Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Amphenol FCI |
CONN SOCKET SIP 10POS GOLD
|
pacchetto: - |
Azione8.856 |
|
10 (1 x 10) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
Preci-Dip |
PGA SOLDER TAIL 1.27MM
|
pacchetto: - |
Azione8.946 |
|
456 (26 x 26) | 0.050" (1.27mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
||
Aries Electronics |
CONN SOCKET SIP 30POS TIN
|
pacchetto: - |
Azione5.418 |
|
30 (1 x 30) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 32POS GLD
|
pacchetto: - |
Azione5.508 |
|
32 (2 x 16) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
Aries Electronics |
CONN SOCKET SIP 27POS TIN
|
pacchetto: - |
Azione7.488 |
|
27 (1 x 27) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 24POS GOLD
|
pacchetto: - |
Azione3.618 |
|
24 (2 x 12) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
||
Aries Electronics |
CONN IC DIP SOCKET 32POS GOLD
|
pacchetto: - |
Azione4.824 |
|
32 (2 x 16) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Preci-Dip |
CONN SOCKET PGA 176POS GOLD
|
pacchetto: - |
Azione4.374 |
|
176 (16 x 16) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 32POS GLD
|
pacchetto: - |
Azione8.118 |
|
32 (2 x 16) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET 20POS GOLD
|
pacchetto: - |
Azione2.538 |
|
20 (2 x 10) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Aries Electronics |
CONN SOCKET SIP 20POS TIN
|
pacchetto: - |
Azione2.538 |
|
20 (1 x 20) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Aries Electronics |
CONN IC DIP SOCKET 26POS GOLD
|
pacchetto: - |
Azione6.804 |
|
26 (2 x 13) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET 8POS GOLD
|
pacchetto: - |
Azione5.580 |
|
8 (2 x 4) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Preci-Dip |
CONN SOCKET PGA 68POS GOLD
|
pacchetto: - |
Azione8.424 |
|
68 (11 x 11) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Preci-Dip |
CONN IC DIP SOCKET 40POS GOLD
|
pacchetto: - |
Azione5.742 |
|
40 (2 x 20) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Preci-Dip |
CONN IC DIP SOCKET 40POS GOLD
|
pacchetto: - |
Azione7.704 |
|
40 (2 x 20) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Aries Electronics |
CONN IC DIP SOCKET 8POS GOLD
|
pacchetto: - |
Azione6.156 |
|
8 (2 x 4) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 | -55°C ~ 105°C |
||
Preci-Dip |
CONN IC DIP SOCKET 12POS GOLD
|
pacchetto: - |
Azione5.994 |
|
12 (2 x 6) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Preci-Dip |
CONN SOCKET PGA 68POS GOLD
|
pacchetto: - |
Azione4.536 |
|
68 (11 x 11) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Samtec Inc. |
CONN IC DIP SOCKET 18POS GOLD
|
pacchetto: - |
Azione6.318 |
|
18 (2 x 9) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass | Polyester, Glass Filled | -55°C ~ 125°C |
||
Preci-Dip |
CONN IC DIP SOCKET 24POS GOLD
|
pacchetto: - |
Azione8.532 |
|
24 (2 x 12) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Aries Electronics |
CONN SOCKET SIP 4POS GOLD
|
pacchetto: - |
Azione6.192 |
|
4 (1 x 4) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
||
Preci-Dip |
CONN IC DIP SOCKET 10POS GOLD
|
pacchetto: - |
Azione7.578 |
|
10 (2 x 5) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Preci-Dip |
CONN IC DIP SOCKET 24POS GOLD
|
pacchetto: - |
Azione2.000 |
|
24 (2 x 12) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 48POS GOLD
|
pacchetto: - |
Azione6.336 |
|
48 (2 x 24) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
||
Mill-Max Manufacturing Corp. |
CONN SOCKET PLCC 28POS TIN
|
pacchetto: - |
Azione12.804 |
|
28 (4 x 7) | 0.050" (1.27mm) | Tin | 150µin (3.81µm) | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 200µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
||
3M |
CONN IC DIP SOCKET ZIF 40POS GLD
|
pacchetto: - |
Azione6.324 |
|
40 (2 x 20) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
||
Aries Electronics |
CONN SOCKET SIP 20POS TIN
|
pacchetto: - |
Azione32.364 |
|
20 (1 x 20) | 0.100" (2.54mm) | Tin | 50µin (1.27µm) | Phosphor Bronze | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 50µin (1.27µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |