Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 2GHZ 40QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione6.512 |
|
2 | 1:2 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 2GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 2GHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione5.040 |
|
2 | 1:2 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 2GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 2GHZ 16VFQFPN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione4.512 |
|
1 | 2:4 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 2GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 2GHZ 16VFQFPN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione4.368 |
|
1 | 2:4 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 2GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione6.304 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 4.75 V ~ 5.25 V | 0°C ~ 70°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTPX 8:1 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione7.312 |
|
1 | 8:1 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 250MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTPX 6:1 250MHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione3.040 |
|
1 | 6:1 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 250MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTPX 2:4 250MHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione25.800 |
|
1 | 2:4 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 250MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC Z-BUFFER 85 OHM ZOUT 48MLF
|
pacchetto: - |
Azione4.880 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 200MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.000 |
|
1 | 1:2 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 200MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 2:4 266MHZ 20VFQFPN
|
pacchetto: 20-VFQFN Exposed Pad |
Azione60.000 |
|
1 | 2:4 | No/Yes | LVCMOS, LVTTL | LVPECL | 266MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 20-VFQFN Exposed Pad | 20-VFQFPN (4x4) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 2GHZ 16VFQFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione7.408 |
|
1 | 2:4 | Yes/Yes | LVDS, LVPECL | LVDS | 2GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 2GHZ 16VFQFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione4.608 |
|
1 | 2:4 | Yes/Yes | LVDS, LVPECL | LVDS | 2GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 2GHZ 16VFQFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione4.528 |
|
1 | 2:4 | Yes/Yes | LVDS, LVPECL | LVDS | 2GHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:2 2GHZ 24VFQFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione4.528 |
|
1 | 2:2 | Yes/Yes | CML, LVDS, LVHSTL, LVPECL | LVDS | 2GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-VFQFN (4x4) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 350MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione21.912 |
|
1 | 1:2 | Yes/No | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVCMOS, LVTTL | 350MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:10 2.5GHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione2.384 |
|
1 | 2:10 | Yes/Yes | LVDS, LVPECL, SSTL | ECL, PECL | 2.5GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-VFQFN (5x5) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:8 200MHZ 28QSOP
|
pacchetto: 28-SSOP (0.154", 3.90mm Width) |
Azione30.000 |
|
2 | 1:8 | No/No | LVCMOS | LVCMOS | 200MHz | 3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 28-SSOP (0.154", 3.90mm Width) | 28-QSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 100MHZ 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione4.224 |
|
1 | 1:10 | No/No | TTL | TTL | 100MHz | 4.75 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 250MHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione5.248 |
|
1 | 1:4 | No/Yes | LVCMOS, LVTTL | LVDS | 250MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 1:10 200MHZ 24TSSOP
|
pacchetto: 24-TSSOP (0.173", 4.40mm Width) |
Azione4.848 |
|
1 | 1:10 | No/No | LVTTL | LVTTL | 200MHz | 2.3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:5 133MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.160 |
|
1 | 1:5 | No/No | Clock | Clock | 133MHz | 2.3 V ~ 2.7 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 350MHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione3.840 |
|
1 | 2:4 | Yes/No | HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, LVTTL, SSTL | LVCMOS, LVTTL | 350MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 140MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.104 |
|
1 | 1:4 | No/No | Clock | Clock | 140MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 166MHZ 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione10.188 |
|
1 | 1:10 | No/No | LVTTL | CMOS, TTL | 166MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione4.416 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 4.75 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione7.888 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 4.75 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:5 166MHZ 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione2.112 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | 166MHz | 2.3 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |