Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
TE Connectivity AMP Connectors |
CONN SOCKET PGA ZIF 370POS GOLD
|
pacchetto: - |
Azione5.202 |
|
370 (19 x 19) | 0.100" (2.54mm) | Gold | Flash | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Copper Alloy | Liquid Crystal Polymer (LCP) | - |
||
Amphenol FCI |
CONN SOCKET SIP 16POS TIN
|
pacchetto: - |
Azione7.290 |
|
16 (1 x 16) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - |
||
Amphenol FCI |
CONN SOCKET SIP 22POS TIN
|
pacchetto: - |
Azione2.718 |
|
22 (1 x 22) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - |
||
3M |
CONN IC DIP SOCKET 8POS TIN
|
pacchetto: - |
Azione4.140 |
|
8 (2 x 4) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Polyester, Glass Filled | -65°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN SOCKET SIP 4POS TIN
|
pacchetto: - |
Azione6.984 |
|
4 (1 x 4) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 105°C |
||
Assmann WSW Components |
CONN IC DIP SOCKET 24POS GOLD
|
pacchetto: - |
Azione3.436 |
|
24 (2 x 12) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | -40°C ~ 105°C |
||
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
pacchetto: - |
Azione3.490 |
|
- | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 125°C |
||
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
pacchetto: - |
Azione8.514 |
|
- | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 125°C |
||
Aries Electronics |
CONN SOCKET PGA GOLD
|
pacchetto: - |
Azione5.814 |
|
- | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
||
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 24POS GOLD
|
pacchetto: - |
Azione8.730 |
|
24 (2 x 12) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass Alloy | Thermoplastic | - |
||
Aries Electronics |
CONN IC DIP SOCKET 18POS GOLD
|
pacchetto: - |
Azione8.100 |
|
18 (2 x 9) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Aries Electronics |
CONN SOCKET SIP 26POS GOLD
|
pacchetto: - |
Azione3.528 |
|
26 (1 x 26) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 | -55°C ~ 105°C |
||
Preci-Dip |
CONN SOCKET PGA 100POS GOLD
|
pacchetto: - |
Azione4.806 |
|
100 (13 x 13) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
SOCKET ASSY
|
pacchetto: - |
Azione5.598 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Aries Electronics |
CONN IC DIP SOCKET 24POS GOLD
|
pacchetto: - |
Azione6.768 |
|
24 (2 x 12) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
||
Preci-Dip |
CONN SOCKET PGA 128POS GOLD
|
pacchetto: - |
Azione5.940 |
|
128 (13 x 13) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Preci-Dip |
CONN IC DIP SOCKET 52POS GOLD
|
pacchetto: - |
Azione6.768 |
|
52 (2 x 26) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Preci-Dip |
CONN SOCKET PGA 101POS GOLD
|
pacchetto: - |
Azione4.788 |
|
101 (13 x 13) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Aries Electronics |
CONN IC DIP SOCKET 14POS TIN
|
pacchetto: - |
Azione6.408 |
|
14 (2 x 7) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Preci-Dip |
CONN IC DIP SOCKET 42POS GOLD
|
pacchetto: - |
Azione2.898 |
|
42 (2 x 21) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Aries Electronics |
CONN SOCKET SIP 14POS GOLD
|
pacchetto: - |
Azione4.752 |
|
14 (1 x 14) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
||
Preci-Dip |
CONN IC DIP SOCKET 22POS GOLD
|
pacchetto: - |
Azione4.518 |
|
22 (2 x 11) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Preci-Dip |
CONN IC DIP SOCKET 20POS GOLD
|
pacchetto: - |
Azione7.812 |
|
20 (2 x 10) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Samtec Inc. |
DIP SOCKETS
|
pacchetto: - |
Azione6.552 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
TE Connectivity AMP Connectors |
SIP IC SKT 16 SSR SN/AU FLH ROHS
|
pacchetto: - |
Azione3.472 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
CNC Tech |
CONN IC DIP SOCKET 48POS TIN
|
pacchetto: - |
Azione7.200 |
|
48 (2 x 24) | 0.100" (2.54mm) | Tin | 60µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 60µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
||
Preci-Dip |
CONN SOCKET PLCC 20POS TIN
|
pacchetto: - |
Azione6.822 |
|
20 (4 x 5) | 0.050" (1.27mm) | Tin | - | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
Amphenol FCI |
CONN SOCKET PLCC 44POS TIN
|
pacchetto: - |
Azione36.744 |
|
44 (4 x 11) | 0.050" (1.27mm) | Tin | 150µin (3.81µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 150µin (3.81µm) | Phosphor Bronze | Polyphenylene Sulfide (PPS) | -55°C ~ 125°C |