Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Silicon Labs |
IC CLK BUFFER 1:4 710MHZ 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione4.544 |
|
1 | 1:4 | Yes/Yes | CML, HCSL, LVDS, LVPECL | LVDS | 710MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 2:12 200MHZ 32TQFP
|
pacchetto: 32-TQFP |
Azione3.984 |
|
1 | 2:12 | Yes/No | LVCMOS, LVPECL, LVTTL | LVCMOS, LVTTL | 200MHz | 2.375 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 100MHZ 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione4.448 |
|
1 | 1:10 | No/No | LVTTL | CMOS, TTL | 100MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 200MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.840 |
|
1 | 1:4 | No/No | Clock | LVCMOS | 200MHz | 1.14 V ~ 1.89 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:6 2GHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione6.336 |
|
1 | 1:6 | Yes/Yes | CML, LVDS, LVPECL, SSTL | ECL, LVPECL | 2GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 1:15 200MHZ 52TQFP
|
pacchetto: 52-TQFP |
Azione4.240 |
|
1 | 1:15 | Yes/Yes | LVCMOS, LVPECL, LVTTL | LVCMOS, LVTTL | 200MHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 52-TQFP | 52-TQFP (10x10) |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione6.336 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
ON Semiconductor |
IC CLK BUFFER 1:2 12GHZ 16FCBGA
|
pacchetto: 16-LBGA, FCBGA |
Azione6.048 |
|
1 | 1:2 | Yes/Yes | CML, LVCMOS, LVDS, LVTTL, NECL, RSNECL, PECL | RSECL, RSNECL, RSPECL | 12GHz | 2.375 V ~ 3.465 V | -40°C ~ 70°C | Surface Mount | 16-LBGA, FCBGA | 16-FCBGA (4x4) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:24 1.5GHZ 64TQFP
|
pacchetto: 64-TQFP Exposed Pad |
Azione2.032 |
|
1 | 1:24 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 1.5GHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 64-TQFP Exposed Pad | 64-TQFP-EP (10x10) |
||
Texas Instruments |
IC CLK BUFFER 1:10 100MHZ 24SOIC
|
pacchetto: 24-SOIC (0.295", 7.50mm Width) |
Azione19.272 |
|
1 | 1:10 | No/No | LVTTL | LVTTL, TRI-State | 100MHz | 3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | 24-SOIC |
||
Microsemi Corporation |
IC CLK BUFF MUX 2:8 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione5.760 |
|
1 | 2:8 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Silicon Labs |
IC CLK BUFFER 1:8 SSTL 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione6.240 |
|
1 | 1:8 | Yes/No | CML, HCSL, LVDS, LVPECL | SSTL | 350MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Microchip Technology |
IC CLK BUFFER 1:2 2.5GHZ 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione2.080 |
|
1 | 1:2 | Yes/Yes | CML, HSTL, LVDS, LVPECL | LVPECL | 2.5GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 2:4 1GHZ 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione5.856 |
|
1 | 2:4 | No/Yes | LVCMOS, LVTTL | LVPECL | 1GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:1 200MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.864 |
|
1 | 1:1 | No/No | LVCMOS, Sine Wave | LVCMOS | 200MHz | 2.5 V ~ 3.3 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 1:2 1.5GHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.344 |
|
1 | 1:2 | Yes/Yes | CML, HCSL, LVDS, LVPECL | LVPECL | 1.5GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC CLK BUFFER 1:5 134MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.712 |
|
1 | 1:5 | No/No | CMOS | CMOS | 134MHz | 1.62 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Microchip Technology |
IC CLK MULTIPLXR 2:10 2GHZ 44MLF
|
pacchetto: 44-VFQFN Exposed Pad, 44-MLF? |
Azione5.648 |
|
1 | 2:10 | Yes/Yes | CML, LVDS, PECL | LVDS | 2GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 44-VFQFN Exposed Pad, 44-MLF? | 44-MLF? (7x7) |
||
Diodes Incorporated |
IC CLK BUFFER 1:10 133MHZ 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione7.392 |
|
1 | 1:10 | No/No | CMOS | CMOS | 133MHz | 2.97 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 2GHZ 16VFQFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione7.572 |
|
1 | 2:4 | Yes/Yes | LVDS, LVPECL | LVDS | 2GHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
Diodes Incorporated |
IC CLOCK
|
pacchetto: - |
Azione3.936 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 20-SSOP
|
pacchetto: - |
Azione3.360 |
|
1 | 1:10 | No/No | LVTTL | CMOS, TTL | 200MHz | 1.71 V ~ 3.45 V | -40°C ~ 105°C | - | - | - |
||
Microchip Technology |
DB2000Q BUFFER WITH ULTRA LOW JI
|
pacchetto: 72-VFQFN Exposed Pad |
Azione6.600 |
|
1 | 1:20 | Yes/Yes | Clock | HCSL | 250MHz | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 72-VFQFN Exposed Pad | 72-QFN (10x10) |
||
Renesas Electronics Corporation |
IC CLK BUFFER 1:8 200MHZ 16TSSOP
|
pacchetto: - |
Azione7.500 |
|
1 | 1:8 | No/No | LVCMOS | LVCMOS | 200 MHz | 1.71V ~ 1.89V, 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Renesas Electronics Corporation |
8S89874BKILF/W
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Texas Instruments |
IC CLK BUFFER 1:8 250MHZ 48VQFN
|
pacchetto: - |
Azione10.524 |
|
1 | 1:8 | Yes/Yes | Clock, HCSL | Clock, HCSL | 250 MHz | 3V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | 48-VQFN (6x6) |
||
Diodes Incorporated |
IC CLK BUFFER 1:12 400MHZ 64TQFN
|
pacchetto: - |
Azione9.000 |
|
1 | 1:12 | Yes/Yes | HCSL | HCSL | 400 MHz | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 64-VFQFN Exposed Pad | 64-TQFN (9x9) |
||
Diodes Incorporated |
IC CLK BUFFER 1:20 400MHZ 80AQFN
|
pacchetto: - |
Azione25.527 |
|
1 | 1:20 | Yes/Yes | CMOS, HCSL | HCSL | 400 MHz | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 80-VFQFN Dual Rows, Exposed Pad | 80-aQFN (6x6) |