Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Convert To (Adapter End) | Number of Pins | Pitch - Mating | Contact Finish - Mating | Mounting Type | Termination | Pitch - Post | Contact Finish - Post | Housing Material | Board Material |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics |
SOCKET ADAPTER QFP TO 144PGA
|
pacchetto: - |
Azione7.902 |
|
PGA | 144 | 0.026" (0.65mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | - | FR4 Epoxy Glass |
||
Aries Electronics |
SOCKET ADAPTER PLCC TO 68DIP 0.6
|
pacchetto: - |
Azione8.280 |
|
DIP, 0.6" (15.24mm) Row Spacing | 68 | 0.050" (1.27mm) | - | Through Hole | Solder | 0.100" (2.54mm) | Tin-Lead | - | FR4 Epoxy Glass |
||
3M |
RECEPTACLE DIP SOCKET 90POS .9"
|
pacchetto: - |
Azione2.340 |
|
- | - | - | - | - | - | - | - | - | - |
||
Aries Electronics |
SOCKET ADAPTER PLCC TO 28DIP 0.6
|
pacchetto: - |
Azione5.706 |
|
DIP, 0.6" (15.24mm) Row Spacing | 28 | - | - | Through Hole | Solder | 0.070" (1.78mm) | Tin-Lead | - | FR4 Epoxy Glass |
||
Aries Electronics |
SOCKET ADAPTER PLCC TO 28DIP 0.3
|
pacchetto: - |
Azione6.300 |
|
DIP, 0.3" (7.62mm) Row Spacing | 28 | 0.050" (1.27mm) | Tin-Lead | Through Hole | Solder | 0.100" (2.54mm) | Tin-Lead | - | FR4 Epoxy Glass |
||
Aries Electronics |
SOCKET ADAPTER DIP TO 28SOIC
|
pacchetto: - |
Azione6.372 |
|
SOIC | 28 | - | Gold | Surface Mount | Solder | 0.100" (2.54mm) | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
||
Logical Systems Inc. |
ADAPTER 40SOIC TO 40DIP
|
pacchetto: - |
Azione8.640 |
|
- | - | - | - | - | - | - | - | - | - |
||
3M |
RECEPTACLE DIP SOCKET 48POS .6"
|
pacchetto: - |
Azione5.760 |
|
- | - | - | - | - | - | - | - | - | - |
||
3M |
SOCKET ADAPTER 22DIP TO 22DIP
|
pacchetto: - |
Azione3.312 |
|
DIP, 0.4" (10.16mm) Row Spacing | 22 | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | Polysulfone (PSU), Glass Filled | - |
||
Aries Electronics |
SOCKET ADAPTER SOIC TO 28DIP 0.3
|
pacchetto: - |
Azione4.518 |
|
DIP, 0.3" (7.62mm) Row Spacing | 28 | 0.050" (1.27mm) | - | Through Hole | Solder | 0.100" (2.54mm) | Gold | - | FR4 Epoxy Glass |
||
Aries Electronics |
SOCKET ADAPTER SSOP TO 24DIP 0.3
|
pacchetto: - |
Azione3.258 |
|
DIP, 0.3" (7.62mm) Row Spacing | 24 | 0.026" (0.65mm) | - | Through Hole | Solder | 0.100" (2.54mm) | Tin-Lead | - | FR4 Epoxy Glass |
||
Aries Electronics |
SOCKET ADAPT SOIC-W TO 28DIP 0.3
|
pacchetto: - |
Azione3.708 |
|
DIP, 0.3" (7.62mm) Row Spacing | 28 | - | - | Through Hole | Solder | 0.050" (1.27mm) | Gold | - | FR4 Epoxy Glass |
||
Aries Electronics |
SCK ADAPT 12P SOIC-W TO SOIC 0.6
|
pacchetto: - |
Azione2.016 |
|
SOIC | 12 | 0.050" (1.27mm) | - | Surface Mount | Solder | 0.050" (1.27mm) | Tin-Lead | - | FR4 Epoxy Glass |
||
Aries Electronics |
SOCKET ADAPT SOIC-W TO 20DIP 0.3
|
pacchetto: - |
Azione8.784 |
|
