Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 300MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione7.552 |
|
1 | 2:4 | Yes/No | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVCMOS, LVTTL | 300MHz | 3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:5 500MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione5.184 |
|
1 | 2:5 | Yes/Yes | HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, LVTTL | HCSL | 500MHz | 2.97 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:2 266MHZ 14TSSOP
|
pacchetto: 14-TSSOP (0.173", 4.40mm Width) |
Azione5.136 |
|
1 | 2:2 | No/Yes | LVCMOS, LVTTL | LVPECL | 266MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 14-TSSOP (0.173", 4.40mm Width) | 14-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK DIVIDR 2:1 250MHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione4.896 |
|
- | - | - | - | - | - | - | - | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 3:6 266MHZ 24TSSOP
|
pacchetto: 24-TSSOP (0.173", 4.40mm Width) |
Azione5.632 |
|
1 | 3:6 | No/Yes | LVCMOS, LVTTL, Crystal | LVPECL | 266MHz | 2.375 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 3:6 266MHZ 24TSSOP
|
pacchetto: 24-TSSOP (0.173", 4.40mm Width) |
Azione5.456 |
|
1 | 3:6 | Yes/Yes | HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, LVTTL, SSTL, Crystal | LVDS | 266MHz | 2.375 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:24 167MHZ 48TQFP
|
pacchetto: 48-LQFP |
Azione3.808 |
|
1 | 2:24 | Yes/No | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVCMOS | 167MHz | 2.375 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:16 200MHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione4.448 |
|
1 | 1:16 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 200MHz | 2.375 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 150MHZ 32TQFP
|
pacchetto: 32-TQFP |
Azione5.056 |
|
1 | 1:10 | No/No | HSTL | HSTL | 150MHz | 1.38 V ~ 1.62 V | 0°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 500MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione7.312 |
|
1 | 2:4 | Yes/Yes | HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, LVTTL, SSTL | HCSL | 500MHz | 2.97 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 1:3/1:6 2GHZ 32VFQFPN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione6.864 |
|
2 | 1:3, 1:6 | Yes/Yes | CML, LVDS, LVPECL, SSTL | LVDS | 2GHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 32-VFQFN Exposed Pad | 32-VFQFPN (5x5) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 3:15 200MHZ 52TQFP
|
pacchetto: 52-LQFP |
Azione6.320 |
|
1 | 3:15 | Yes/No | LVCMOS, LVPECL | LVCMOS | 200MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 52-LQFP | 52-TQFP (10x10) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER/DIVIDER 32VFQFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione4.832 |
|
1 | 1:8 | Yes/Yes | CML, LVDS, LVPECL | LVDS | 500MHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-VFQFN (5x5) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 250MHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione2.480 |
|
1 | 1:10 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL | HCSL | 250MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:9 500MHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione6.128 |
|
1 | 2:9 | Yes/Yes | CML, HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 500MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 1:16 150MHZ 32VFQFPN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione6.000 |
|
1 | 1:16 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 150MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 32-VFQFN Exposed Pad | 32-VFQFPN (5x5) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 3:6 700MHZ 24TSSOP
|
pacchetto: 24-TSSOP (0.173", 4.40mm Width) |
Azione3.296 |
|
1 | 3:6 | Yes/Yes | HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, LVTTL, SSTL, Crystal | LVPECL | 700MHz | 2.375 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:18 250MHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione4.608 |
|
1 | 2:18 | Yes/No | CML, LVCMOS, LVPECL, LVTTL, SSTL | LVCMOS, LVTTL | 175MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFF/DIVIDER/MUX 32VFQFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione7.328 |
|
1 | 1:8 | Yes/Yes | LVDS, LVPECL | LVDS, LVPECL | 1.5GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-VFQFN (5x5) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:12 250MHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione9.624 |
|
1 | 1:12 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 250MHz | 1.6 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:6 3GHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione4.928 |
|
1 | 2:6 | Yes/Yes | LVCMOS, LVPECL | LVPECL | 3GHz | 2.375 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 266MHZ 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione4.608 |
|
1 | 2:4 | No/Yes | LVCMOS, LVTTL, Crystal | LVCMOS, LVPECL | 266MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 1GHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione7.520 |
|
1 | 2:4 | No/Yes | LVCMOS, LVTTL | LVPECL | 1GHz | 3.135 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 650MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione7.344 |
|
1 | 2:4 | No/Yes | LVCMOS, LVTTL | LVDS | 650MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:12 150MHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione6.016 |
|
1 | 2:12 | Yes/No | HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, LVTTL, SSTL | LVCMOS | 150MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 266MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione6.048 |
|
1 | 2:4 | No/Yes | LVCMOS, LVTTL | LVHSTL | 266MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:16 700MHZ 48TQFP
|
pacchetto: 48-LQFP |
Azione2.688 |
|
1 | 1:16 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVDS | 700MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 150MHZ 32TQFP
|
pacchetto: 32-TQFP |
Azione7.040 |
|
1 | 1:10 | No/No | HSTL | HSTL | 150MHz | 1.38 V ~ 1.62 V | 0°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |