Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 3GHZ 8TSSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione4.864 |
|
1 | 1:2 | Yes/Yes | ECL | LVPECL | 3GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 1:10 200MHZ 20VFQFPN
|
pacchetto: 20-VFQFN Exposed Pad |
Azione2.400 |
|
1 | 1:10 | No/No | LVTTL | LVTTL | 200MHz | 2.3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-VFQFN Exposed Pad | 20-VFQFPN (3.5x4.5) |
||
NXP |
IC CLK BUFFER 1:18 250MHZ 32LQFP
|
pacchetto: 32-LQFP |
Azione5.376 |
|
1 | 1:18 | Yes/No | LVPECL | LVCMOS | 250MHz | 2.375 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
Diodes Incorporated |
IC CLK BUFFER 1:18 100MHZ 48SSOP
|
pacchetto: 48-BSSOP (0.295", 7.50mm Width) |
Azione3.728 |
|
1 | 1:18 | No/No | TTL | TTL | 100MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 48-BSSOP (0.295", 7.50mm Width) | 48-SSOP |
||
Microchip Technology |
IC CLK BUFFER 2:4 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione7.104 |
|
1 | 2:4 | Yes/Yes | ECL, PECL | ECL, PECL | - | 3 V ~ 3.8 V | 0°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Microchip Technology |
IC CLK BUFFER 2:5 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione135.840 |
|
1 | 2:5 | Yes/Yes | ECL, PECL | ECL, PECL | - | 3 V ~ 5.5 V | 0°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
NXP |
IC CLK BUFFER 3:15 200MHZ 52LQFP
|
pacchetto: 52-LQFP |
Azione5.984 |
|
1 | 3:15 | Yes/No | LVCMOS, LVPECL | LVCMOS | 200MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 52-LQFP | 52-LQFP (10x10) |
||
NXP |
IC CLK BUFFER 2:1 3GHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione7.280 |
|
2 | 2:1 | Yes/Yes | ECL, PECL, LVDS | ECL, PECL | 3GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
NXP |
IC CLK BUFFER 2:20 2GHZ 52LQFP
|
pacchetto: 52-LQFP Exposed Pad |
Azione3.952 |
|
1 | 2:20 | Yes/Yes | ECL, HSTL, PECL | ECL, PECL | 2GHz | 2.375 V ~ 3.465 V | -40°C ~ 110°C | Surface Mount | 52-LQFP Exposed Pad | 52-LQFP (10x10) |
||
Diodes Incorporated |
IC CLK BUFFER 1:5 66MHZ 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione2.720 |
|
2 | 1:5 | No/No | CMOS, TTL | CMOS | 66MHz | 4.75 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Linear Technology |
IC CLK BUFFER 1:3 1.4GHZ
|
pacchetto: 36-WFQFN Exposed Pad |
Azione7.856 |
|
1 | 1:3 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVCMOS, LVDS, LVPECL | 1.4GHz | 3.15 V ~ 3.45 V | -40°C ~ 105°C | Surface Mount | 36-WFQFN Exposed Pad | 36-QFN (4x7) |
||
Texas Instruments |
IC CLK BUFFER 2:10 1.1GHZ 32LQFP
|
pacchetto: 32-LQFP |
Azione3.472 |
|
1 | 2:10 | Yes/Yes | LVDS | LVDS | 1.1GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTIPLX 4:1 2GHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione5.968 |
|
1 | 4:1 | Yes/Yes | CML, LVDS, LVPECL, SSTL | LVDS | 2GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Silicon Labs |
IC CLK BUFFER 1:4 LVPECL 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione6.560 |
|
1 | 1:4 | Yes/Yes | CML, HCSL, LVDS, LVPECL | LVPECL | 710MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Diodes Incorporated |
IC CLOCK BUFF 3:8 200MHZ 32TQFN
|
pacchetto: 32-WFQFN Exposed Pad |
Azione7.136 |
|
1 | 3:8 | Yes/No | LVCMOS, LVTTL, Crystal | CMOS | 200MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-WFQFN Exposed Pad | 32-TQFN (5x5) |