DIP, 0.3" (7.62mm) Row Spacing | 20 | 0.050" (1.27mm) | - | Through Hole | Solder | 0.100" (2.54mm) | Tin-Lead | - | FR4 Epoxy Glass |
||
Aries Electronics |
SOCKET ADAPTER SOIC TO TO-8
|
pacchetto: - |
Azione5.922 |
|
JEDEC | 8 | 0.050" (1.27mm) | - | Through Hole | Solder | - | Tin-Lead | - | FR4 Epoxy Glass |
||
Aries Electronics |
SOCKET ADAPTER PLCC TO 16DIP 0.3
|
pacchetto: - |
Azione5.598 |
|
DIP, 0.3" (7.62mm) Row Spacing | 16 | 0.050" (1.27mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | - | FR4 Epoxy Glass |
||
Aries Electronics |
SOCKET ADAPTER MULT PKG TO 60QFP
|
pacchetto: - |
Azione2.934 |
|
QFP | 60 | 0.020" (0.50mm) | - | Through Hole | Solder | 0.100" (2.54mm) | Gold | Polyester | FR4 Epoxy Glass |
||
Aries Electronics |
SOCKET ADAPTER DIP TO 16DIP 0.3
|
pacchetto: - |
Azione7.218 |
|
DIP, 0.3" (7.62mm) Row Spacing | 16 | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
||
Aries Electronics |
SOCKET ADAPTER SOIC TO 14DIP 0.3
|
pacchetto: - |
Azione3.834 |
|
DIP, 0.3" (7.62mm) Row Spacing | 14 | 0.050" (1.27mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin-Lead | - | Polyimide (PI) |
||
Aries Electronics |
SOCKET ADAPTER SOJ TO 32DIP 0.4
|
pacchetto: - |
Azione4.662 |
|
DIP, 0.4" (10.16mm) Row Spacing | 32 | 0.050" (1.27mm) | - | Through Hole | Solder | 0.100" (2.54mm) | - | - | FR4 Epoxy Glass |
||
3M |
RECEPTACLE DIP SOCKET 14POS .3"
|
pacchetto: - |
Azione5.382 |
|
- | - | - | - | - | - | - | - | - | - |
||
Aries Electronics |
SOCKET ADAPTER SSOP TO 14DIP 0.3
|
pacchetto: - |
Azione6.534 |
|
DIP, 0.3" (7.62mm) Row Spacing | 14 | 0.026" (0.65mm) | - | Through Hole | Solder | 0.100" (2.54mm) | Tin-Lead | - | FR4 Epoxy Glass |
||
3M |
RECEPTACLE DIP SOCKET 40POS .6"
|
pacchetto: - |
Azione5.472 |
|
- | - | - | - | - | - | - | - | - | - |
||
Aries Electronics |
SOCKET ADAPTER SOIC TO 28DIP 0.3
|
pacchetto: - |
Azione9.156 |
|
DIP, 0.3" (7.62mm) Row Spacing | 28 | 0.050" (1.27mm) | - | Through Hole | Solder | 0.100" (2.54mm) | Tin-Lead | - | FR4 Epoxy Glass |
||
Aries Electronics |
SOCKET ADAPTER DIP TO TO-8
|
pacchetto: - |
Azione6.132 |
|
JEDEC | 8 | 0.100" (2.54mm) | Gold | Through Hole | Solder | - | Tin-Lead | Polyamide (PA46), Nylon 4/6, Glass Filled | FR4 Epoxy Glass |
||
Aries Electronics |
SOCKET ADAPTER SOIC TO 28DIP 0.6
|
pacchetto: - |
Azione6.396 |
|
DIP, 0.6" (15.24mm) Row Spacing | 28 | 0.050" (1.27mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | - | FR4 Epoxy Glass |
||
Aries Electronics |
SOCKET ADAPTER PLCC TO 68PGA
|
pacchetto: - |
Azione7.716 |
|
PGA | 68 | 0.050" (1.27mm) | - | Through Hole | Solder | 0.050" (1.27mm) | Tin-Lead | - | FR4 Epoxy Glass |
||
Logical Systems Inc. |
SOCKET ADAPTER SOIC TO 16DIP
|
pacchetto: - |
Azione15.780 |
|
DIP | 16 | 0.050" (1.27mm) | - | Through Hole | Solder | 0.100" (2.54mm) | - | - | - |