Pagina 29 - Zoccoli per C.I., transistor | Connettori, interconnessioni | Heisener Electronics
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Zoccoli per C.I., transistor

Record 11.083
Pagina  29/396
Immagine
Numero di parte
Produttore
Descrizione
pacchetto
Azione
Quantità
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
100-018-050
3M

CONN IC DIP SOCKET 18POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 18 (2 x 9)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 8µin (0.20µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: Flash
  • Contact Material - Post: Brass
  • Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
  • Operating Temperature: -65°C ~ 125°C
pacchetto: -
Azione8.280
18 (2 x 9)
0.100" (2.54mm)
Gold
8µin (0.20µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
Flash
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-65°C ~ 125°C
A-CCS20-Z
Assmann WSW Components

CONN SOCKET PLCC 20POS TIN

  • Type: PLCC
  • Number of Positions or Pins (Grid): 20 (4 x 5)
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: 150µin (3.81µm)
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 150µin (3.81µm)
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
  • Operating Temperature: -55°C ~ 105°C
pacchetto: -
Azione8.604
20 (4 x 5)
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
546-83-545-17-000147
Preci-Dip

CONN SOCKET PGA 545POS GOLD

  • Type: PGA
  • Number of Positions or Pins (Grid): 545 (17 x 17)
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 29.5µin (0.75µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Press-Fit
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Bronze
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
pacchetto: -
Azione8.658
545 (17 x 17)
0.050" (1.27mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Open Frame
Press-Fit
0.100" (2.54mm)
Tin
-
Bronze
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
48-3574-16
Aries Electronics

CONN IC DIP SOCKET ZIF 48POS TIN

  • Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 48 (2 x 24)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: 200µin (5.08µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
  • Operating Temperature: -
pacchetto: -
Azione8.136
48 (2 x 24)
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
-
1939416-2
TE Connectivity AMP Connectors

CONN SOCKET LGA 1207POS GOLD

  • Type: LGA
  • Number of Positions or Pins (Grid): 1207 (33 x 34)
  • Pitch - Mating: 0.043" (1.09mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Surface Mount
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.043" (1.09mm)
  • Contact Finish - Post: -
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: -
  • Housing Material: Thermoplastic
  • Operating Temperature: -55°C ~ 110°C
pacchetto: -
Azione7.074
1207 (33 x 34)
0.043" (1.09mm)
Gold
-
Beryllium Copper
Surface Mount
Closed Frame
Solder
0.043" (1.09mm)
-
-
-
Thermoplastic
-55°C ~ 110°C
48-3572-11
Aries Electronics

CONN IC DIP SOCKET ZIF 48POS GLD

  • Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 48 (2 x 24)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 10µin (0.25µm)
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
  • Operating Temperature: -
pacchetto: -
Azione8.280
48 (2 x 24)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
-
36-3574-11
Aries Electronics

CONN IC DIP SOCKET ZIF 36POS TIN

  • Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 36 (2 x 18)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: 200µin (5.08µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
  • Operating Temperature: -
pacchetto: -
Azione3.798
36 (2 x 18)
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
-
1981837-2
TE Connectivity AMP Connectors

CONN SOCKET LGA 1366POS GOLD

  • Type: LGA
  • Number of Positions or Pins (Grid): 1366 (32 x 41)
  • Pitch - Mating: 0.040" (1.01mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Surface Mount
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.040" (1.01mm)
  • Contact Finish - Post: -
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Copper Alloy
  • Housing Material: Thermoplastic
  • Operating Temperature: -
pacchetto: -
Azione8.910
1366 (32 x 41)
0.040" (1.01mm)
Gold
30µin (0.76µm)
Copper Alloy
Surface Mount
Open Frame
Solder
0.040" (1.01mm)
-
-
Copper Alloy
Thermoplastic
-
28-8750-610C
Aries Electronics

CONN IC DIP SOCKET 28POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 28 (2 x 14)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame, Elevated
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 10µin (0.25µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -55°C ~ 105°C
pacchetto: -
Azione3.762
28 (2 x 14)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame, Elevated
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
36-3571-10
Aries Electronics

CONN IC DIP SOCKET ZIF 36POS TIN

  • Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 36 (2 x 18)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: 200µin (5.08µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
  • Operating Temperature: -
pacchetto: -
Azione3.690
36 (2 x 18)
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
-
116-93-308-41-008000
Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 8POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 8 (2 x 4)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Elevated, Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Brass Alloy
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
  • Operating Temperature: -55°C ~ 125°C
pacchetto: -
Azione7.164
8 (2 x 4)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
50-9513-11
Aries Electronics

CONN IC DIP SOCKET 50POS GOLD

  • Type: DIP, 0.9" (22.86mm) Row Spacing
  • Number of Positions or Pins (Grid): 50 (2 x 25)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 10µin (0.25µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -
pacchetto: -
Azione3.906
50 (2 x 25)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
614-93-306-31-007000
Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 6POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 6 (2 x 3)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Brass Alloy
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
  • Operating Temperature: -55°C ~ 125°C
pacchetto: -
Azione7.830
6 (2 x 3)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
510-83-144-15-001101
Preci-Dip

CONN SOCKET PGA 144POS GOLD

  • Type: PGA
  • Number of Positions or Pins (Grid): 144 (15 x 15)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 29.5µin (0.75µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
pacchetto: -
Azione5.400
144 (15 x 15)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
116-87-650-41-004101
Preci-Dip

