Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Plating | Plating - Thickness | Mounting Type |
|---|---|---|---|---|---|---|---|---|---|
|
TE Connectivity AMP Connectors |
DUAL FLOATING PIN ASSY TI
|
pacchetto: - |
Azione3.564 |
|
Gold | - | - |
|
|
Omron Electronics Inc-EMC Div |
CONTACT PROBE .4MM PITCH
|
pacchetto: - |
Azione4.644 |
|
Gold | 40µin (1.02µm) | Through Hole |
|
|
|
Omron Electronics Inc-EMC Div |
CONTACT PROBE 0.5MM PITCH
|
pacchetto: - |
Azione2.340 |
|
Gold | 40µin (1.02µm) | Through Hole |
|
|
|
Omron Electronics Inc-EMC Div |
CONTACT PROBE 1.0MM PITCH
|
pacchetto: - |
Azione7.056 |
|
Gold | 40µin (1.02µm) | Through Hole |
|
|
|
Omron Electronics Inc-EMC Div |
CONTACT PROBE 0.6MM PITCH
|
pacchetto: - |
Azione3.834 |
|
Gold | 40µin (1.02µm) | Through Hole |
|
|
|
Omron Electronics Inc-EMC Div |
CONTACT PROBE 0.5MM PITCH
|
pacchetto: - |
Azione2.646 |
|
Gold | 40µin (1.02µm) | Through Hole |
|
|
TE Connectivity AMP Connectors |
SPRING PROBE CONTACT SMD
|
pacchetto: - |
Azione3.690 |
|
Gold | - | Surface Mount |
|
|
SparkFun Electronics |
POGO PIN W/ CHISELED TIP
|
pacchetto: - |
Azione5.958 |
|
Gold | - | Through Hole |
|
|
Harwin Inc. |
SMT PCB PAD SQ 3.8X1.8X0.1MM
|
pacchetto: - |
Azione6.408 |
|
Gold | Flash | Surface Mount |
|
|
Mill-Max Manufacturing Corp. |
CONN PIN SPRING-LOADED PCB GOLD
|
pacchetto: - |
Azione3.544 |
|
Gold | 20µin (0.51µm) | Through Hole |
|
|
Harwin Inc. |
PROBE CONCAVE
|
pacchetto: - |
Azione6.600 |
|
Gold | Flash | Through Hole |
|
|
Mill-Max Manufacturing Corp. |
DISCRETE INSULATED SPRING PINS
|
pacchetto: - |
Azione20.988 |
|
Gold | 20µin (0.51µm) | Through Hole |
|
|
Omron Electronics Inc-EMC Div |
CONTACT PROBE PIN .5MM PITCH
|
pacchetto: - |
Azione6.468 |
|
Gold | - | Through Hole |
|
|
|
Omron Electronics Inc-EMC Div |
CONTACT PROBE PIN .5MM PITCH
|
pacchetto: - |
Azione8.802 |
|
Gold | - | Through Hole |
|
|
Mill-Max Manufacturing Corp. |
SMT INSULATED SPRING PIN .197"
|
pacchetto: - |
Azione7.452 |
|
Gold | 20µin (0.51µm) | Surface Mount |
|
|
Mill-Max Manufacturing Corp. |
SPRING PIN
|
pacchetto: - |
Azione18.252 |
|
Gold | 20µin (0.51µm) | Through Hole |
|
|
Preci-Dip |
SPRING LOAD CONT SLD CUP
|
pacchetto: - |
Azione35.898 |
|
Gold | - | Through Hole, Solder Cup |
|
|
Preci-Dip |
SPRING LOAD CONT SLD TAIL
|
pacchetto: - |
Azione38.556 |
|
Gold | - | Through Hole |
|
|
Preci-Dip |
SPRING LOAD CONT SLD TAIL
|
pacchetto: - |
Azione25.920 |
|
Gold | - | Through Hole |
|
|
Harwin Inc. |
CONN PIN SPRING LOAD SMT AU
|
pacchetto: - |
Azione31.830 |
|
Gold | 16µin (0.40µm) | Surface Mount |
|
|
Harwin Inc. |
CONN PIN SPRING LOAD PCB AU
|
pacchetto: - |
Azione20.652 |
|
Gold | 16µin (0.40µm) | Through Hole |
|
|
Mill-Max Manufacturing Corp. |
CONN PIN PCB .332"
|
pacchetto: - |
Azione23.688 |
|
Gold | 20µin (0.51µm) | Through Hole |
|
|
Preci-Dip |
SPRING LOAD CONT SLD CUP
|
pacchetto: - |
Azione27.828 |
|
Gold | - | Through Hole, Solder Cup |
|
|
Mill-Max Manufacturing Corp. |
LARGE DIAMETER SOLDER SPRING PIN
|
pacchetto: - |
Azione96.462 |
|
Gold | 20µin (0.51µm) | Through Hole |
|
|
Mill-Max Manufacturing Corp. |
CONN PWR SPRING PIN THRU HOLE
|
pacchetto: - |
Azione287.040 |
|
Gold | 20µin (0.51µm) | Through Hole |
|
|
Mill-Max Manufacturing Corp. |
CONN PIN SPRING-LOAD .430" GOLD
|
pacchetto: - |
Azione75.264 |
|
Gold | 20µin (0.51µm) | Through Hole |
|
|
Mill-Max Manufacturing Corp. |
CONN PIN SPRING LOAD .197 AU SMD
|
pacchetto: - |
Azione339.438 |
|
Gold | 20µin (0.51µm) | Surface Mount |
|
|
|
Mill-Max Manufacturing Corp. |
CONN PIN SPRING LOAD .177 AU SMD
|
pacchetto: - |
Azione140.496 |
|
Gold | 20µin (0.51µm) | Surface Mount |