||
Microchip Technology |
HIGH SPEED TRANSLATOR BUFFER TO
|
pacchetto: 16-VFQFN |
Azione10.680 |
|
1 | 1:1 | No/No | LVCMOS, Sine Wave | LVCMOS | 200MHz | 2.5 V ~ 3.3 V | 0°C ~ 70°C | Surface Mount | 16-VFQFN | 16-QFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 650MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione6.624 |
|
1 | 2:4 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVHSTL | 650MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Silicon Labs |
IC BUFFER 1:8 CMOS 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione5.664 |
|
1 | 1:8 | No/No | LVCMOS | LVCMOS | 200MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Linear Technology |
IC CLK BUFFER 1:3 1.4GHZ
|
pacchetto: 36-WFQFN Exposed Pad |
Azione6.816 |
|
1 | 1:3 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVCMOS, LVDS | 1.4GHz | 3.15 V ~ 3.45 V | -40°C ~ 105°C | Surface Mount | 36-WFQFN Exposed Pad | 36-QFN (4x7) |
||
ON Semiconductor |
IC CLK BUFFER 1:2 6GHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione17.172 |
|
1 | 1:2 | Yes/Yes | CML, LVCMOS, LVDS, LVNECL, LVPECL, LVTTL | ECL | 6GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
ON Semiconductor |
IC CLK BUFFER 1:8 8GHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione4.784 |
|
1 | 1:8 | Yes/Yes | CML, LVCMOS, LVDS, LVPECL, LVTTL | CML | 8GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
IDT, Integrated Device Technology Inc |
IC NETWORK TIMING 32VFQFPN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione3.392 |
|
1 | 1:8 | Yes/Yes | CML, LVDS, LVPECL | LVDS | 1GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-VFQFPN (5x5) |
||
Renesas Electronics Corporation |
IC CLK MULTIPLX 2:1/1:2 16VFQFPN
|
pacchetto: - |
Request a Quote |
|
2 | 2:1, 1:2 | Yes/Yes | CML, LVDS, LVPECL | LVDS | 2.5 GHz | 2.375V ~ 2.625V | -40°C ~ 85°C (TA) | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFPN (3x3) |
||
Renesas Electronics Corporation |
IC CLK BUFFER 1:18 2GHZ 48VFQFPN
|
pacchetto: - |
Request a Quote |
|
1 | 1:18 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVDS, LVPECL | 2 GHz | 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | 48-VFQFPN (7x7) |
||
Texas Instruments |
IC CLK BUFFER 1:2 2GHZ 16VQFN
|
pacchetto: - |
Azione750 |
|
2 | 1:2 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | Clock, LVDS | 2 GHz | 1.71V ~ 1.89V, 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 105°C (TA) | Surface Mount | 16-VFQFN Exposed Pad | 16-VQFN (3x3) |
||
Cypress Semiconductor Corp |
IC ZD BUFFER 16TSSOP
|
pacchetto: - |
Request a Quote |
|
- | 1:9 | No/No | Clock | Clock | - | 3V ~ 3.6V | 0°C ~ 70°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Renesas Electronics Corporation |
IC CLK BUFFER 1:8 200MHZ 16QFN
|
pacchetto: - |
Request a Quote |
|
1 | 1:8 | No/No | LVCMOS | LVCMOS | 200 MHz | 1.71V ~ 1.89V, 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 16-UFQFN | 16-QFN (2.5x2.5) |
||
Skyworks Solutions Inc. |
IC CLK BUFFER 1:4 170MHZ 40QFN
|
pacchetto: - |
Request a Quote |
|
1 | 1:4 | Yes/Yes | Clock | HCSL, LVCMOS, LVDS, LVPECL | 170 MHz | 1.71V ~ 3.46V | -40°C ~ 105°C (TA) | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (6x6) |