CONN IC DIP SOCKET 50POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 50 (2 x 25)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: Flash
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Elevated, Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
pacchetto: -
Azione2.844
50 (2 x 25)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
40-6518-11
Aries Electronics

CONN IC DIP SOCKET 40POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 40 (2 x 20)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 10µin (0.25µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -
pacchetto: -
Azione4.374
40 (2 x 20)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
114-93-628-41-117000
Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 28POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 28 (2 x 14)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Surface Mount
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Brass Alloy
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
  • Operating Temperature: -55°C ~ 125°C
pacchetto: -
Azione3.508
28 (2 x 14)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
116-87-650-41-018101
Preci-Dip

CONN IC DIP SOCKET 50POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 50 (2 x 25)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: Flash
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Elevated, Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
pacchetto: -
Azione5.418
50 (2 x 25)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
146-83-328-41-036101
Preci-Dip

CONN IC DIP SOCKET 28POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 28 (2 x 14)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 29.5µin (0.75µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Press-Fit
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
pacchetto: -
Azione2.826
28 (2 x 14)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Open Frame
Press-Fit
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
04-1508-21
Aries Electronics

CONN IC DIP SOCKET 4POS GOLD

  • Type: DIP, 0.2" (5.08mm) Row Spacing
  • Number of Positions or Pins (Grid): 4 (2 x 2)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Wire Wrap
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 10µin (0.25µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA46), Nylon 4/6
  • Operating Temperature: -55°C ~ 125°C
pacchetto: -
Azione7.452
4 (2 x 2)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Wire Wrap
0.100" (2.54mm)
Gold
10µin (0.25µm)
Brass
Polyamide (PA46), Nylon 4/6
-55°C ~ 125°C
APA-318-T-K
Samtec Inc.

ADAPTOR PLUG

  • Type: -
  • Number of Positions or Pins (Grid): -
  • Pitch - Mating: -
  • Contact Finish - Mating: -
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: -
  • Mounting Type: -
  • Features: -
  • Termination: -
  • Pitch - Post: -
  • Contact Finish - Post: -
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: -
  • Housing Material: -
  • Operating Temperature: -
pacchetto: -
Azione6.786
-
-
-
-
-
-
-
-
-
-
-
-
-
-
116-87-432-41-012101
Preci-Dip

CONN IC DIP SOCKET 32POS GOLD

  • Type: DIP, 0.4" (10.16mm) Row Spacing
  • Number of Positions or Pins (Grid): 32 (2 x 16)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: Flash
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Elevated, Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
pacchetto: -
Azione7.344
32 (2 x 16)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
05-0508-20
Aries Electronics

CONN SOCKET SIP 5POS GOLD

  • Type: SIP
  • Number of Positions or Pins (Grid): 5 (1 x 5)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: -
  • Termination: Wire Wrap
  • Pitch - Post: -
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA46), Nylon 4/6
  • Operating Temperature: -55°C ~ 105°C
pacchetto: -
Azione5.184
5 (1 x 5)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
-
Wire Wrap
-
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6
-55°C ~ 105°C
540-88-084-17-400-2
Preci-Dip

CONN SOCKET PLCC 84POS TIN

  • Type: PLCC
  • Number of Positions or Pins (Grid): 84 (4 x 21)
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Surface Mount
  • Features: Board Guide, Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
  • Operating Temperature: -
pacchetto: -
Azione2.358
84 (4 x 21)
0.050" (1.27mm)
Tin
-
Phosphor Bronze
Surface Mount
Board Guide, Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Polyphenylene Sulfide (PPS), Glass Filled
-
PLCC-044-T-N
Samtec Inc.

CONN SOCKET PLCC 44POS TIN

  • Type: PLCC
  • Number of Positions or Pins (Grid): 44 (4 x 11)
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Surface Mount
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Liquid Crystal Polymer (LCP)
  • Operating Temperature: -55°C ~ 125°C
pacchetto: -
Azione6.012
44 (4 x 11)
0.050" (1.27mm)
Tin
-
Beryllium Copper
Surface Mount
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Beryllium Copper
Liquid Crystal Polymer (LCP)
-55°C ~ 125°C
115-47-422-41-003000
Mill-Max Manufacturing Corp.

STANDRD SOLDER TAIL DIP SOCKET

  • Type: DIP, 0.4" (10.16mm) Row Spacing
  • Number of Positions or Pins (Grid): 22 (2 x 11)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: Flash
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Brass Alloy
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
  • Operating Temperature: -55°C ~ 125°C
pacchetto: -
Azione8.856
22 (2 x 11)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
614-87-628-31-012101
Preci-Dip

CONN IC DIP SOCKET 28POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 28 (2 x 14)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: Flash
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
pacchetto: -
Azione7.944
28 (2 x 14)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
117-93-656-41-005000
Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 56POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 56 (2 x 28)
  • Pitch - Mating: 0.070" (1.78mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.070" (1.78mm)
  • Contact Finish - Post: Tin-Lead
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Brass Alloy
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
  • Operating Temperature: -55°C ~ 125°C
pacchetto: -
Azione7.344
56 (2 x 28)
0.070" (1.78mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.070" (1.78mm)
Tin-Lead
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C