SSTL | CMOS | 200MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Maxim Integrated |
IC CLK BUFFER 2:5 1.5GHZ 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione7.744 |
|
1 | 2:5 | Yes/Yes | HSTL, LVECL, LVPECL | LVECL, LVPECL | 1.5GHz | 3 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Texas Instruments |
IC CLK BUFFER 2:12 2GHZ 40VQFN
|
pacchetto: 40-VFQFN Exposed Pad |
Azione4.480 |
|
1 | 2:12 | Yes/Yes | LVCMOS, LVDS, LVPECL, LVTTL | LVPECL | 2GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-VQFN (6x6) |
||
Microsemi Corporation |
IC CLK BUFF MUX 2:8 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione4.832 |
|
1 | 2:8 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Texas Instruments |
IC CLK BUFFER 1:18 100MHZ 48SSOP
|
pacchetto: 48-BSSOP (0.295", 7.50mm Width) |
Azione121.500 |
|
1 | 1:18 | No/No | LVTTL | LVTTL, TTL | 100MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 48-BSSOP (0.295", 7.50mm Width) | 48-SSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:6 2GHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione4.672 |
|
1 | 1:6 | Yes/Yes | CML, LVDS, LVPECL | ECL, LVPECL | 2GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Diodes Incorporated |
IC CLK BUFFER 1:10 156MHZ 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione5.232 |
|
1 | 1:10 | No/No | CMOS, TTL | CMOS, TTL | 156MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Silicon Labs |
IC CLK BUFFER 1:4 LVPECL 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione5.360 |
|
1 | 1:4 | Yes/Yes | CML, HCSL, LVDS, LVPECL | LVPECL | 710MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 700MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.108 |
|
1 | 1:2 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVHSTL | 700MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Silicon Labs |
1:10 UNIVERSAL BUFFER/LEVEL TRAN
|
pacchetto: 44-VFQFN Exposed Pad |
Azione5.616 |
|
1 | 2:10 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | CML, HCSL, LVCMOS, LVDS, LVPECL | 725MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 44-VFQFN Exposed Pad | 44-QFN (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione16.548 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:6 100MHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione63.972 |
|
1 | 1:6 | No/No | Crystal | LVCMOS, LVTTL | 100MHz | 1.6 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Analog Devices Inc. |
IC CLK BUFFER 1:6 1.2GHZ 24LFCSP
|
pacchetto: 24-VFQFN Exposed Pad, CSP |
Azione25.200 |
|
1 | 1:6 | Yes/Yes | CML, CMOS, HSTL, LVDS, LVPECL | CMOS, LVDS | 1.2GHz | 1.71 V ~ 1.89 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad, CSP | 24-LFCSP-VQ (4x4) |
||
Texas Instruments |
LMK00301ARHSR
|
pacchetto: - |
Azione5.472 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
NETWORK TIMING
|
pacchetto: 32-VFQFN Exposed Pad |
Azione2.592 |
|
1 | 1:8 | Yes/Yes | HCSL, LVPECL | HCSL | 350MHz | 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | 32-VFQFPN (5x5) |
||
Renesas Electronics Corporation |
IC CLK BUFFER 1:2 1GHZ 8SOIC
|
pacchetto: - |
Request a Quote |
|
1 | 1:2 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | ECL, LVPECL | 1 GHz | 2.375V ~ 2.625V, 3.135V ~ 3.465V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
QS52806ZQTSO
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Cypress Semiconductor Corp |
LOW SKEW CLOCK DRIVER
|
pacchetto: - |
Request a Quote |
|
- | 2:13 | No/No | Clock | Clock | - | 3.135V ~ 3.465V | 0°C ~ 70°C (TA) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |